摘要:
Provided is a vertical LED including an n-electrode; an n-type GaN layer formed under the n-electrode, the n-type GaN layer having a surface coming in contact with the n-electrode, the surface having a Ga+N layer containing a larger amount of Ga than that of N; an active layer formed under the n-type GaN layer; a p-type GaN layer formed under the active layer; a p-electrode formed under the p-type GaN layer; and a structure support layer formed under the p-electrode.
摘要:
A vertical nitride-based semiconductor LED comprises a structure support layer; a p-electrode formed on the structure support layer; a p-type nitride semiconductor layer formed on the p-electrode; an active layer formed on the p-type nitride semiconductor layer; an n-type nitride semiconductor layer formed on the active layer; an n-electrode formed on a portion of the n-type nitride semiconductor layer; and a buffer layer formed on a region of the n-type nitride semiconductor layer on which the n-electrode is not formed, the buffer layer having irregularities formed thereon. The surface of the n-type nitride semiconductor layer coming in contact with the n-electrode is flat.
摘要:
A variable tape feeder is provided. The variable tape feeder includes a frame having an accommodating section and a component feeding section on a transfer path that transfers a carrier tape having components packaged with a cover tape. Width adjusters for the transfer path, the accommodating section, and the component feeding section are installed respectively on the transfer path, accommodating section, and component feeding section to adjust widths thereof according to widths of the carrier tape, the accommodating section, and the component feeding section, respectively. Width sensors for the transfer path, the accommodating section, and the component feeding section detect widths adjustment of the transfer path, the accommodating section, and the component feeding section width adjusters, respectively. A controller outputs a response signal in response to signals detected by the respective sensors installed in the component feeding section and the accommodating section.
摘要:
An electronic component feeder and a chip mount having the electronic component feeder are provided. The electronic component feeder includes a body having a pickup position at which electronic components are picked up and a plurality of component feed paths guiding respective component feed tapes holding the electronic components to the pickup position, and which switches the component feed paths to select a component feed path guiding a component feed tape to the pickup position so that the electronic components held in the component feed tape are picked up at the pickup position, based on a component holding state about the electronic components held in one of the component feed tapes.
摘要:
A vertical nitride-based semiconductor LED comprises a structure support layer; a p-electrode formed on the structure support layer; a p-type nitride semiconductor layer formed on the p-electrode; an active layer formed on the p-type nitride semiconductor layer; an n-type nitride semiconductor layer formed on the active layer; an n-electrode formed on a portion of the n-type nitride semiconductor layer; and a buffer layer formed on a region of the n-type nitride semiconductor layer on which the n-electrode is not formed, the buffer layer having irregularities formed thereon. The surface of the n-type nitride semiconductor layer coming in contact with the n-electrode is flat.
摘要:
There is provided a semiconductor light emitting device having excellent light extraction efficiency to efficiently reflect light moving into the device by increasing the total reflectivity of a reflective layer. A semiconductor light emitting device according to an aspect of the invention includes: a substrate, a reflective electrode, a first conductivity semiconductor layer, an active layer, and a second conductivity type semiconductor layer that are sequentially stacked. Here, the reflective electrode includes; a first reflective layer provided on the substrate and including a conductive reflective material reflecting light generated from the active layer; and a second reflective layer provided on the first reflective layer, including one or more dielectric portions reflecting light generated from the active layer, and one or more contact holes filled with a conductive filler to electrically connect the first conductivity type semiconductor layer and the first reflective layer, and having a greater thickness than a wavelength of the generated light.
摘要:
A row redundancy circuit for use in a semiconductor memory device. The row redundancy circuit providing fuse boxes to repair defective normal memory cells even in the adjacent normal memory cell arrays.
摘要:
According to an example embodiment, a method includes forming a nitrogen vacancy surface layer by treating a surface of an n-type nitride semiconductor with inert gas plasma, and forming an oxygen-added nitride film by treating a surface of the nitrogen vacancy surface layer with oxygen-containing gas plasma, and forming an electrode on the oxygen-added nitride film. The nitrogen vacancy surface layer lacks a nitrogen element.
摘要:
There is provided a semiconductor light emitting device and method of making the same, having a first conductivity type semiconductor layer; an active layer formed on the first conductivity type semiconductor layer; a second conductivity type semiconductor layer formed on the active layer and including a plurality of holes; and a transparent electrode formed on the second conductivity type semiconductor layer.
摘要:
A variable tape feeder is provided. The variable tape feeder includes a frame having an accommodating section and a component feeding section on a transfer path that transfers a carrier tape having components packaged with a cover tape. Width adjusters for the transfer path, the accommodating section, and the component feeding section are installed respectively on the transfer path, accommodating section, and component feeding section to adjust widths thereof according to widths of the carrier tape, the accommodating section, and the component feeding section, respectively. Width sensors for the transfer path, the accommodating section, and the component feeding section detect widths adjustment of the transfer path, the accommodating section, and the component feeding section width adjusters, respectively. A controller outputs a response signal in response to signals detected by the respective sensors installed in the component feeding section and the accommodating section.