公开(公告)号：US06300576B1

公开(公告)日：2001-10-09

申请号：US09106302

申请日：1998-06-29

申请人： Yoshifumi Nakamura ,  Minehiro Itagaki ,  Hiroaki Takezawa ,  Yoshihiro Bessho ,  Tsukasa Shiraishi

发明人： Yoshifumi Nakamura ,  Minehiro Itagaki ,  Hiroaki Takezawa ,  Yoshihiro Bessho ,  Tsukasa Shiraishi

IPC分类号： H01R909

CPC分类号： H01L23/49811 ,  H01L21/4853 ,  H01L2924/0002 ,  H05K1/095 ,  H05K3/4007 ,  H05K3/4069 ,  H05K3/4614 ,  H05K2201/0355 ,  H05K2203/0191 ,  H05K2203/1461 ,  Y10T29/49126 ,  Y10T29/49149 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/49165 ,  Y10T428/24926 ,  H01L2924/00

摘要： A printed-circuit board, especially a multilayer printed-circuit board, with projection electrodes integrated with via hole conductors. Each of the projection electrodes is highly adhesive to a corresponding one of the via hole conductors and has high strength, and thus the production method of the printed-circuit board is simplified. Projection electrodes formed of a cured conducting paste are formed in such a manner that the electrodes are integrated with the via hole conductors which consist of a conducting paste embedded into the via hole formed in an insulating resin substrate to form a printed board. The method for producing a printed-circuit board, includes making via holes that penetrate through a prepreg to whose surface a parting film is applied; filling the via hole with a conducting paste; compressing the prepreg under heat to cure the prepreg and the paste; and then peeling off the film. Thus, projection electrodes with a height corresponding the thickness of the film are formed in a manner such that the projecting electrodes are integrated with the via hole conductors.

摘要翻译： 印刷电路板，特别是多层印刷电路板，其具有与通孔导体集成的突出电极。 每个突起电极与相应的一个通孔导体高度粘合，并且具有高强度，因此简化了印刷电路板的制造方法。 由固化导电膏形成的投影电极以这样的方式形成，使得电极与通孔导体集成，通孔导体包括嵌入到形成在绝缘树脂基板中的通孔中的导电膏，以形成印刷板。 制造印刷电路板的方法包括制造穿透预浸料的通孔，其中涂覆有分离膜的表面; 用导电膏填充通孔; 在加热下压制预浸料以固化预浸料和糊料; 然后剥离胶片。 因此，以使得突出电极与通孔导体一体化的方式形成具有与膜的厚度对应的高度的突起电极。

公开(公告)号：US06284640B1

公开(公告)日：2001-09-04

申请号：US09427807

申请日：1999-10-27

申请人： Masahiro Ono ,  Tsukasa Shiraishi ,  Yoshihiro Bessho ,  Kazuo Eda

发明人： Masahiro Ono ,  Tsukasa Shiraishi ,  Yoshihiro Bessho ,  Kazuo Eda

IPC分类号： H01L2144

CPC分类号： H01L24/85 ,  H01L24/11 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05027 ,  H01L2224/0508 ,  H01L2224/05572 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/78301 ,  H01L2224/81191 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2924/00

摘要： A manufacturing method for a semiconductor device using a wire bonding method using a metal wire. In the wire bonding method, an impact load applied when a metal ball formed at the tip of the metal wire by electric discharge is brought into contact with a terminal electrode of a semiconductor device is smaller than a static load applied after the metal ball is brought into contact with the terminal electrode. The method makes it possible to prevent an element or wiring from being damaged while securing the pressure necessary for bonding the metal ball to the terminal electrode even when the terminal electrode is placed on the element or the wiring.

