公开(公告)号：US07544542B2

公开(公告)日：2009-06-09

申请号：US11462993

申请日：2006-08-07

申请人： Seah Sun Too ,  Raj N. Master ,  Jacquana Diep ,  Mohammad Khan

发明人： Seah Sun Too ,  Raj N. Master ,  Jacquana Diep ,  Mohammad Khan

IPC分类号： H01L21/44

CPC分类号： H01L23/10 ,  H01L24/32 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15312 ,  H01L2924/16152 ,  H01L2924/166 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3511 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/0401

摘要： Various method and apparatus for packaging an integrated circuit are provided. In one aspect, a method of packaging an integrated circuit is provided that includes coupling an integrated circuit to a substrate, mixing an adhesive with a plurality of particles, and coupling a lid to the substrate with the adhesive. At least a portion of the plurality of particles in the adhesive oppose compressive force from the lid to restrict rotation of the lid relative to the substrate.

摘要翻译： 提供了用于封装集成电路的各种方法和装置。 一方面，提供一种封装集成电路的方法，其包括将集成电路耦合到基板，将粘合剂与多个颗粒混合，以及用盖子将盖子与粘合剂连接。 粘合剂中多个颗粒的至少一部分与来自盖的压缩力相反，以限制盖相对于基底的旋转。

公开(公告)号：US06722553B2

公开(公告)日：2004-04-20

申请号：US09922936

申请日：2001-08-07

申请人： Raj N. Master ,  Mohammad Z. Khan ,  Maria G. Guardado ,  Ooi Tong Ong

发明人： Raj N. Master ,  Mohammad Z. Khan ,  Maria G. Guardado ,  Ooi Tong Ong

IPC分类号： B23K1308

CPC分类号： H05K3/3489 ,  B23K1/203 ,  B23K2101/36 ,  H05K3/3436

摘要： A method and apparatus are provided for controllably dispensing flux on a substrate having a plurality of conductive terminals. Flux having a viscosity range between 10 centipoises and about 150 centipoises is sprayed on the substrate and the conductive terminals at a valve pressure range between about 1.5 psi and about 30 psi via a dispense nozzle of a flux dispenser. Upon a subsequent high temperature solder reflow process, the sprayed flux on the substrate is mostly removed by thermal decomposition to volatile species, thereby significantly reducing flux residue remaining on the surface of the substrate between the conductive terminals.

摘要翻译： 提供了一种方法和装置，用于在具有多个导电端子的基板上可控地分配通量。 具有10厘泊和约150厘泊之间的粘度范围的助焊剂通过焊剂分配器的分配喷嘴在约1.5psi至约30psi之间的阀压力范围内喷射到衬底和导电端子上。 在随后的高温焊料回流工艺中，基板上的喷涂焊剂主要通过热分解除去到挥发性物质，从而显着减少在导电端子之间残留在基板表面上的焊剂残余物。

公开(公告)号：US06632690B2

公开(公告)日：2003-10-14

申请号：US10062407

申请日：2002-02-05

申请人： Raj N. Master ,  Edward S. Alcid ,  Diong-Hing Ding

发明人： Raj N. Master ,  Edward S. Alcid ,  Diong-Hing Ding

IPC分类号： G01R3126

CPC分类号： H05K3/3478

摘要： A method of fabricating laminate assemblies determines the ideal weight (W) of underfill to be dispensed, based on the size of the semiconductor die and the gap between the die and the laminate substrate. Underfill is dispensed in a single step in an amount between 1.1W and 1.3W to form fillets that cover at least 15% of the height of the semiconductor die on all four sides of the die. The amount of underfill ensures that the fillet coverage imbalance is 30% or less for each of the pairs of opposing sides of the die, thereby improving solder joint reliability.