摘要翻译： 一种使用金属线的引线接合方法的半导体器件的制造方法。 在引线接合方法中，当通过放电在金属线的前端形成的金属球与半导体器件的端子电极接触时施加的冲击载荷小于在金属球被带入之后施加的静态载荷 与端子电极接触。 该方法使得即使当将端子电极放置在元件或布线上时，也可以确保将金属球接合到端子电极所需的压力，从而防止元件或布线损坏。

公开(公告)号：US5920142A

公开(公告)日：1999-07-06

申请号：US813279

申请日：1997-03-10

申请人： Keiji Onishi ,  Hideki Iwaki ,  Shun-ichi Seki ,  Yutaka Taguchi ,  Tsukasa Shiraishi ,  Yoshihiro Bessho ,  Osamu Kawasaki ,  Kazuo Eda

发明人： Keiji Onishi ,  Hideki Iwaki ,  Shun-ichi Seki ,  Yutaka Taguchi ,  Tsukasa Shiraishi ,  Yoshihiro Bessho ,  Osamu Kawasaki ,  Kazuo Eda

IPC分类号： H03H3/08 ,  H03H9/10 ,  H01L41/08

CPC分类号： H03H9/0509 ,  H03H3/08 ,  H03H9/0585 ,  H03H9/059 ,  H03H9/1042 ,  H03H9/1071 ,  H03H9/1085 ,  H03H9/1092 ,  H01L2224/1134 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/45144 ,  H01L2924/00013 ,  H01L2924/09701 ,  H01L2924/16152 ,  Y10T29/42 ,  Y10T29/4913 ,  Y10T29/49146

摘要： The present invention relates to an electronic part used for mobile communications apparatuses and the like, and more particularly to an electronic part, such as an acoustic surface-wave device, a piezoelectric ceramic device or the like, which requires an oscillation space near the surface of the functional device chip thereof, and a method of production thereof. With this method, a space retainer for forming a sealed space at the functional portion of the chip can be hermetically sealed and have high moisture resistance, and the process of forming the space retainer can be carried out easily.The electronic part of the present invention comprises a functional device chip, a space retainer for forming a sealed space at the functional portion of the chip, a circuit substrate to which the chip is secured, electrode interconnection portions for establishing electric connection between the chip and the circuit substrate, and a sealing resin for covering and sealing at least the space retainer, wherein the space retainer comprises a support layer made of a synthetic resin film, provided with an opening enclosing the functional portion and joined onto the main surface, and a cover formed and joined onto the support layer so as to cover the functional portion and form a sealed space between the cover and the functional portion.

公开(公告)号：US08353102B2

公开(公告)日：2013-01-15

申请号：US12120864

申请日：2008-05-15

申请人： Masayoshi Koyama ,  Tsukasa Shiraishi

发明人： Masayoshi Koyama ,  Tsukasa Shiraishi

IPC分类号： H05K3/34 ,  H05K3/30 ,  H05K1/00

CPC分类号： H05K3/361 ,  H01L24/11 ,  H01L2924/00014 ,  H05K1/117 ,  H05K3/323 ,  H05K2201/0373 ,  H05K2201/09663 ,  H05K2201/0969 ,  H05K2201/09745 ,  H05K2203/087 ,  H05K2203/166 ,  Y10T29/4913 ,  Y10T29/49144 ,  H01L2224/05599

摘要： A wiring board connection method comprising: arranging a continuous conductive joint body on adjacent connection terminals of one of the wiring boards in a space between the adjacent connection terminals on one of the wiring boards; aligning the wiring boards so that the connection terminals face each other with the conductive joint body interposed therebetween; and bonding the connection terminals with each other by heating and then cooling the conductive joint body, wherein: the conductive joint body is a material that generates air bubbles upon being heated; and a recessed portion is formed on a surface of at least one of the connection terminals, the surface being opposite to the connection terminal of another wiring board. When the connection terminals are bonded with each other, the conductive joint body is allowed to move so as to gather on the surfaces of the connection terminals where no recessed portions are formed.

摘要翻译： 一种布线板连接方法，包括：在一个所述布线板之间的相邻连接端子之间的空间中，在所述布线板之一的相邻连接端子上布置连续的导电接头体; 对准布线板，使得连接端子彼此面对，并且导电接头体插入其间; 并且通过加热将所述连接端子彼此接合，然后冷却所述导电接头体，其中：所述导电接头体是在加热时产生气泡的材料; 并且在至少一个连接端子的表面上形成凹部，该表面与另一布线板的连接端子相对。 当连接端子彼此接合时，导电接头体被允许移动，以便聚集在不形成凹部的连接端子的表面上。

公开(公告)号：US20110112497A1

公开(公告)日：2011-05-12

申请号：US12990291

申请日：2009-03-23

申请人： Tsukasa Shiraishi ,  Yusuke Kawakami

发明人： Tsukasa Shiraishi ,  Yusuke Kawakami

IPC分类号： A61F13/42

CPC分类号： A61F13/42

摘要： An absorbent article that enables the presence of moisture, for example, derived from urination to be easily recognized. The absorbent article includes an outer sheet provided on a side that faces a wearer's skin, i.e., on its side facing a liquid-absorbent structure with moisture visualizing elements. The moisture visualizing elements are formed by coating the outer sheet with hot melt composition comprising pH indicator mixed with pressure-sensitive adhesive ingredient. Two or more stripes of the hot melt composition forming the moisture visualizing elements extend in a longitudinal direction at least across a crotch region. Between the moisture visualizing elements and the liquid-absorbent structure, there is provided a barrier sheet or barrier sheets extending in a transverse direction so as to intersect the moisture visualizing elements comprising two or more stripes of the hot melt composition.

摘要翻译： 使得能够容易地识别例如来自排尿的水分的存在的吸收制品。 吸收性物品包括设置在面向穿着者皮肤的一侧的外侧片，即其面向具有水分可视化元件的吸液结构的一侧。 水分可视化元件通过用包含与压敏粘合剂成分混合的pH指示剂的热熔组合物涂布外片而形成。 形成水分可视化元件的热熔组合物的两条或更多条至少在裆部区域沿纵向方向延伸。 在水分可视化元件和吸液结构之间，设置有横向延伸的阻挡片或阻挡片，以与包含两个或更多个热熔组合物条纹的水分可视化元件相交。

公开(公告)号：US07649267B2

公开(公告)日：2010-01-19

申请号：US11884613

申请日：2006-03-08

申请人： Tsukasa Shiraishi ,  Yukihiro Ishimaru ,  Seiji Karashima ,  Seiichi Natkatani ,  Hiroki Yabe

发明人： Tsukasa Shiraishi ,  Yukihiro Ishimaru ,  Seiji Karashima ,  Seiichi Natkatani ,  Hiroki Yabe

IPC分类号： H01L29/41 ,  H01L21/00

CPC分类号： H05K3/3436 ,  H01L21/563 ,  H01L23/49838 ,  H01L24/11 ,  H01L24/16 ,  H01L24/17 ,  H01L24/83 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05611 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/1703 ,  H01L2224/17051 ,  H01L2224/17132 ,  H01L2224/17136 ,  H01L2224/17151 ,  H01L2224/17155 ,  H01L2224/17177 ,  H01L2224/17515 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32052 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83007 ,  H01L2224/83097 ,  H01L2224/83192 ,  H01L2224/83801 ,  H01L2224/83887 ,  H01L2224/83888 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/30105 ,  H01L2924/3025 ,  H05K3/323 ,  H05K3/3484 ,  H05K2201/09781 ,  H05K2201/10977 ,  H05K2203/046 ,  Y02P70/613 ,  H01L2224/1713 ,  H01L2224/1715 ,  H01L2924/00 ,  H01L2924/01083 ,  H01L2924/013 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A highly reliable, high-productivity package equipped with a semiconductor chip, and a method for producing the same. In a package (100) comprising a semiconductor chip (10) and a mounting substrate (30), a plurality of electrode terminals (12) are formed on the surface (10a) of the semiconductor chip (10) opposing the mounting substrate side, connection terminals (32) respectively corresponding to the plurality of electrode terminals (12), are formed on the mounting substrate (30), the connection terminals (32) on the mounting substrate (30) and the electrode terminals (12) are electrically connected collectively by solder bumps (17) formed in self-assembly, an electrode pattern (20) not connected with the electrode terminals (12) and the connection terminals (32) is formed on the chip surface (10a) or the surface (35) of the mounting substrate (30) corresponding to the chip surface (10a), and solder (19) is accumulated on the electrode pattern (20).