摘要翻译： 基于半导体管芯的尺寸和管芯与层叠基板之间的间隙，制造叠层组件的方法决定了要分配的底部填充物的理想重量（W）。 底部填充剂以1.1W至1.3W之间的一个步骤进行分配，以形成在模具的四面上覆盖半导体管芯高度的至少15％的圆角。 底部填充剂的数量确保了模具的每对相对侧的圆角覆盖不平衡为30％以下，从而提高焊点的可靠性。

公开(公告)号：US06617195B1

公开(公告)日：2003-09-09

申请号：US09624491

申请日：2000-07-24

申请人： Raj N. Master ,  Mohammad Z. Khan ,  Maria G. Guardado

发明人： Raj N. Master ,  Mohammad Z. Khan ,  Maria G. Guardado

IPC分类号： H01L2144

CPC分类号： H01L24/81 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H05K3/3494

摘要： A method of manufacturing a semiconductor device by attaching a flip chip die to an organic substrate using solder comprises applying no-clean flux to the flip chip die or the organic substrate; heating the flip chip die and the organic substrate to bond the flip chip die to the organic substrate, and cooling the flip chip die and the organic substrate. The step of heating the flux includes controlling oxygen and moisture content of an atmosphere surrounding the flux, preheating to a temperature of about 145° C. to about 165° C., soaking at a temperature of about 145° C. to about 165° C. for about four to about six minutes, and reflowing above the solder's melting point.

摘要翻译： 通过使用焊料将倒装芯片裸片附着到有机基板来制造半导体器件的方法包括向倒装芯片或有机基板施加免清洗助焊剂; 加热倒装晶片管芯和有机衬底以将倒装晶片管芯结合到有机衬底上，并冷却倒装晶片管芯和有机衬底。 加热焊剂的步骤包括控制焊剂周围的气氛中的氧气和水分含量，预热至约145℃至约165℃的温度，在约145℃至约165℃的温度下浸泡 C.约4至6分钟，并回流焊料熔点以上。

公开(公告)号：US06488158B1

公开(公告)日：2002-12-03

申请号：US09659826

申请日：2000-09-11

申请人： Mohammad Khan ,  Raj N. Master ,  Maria G. Guardado ,  Loo L. Teoh ,  Ahmad Juwanda

发明人： Mohammad Khan ,  Raj N. Master ,  Maria G. Guardado ,  Loo L. Teoh ,  Ahmad Juwanda

IPC分类号： A47G1908

CPC分类号： H01L21/67333 ,  H01L21/67336 ,  H01L21/6835 ,  H01L2221/68313

摘要： A boat is formed with a plurality of through-holes sized to securely maintain ceramic or organic flip chip semiconductor packages in place during assembly. Embodiments comprises a boat having a bottom layer with an array of four-sided through-holes and a top layer with an array of through-holes and tabs extending from the sides of the through-hole. Embodiments further include a boat having a bottom layer with through-holes smaller than substantially aligned overlying through-holes in the top layer, the substantially aligned through-holes forming flip chip package holding pockets. An alignment mechanism ensures that components are accurately positioned on flip chip packages held in the boat during assembly.

摘要翻译： 船形成有多个通孔，其尺寸设计成在组装期间可靠地将陶瓷或有机倒装芯片半导体封装保持在适当的位置。 实施例包括具有具有四面通孔阵列的底层和具有从通孔侧面延伸的通孔阵列的顶层的船。 实施例还包括具有底层的船，该底层具有通孔小于顶层中的基本上对准的覆盖通孔，基本对准的通孔形成倒装芯片封装保持袋。 对准机构确保组件准确地定位在组装期间保持在船中的倒装芯片封装上。

公开(公告)号：US06367679B1

公开(公告)日：2002-04-09

申请号：US09642831

申请日：2000-08-22

申请人： Raj N. Master ,  Jonathan D. Halderman

发明人： Raj N. Master ,  Jonathan D. Halderman

IPC分类号： B23K3112

CPC分类号： B23K3/029 ,  H05K3/26

摘要： Detection of flux residue remaining the formation of a device/substrate assembly is carried out by contacting the assembly with a fixed amount of solvent adapted to remove residual flux from the assembly and measuring the conductivity or resistance of the contacted solvent to determine the presence of flux residue in the solvent obtained from the assembly. Embodiments include contacting the assembly with isopropanol by immersing and withdrawing the assembly in a fixed amount of the solvent and measuring the conductivity of the contacted solvent with a volt meter.

摘要翻译： 通过使组件与固定量的溶剂接触来检测剩余的器件/衬底组件的形成，该溶剂适于从组件中除去残留的焊剂并测量接触溶剂的导电性或电阻以确定焊剂的存在 残留在从组装得到的溶剂中。 实施方案包括通过将组件浸入和取出固定量的溶剂并用电压表测量接触溶剂的电导率来使组件与异丙醇接触。

公开(公告)号：US06229207B1

公开(公告)日：2001-05-08

申请号：US09482095

申请日：2000-01-13

申请人： Raj N. Master

发明人： Raj N. Master

IPC分类号： H01L2348

CPC分类号： H01L23/49811 ,  H01L2224/16225 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/15312 ,  H05K3/3463

摘要： An organic carrier member for mounting a semiconductor device is provided that has a plurality of pin leads joined to conductive pads on the carrier member by a solder fillet having a reflow temperature higher than the temperature necessary to attach the semiconductor device. Embodiments include a bismaleimide-triazine epoxy laminate carrier member having an array of pins joined to the carrier member by a solder fillet having a reflow temperature of no greater than 275° C.

摘要翻译： 提供一种用于安装半导体器件的有机载体构件，其具有多个引脚引线，其通过具有高于附接半导体器件所需的温度的回流温度的焊接圆角而与载体构件上的导电焊盘接合。 实施方案包括双马来酰亚胺 - 三嗪环氧树脂层压载体构件，其具有通过具有不高于275℃的回流温度的焊接圆角连接到载体构件的销的阵列。

公开(公告)号：US4885038A

公开(公告)日：1989-12-05

申请号：US858488

申请日：1986-05-01

申请人： Herbert R. Anderson, Jr. ,  Renuka S. Divakaruni ,  Joseph M. Dynys ,  Steven M. Kandetzke ,  Daniel P. Kirby ,  Raj N. Master ,  Jon A. Casey

发明人： Herbert R. Anderson, Jr. ,  Renuka S. Divakaruni ,  Joseph M. Dynys ,  Steven M. Kandetzke ,  Daniel P. Kirby ,  Raj N. Master ,  Jon A. Casey

IPC分类号： H05K3/46 ,  H01L21/48 ,  H05K1/03 ,  H05K1/09 ,  H05K3/28

CPC分类号： H01L21/4867 ,  H01L21/4846 ,  H05K1/0306 ,  H05K1/092 ,  H05K3/28 ,  H05K3/4611 ,  H05K3/4629

摘要： The present invention provides a method for producing multilayered ceramic structures having copper-based conductors therein, wherein the onset of sintering of the copper-based conductor can be adjusted to approach or match that of the ceramic portion of the structure. In addition, methods are provided whereby the polymeric binder resin used in formation of the ceramic portion of the structure can be removed or burned-off, using oxygen-containing ambients, wherein the oxygen content is greater than 200 ppm, without oxidation of the copper-based conductors therein.

摘要翻译： 本发明提供了一种制造其中具有铜基导体的多层陶瓷结构的方法，其中可以调节铜基导体的烧结开始以接近或匹配结构的陶瓷部分。 此外，提供了方法，其中用于形成结构陶瓷部分的聚合物粘合剂树脂可以使用含氧环境除去或燃烧，其中氧含量大于200ppm，而不会氧化铜 的导体。

公开(公告)号：US4824009A

公开(公告)日：1989-04-25

申请号：US336246

申请日：1981-12-31

申请人： Raj N. Master ,  Marvin S. Pittler ,  Paul A. Totta ,  Norman G. Ainslie ,  Paul H. Palmateer