摘要翻译： 具有半导体芯片的高可靠性，高生产率的封装及其制造方法。 在包括半导体芯片（10）和安装基板（30）的封装（100）中，在与安装基板侧相对的半导体芯片（10）的表面（10a）上形成有多个电极端子（12） 分别对应于多个电极端子（12）的连接端子（32）形成在安装基板（30）上，安装基板（30）上的连接端子（32）和电极端子（12）电连接 集体地通过自组装形成的焊料凸点（17），在芯片表面（10a）或表面（35）上形成未与电极端子（12）和连接端子（32）连接的电极图案（20） 对应于芯片表面（10a）的安装基板（30），并且焊料（19）积聚在电极图案（20）上。

公开(公告)号：US20090049687A1

公开(公告)日：2009-02-26

申请号：US11886533

申请日：2006-03-17

申请人： Tsukasa Shiraishi ,  Yukihiro Ishimaru ,  Shinobu Masuda ,  Satoru Tomekawa

发明人： Tsukasa Shiraishi ,  Yukihiro Ishimaru ,  Shinobu Masuda ,  Satoru Tomekawa

IPC分类号： H05K3/34

CPC分类号： H01L24/81 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/75822 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/83851 ,  H01L2224/83886 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K3/3436 ,  H05K2203/0195 ,  H05K2203/048 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49137 ,  Y10T29/49139 ,  Y10T29/49142 ,  Y10T29/49144 ,  Y10T29/49149 ,  H01L2924/00 ,  H01L2224/05599

摘要： [Problem] To improve productivity and reliability in mounting an electronic component.[Means for Solving Problems] At least one of an electrode terminal of an electronic component and a connecting terminal of a wiring substrate is provided with solder beforehand, one of the wiring substrate and the electronic component is secured, and the electrode terminal of the electronic component and the connecting terminal of the wiring substrate are made to abut each other in a state where one of the wiring substrate and the electronic component, whichever is not secured, is held. Then, the electronic component is heated so that the solder is melted, and the solder is solidified while the electronic component is held, so that the electrode terminal and the connecting terminal are bonded to each other by means of the solder. Further, while an interval formed between the wiring substrate and the electronic component by the melted solder is being held, the electrode terminal and the connecting terminal are finely moved relative to each other with reference to a surface of the wiring substrate in an XYθ direction.

摘要翻译： [问题]提高安装电子元件的生产力和可靠性。 解决问题的手段电子部件的电极端子和布线基板的连接端子中的至少一个预先设置有焊料，布线基板和电子部件中的一个被固定，电子端子 使布线基板的连接端子与布线基板和电子部件中的一方（以未固定的方式）保持的状态相互抵接。 然后，电子部件被加热使得焊料熔化，并且在保持电子部件的同时使焊料​​固化，使得电极端子和连接端子通过焊料彼此接合。 此外，在通过熔化的焊料在布线基板和电子部件之间形成的间隔被保持的同时，电极端子和连接端子相对于布线基板的表面在XYθ方向上相对于彼此微细移动。

公开(公告)号：US20080298023A1

公开(公告)日：2008-12-04

申请号：US12127123

申请日：2008-05-27

申请人： Rikiya Okimoto ,  Tsukasa Shiraishi ,  Yukihiro Ishimaru ,  Toshiyuki Kojima

发明人： Rikiya Okimoto ,  Tsukasa Shiraishi ,  Yukihiro Ishimaru ,  Toshiyuki Kojima

IPC分类号： H05K7/20 ,  H05K3/30

CPC分类号： H05K1/183 ,  H01L2224/0554 ,  H01L2224/05548 ,  H01L2224/05573 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/16251 ,  H01L2924/19105 ,  H05K1/186 ,  H05K1/187 ,  H05K3/20 ,  H05K3/4614 ,  H05K2201/0394 ,  H05K2201/10378 ,  H05K2201/10454 ,  H05K2203/063 ,  Y10T29/49137 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： An electronic component-containing module includes an electrically insulating substrate; and a first electronic component and second electronic component embedded in the electrically insulating substrate, wherein the first electronic component protrudes partially from at least one surface of the electrically insulating substrate, and the second electronic component is contained in the electrically insulating substrate.