发明人： Raj N. Master ,  Marvin S. Pittler ,  Paul A. Totta ,  Norman G. Ainslie ,  Paul H. Palmateer

IPC分类号： B23K1/20 ,  H01L21/48 ,  H01L23/498 ,  H01L23/50 ,  H05K3/24 ,  H05K3/34 ,  B23K31/02

CPC分类号： H01L23/49811 ,  H01L21/4853 ,  H01L2924/15312 ,  H05K3/245 ,  H05K3/3463

摘要： In the process of braze attachment of electronic package members, such as attaching metallic coated connector pins to a multilayer ceramic substrate, contact areas of the substrate are formed by sequential coatings of molybdenum and nickel, which are heated to diffuse the nickel. A pure gold paste is applied by screen printing, for example, followed by the step of firing to burn out the paste binder and to sinter the pure gold particles onto a dense low porosity structure. The sintering operation converts the Ni film into a continuous Au-Ni solid solution. During pin braze, Ni-Sn intermetallics are dispersed in a gold rich matrix of the Au-Ni solid solution.

摘要翻译： 在诸如将金属涂覆的连接器引脚连接到多层陶瓷基板的电子封装构件的钎焊附接的过程中，基板的接触区域由钼和镍的顺序涂层形成，其被加热以扩散镍。 例如通过丝网印刷施加纯金膏，然后进行煅烧步骤以烧尽糊状粘合剂并将纯金颗粒烧结到致密的低孔隙结构上。 烧结操作将Ni膜转变为连续的Au-Ni固溶体。 在引脚钎焊过程中，Ni-Sn金属间化合物分散在Au-Ni固溶体的富含金的基质中。

公开(公告)号：US4776978A

公开(公告)日：1988-10-11

申请号：US42922

申请日：1987-04-27

申请人： Lester W. Herron ,  Raj N. Master ,  Robert W. Nufer

发明人： Lester W. Herron ,  Raj N. Master ,  Robert W. Nufer

IPC分类号： B22F1/00 ,  B22F3/10 ,  C04B41/51 ,  C04B41/88 ,  H01L21/48 ,  H05K1/09 ,  H01B1/06

CPC分类号： H01L21/4867 ,  B22F1/0059 ,  B22F3/10 ,  B22F3/1021 ,  C04B41/51 ,  C04B41/88 ,  H05K1/092 ,  Y10T428/2998

摘要： Sintering of metal particles at their normal sintering temperature is inhibited by coating the metal particles with an organic material such as polyvinyl butyral, polyvinyl formvar, polyvinyl alcohol, polyacrylonitrile epoxies, urethanes and cross-linked polyvinyl butyral. The organic coating serves as a barrier preventing physical contact between metal particles during the initial phase of the sintering cycle and degrades into a carbonaceous coating followed by volatilization during the intermediate phase of the cycle permitting coalescence of the metal particles into a dense mass along with the coalescence of the glass-ceramic particles. Co-sintering of the metal particles and the glass-ceramic particles with the aid of the organic coating results in a hermetic multi-layer glass ceramic substrate free of dimensional stability problems without deleteriously affecting the electrical conductivity of the metal conductor pattern.

摘要翻译： 通过用有机材料如聚乙烯醇缩丁醛，聚乙烯基甲醛，聚乙烯醇，聚丙烯腈环氧化合物，聚氨酯和交联的聚乙烯醇缩丁醛涂覆金属颗粒来抑制金属颗粒在其正常烧结温度下的烧结。 有机涂层用作防止金属颗粒在烧结循环的初始阶段期间物理接触的屏障，并降解成碳质涂层，随后在循环的中间阶段挥发，使得金属颗粒与 玻璃陶瓷颗粒的聚结。 借助于有机涂层来共同烧结金属颗粒和玻璃 - 陶瓷颗粒导致密封的多层玻璃陶瓷衬底没有尺寸稳定性问题，而不会有害地影响金属导体图案的导电性。