摘要翻译： 含电子元件的模块包括电绝缘基板; 以及嵌入在所述电绝缘基板中的第一电子部件和第二电子部件，其中，所述第一电子部件从所述电绝缘基板的至少一个表面部分突出，并且所述第二电子部件容纳在所述电绝缘基板中。

公开(公告)号：US20070262447A1

公开(公告)日：2007-11-15

申请号：US11748111

申请日：2007-05-14

申请人： Koichi HIRANO ,  Tsukasa SHIRAISHI ,  Seiichi NAKATANI ,  Tatsuo OGAWA

发明人： Koichi HIRANO ,  Tsukasa SHIRAISHI ,  Seiichi NAKATANI ,  Tatsuo OGAWA

IPC分类号： H01L23/48

CPC分类号： H05K1/0271 ,  H01L23/49811 ,  H01L24/12 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13011 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/16 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/351 ,  H05K1/09 ,  H05K1/111 ,  H05K3/243 ,  H05K2201/0338 ,  H05K2201/0355 ,  H05K2201/09109 ,  H01L2924/00 ,  H01L2224/05599

摘要： A circuit board 1 having a base material 10 and an electrode 11 formed on at least one main surface of the base material 10 includes an easy peeling portion 12 formed in at least one of an inner portion and a side portion of the electrode 11, with the adhesive strength between the electrode 11 and the easy peeling portion 12 being less than the adhesive strength between the electrode 11 and the base material 10. A circuit board that has high connection reliability and enables narrow pitch mounting thereby can be provided.

摘要翻译： 具有基材10和形成在基材10的至少一个主表面上的电极11的电路板1包括形成在电极11的内部和侧部中的至少一个中的易剥离部分12， 电极11和容易剥离部12之间的粘合强度小于电极11与基材10之间的粘合强度。可以提供具有高连接可靠性并能实现窄间距安装的电路板。

公开(公告)号：US06818461B2

公开(公告)日：2004-11-16

申请号：US10062463

申请日：2002-02-05

申请人： Kazuyoshi Amami ,  Tsukasa Shiraishi ,  Yoshihiro Bessho

发明人： Kazuyoshi Amami ,  Tsukasa Shiraishi ,  Yoshihiro Bessho

IPC分类号： G01R3126

CPC分类号： H01L24/81 ,  H01L21/56 ,  H01L2224/0401 ,  H01L2224/0603 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/13082 ,  H01L2224/13099 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/1403 ,  H01L2224/16 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2224/83191 ,  H01L2224/92125 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01056 ,  H01L2924/01057 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/305 ,  H05K3/321 ,  H01L2924/00014

摘要： A mounting structure is formed by flip-chip mounting a semiconductor device onto a substrate. An electrical connecting portion of the semiconductor device is connected to an electrical connecting portion of the substrate by means of an electrically conductive adhesive. A region of the semiconductor device which is not involved in electrical connection is bonded to a region of the substrate which is not involved in electrical connection by means of an adhesive. A test of electrical properties is performed on the semiconductor device and the substrate which are connected to each other. If it is determined that the electrical properties are poor in the test, the semiconductor device is separated from the substrate after heating a bonding place of the adhesive up to a temperature higher than a glass transition point or a melting point of the adhesive. If it is determined that the electrical properties are good in the test, the semiconductor device and the substrate are sealed by means of a sealing resin.

摘要翻译： 通过将半导体器件倒装安装到衬底上来形成安装结构。 半导体器件的电连接部分通过导电粘合剂连接到基片的电连接部分。 不参与电连接的半导体器件的区域通过粘合剂结合到不涉及电连接的基板的区域。 对彼此连接的半导体器件和衬底进行电特性的测试。 如果在测试中确定电气性能差，则在将粘合剂的粘合位置加热到高于粘合剂的玻璃化转变点或熔点的温度之后，半导体器件与基板分离。 如果在测试中确定电性能良好，则半导体器件和衬底通过密封树脂密封。