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公开(公告)号:US20130235528A1
公开(公告)日:2013-09-12
申请号:US13465049
申请日:2012-05-07
Applicant: WEN-HSIEN LEE , SHIH-PO LO , CHING-FENG HSIEH
Inventor: WEN-HSIEN LEE , SHIH-PO LO , CHING-FENG HSIEH
IPC: H05K7/20
CPC classification number: H05K7/20418 , H05K9/0032
Abstract: An assembled electromagnetic shielding case conducive to electromagnetic interference shielding and heat dissipation of an electronic component on a printed circuit board includes a body, a shielding element, and a fixing element. The body has an opening and an engagement portion. The engagement portion connects the body and the printed circuit board. The shielding element has a bottom side and a heat-dissipating side opposing thereto. The shielding element closes the opening for effectuating electromagnetic interference shielding. The shielding element dissipates heat generated from the electronic component by transferring the heat from the bottom side to the heat-dissipating side for dissipating the heat. The fixing element couples the body and the shielding element. Accordingly, with the assembled electromagnetic shielding case, not only is the electronic component insusceptible to electromagnetic interference and easy to change, but it is feasible to provide highly efficient heat dissipation and a miniaturized heat dissipation structure.
Abstract translation: 一种有助于印刷电路板上的电子部件的电磁干扰屏蔽和散热的组装的电磁屏蔽壳体包括主体,屏蔽元件和固定元件。 主体具有开口和接合部分。 接合部分连接主体和印刷电路板。 屏蔽元件具有与其相对的底侧和散热侧。 屏蔽元件封闭用于实现电磁干扰屏蔽的开口。 屏蔽元件通过将热量从底侧传递到散热侧来散发由电子元件产生的热量,以耗散热量。 固定元件连接主体和屏蔽元件。 因此,通过组装的电磁屏蔽壳体,电子部件不仅不易受到电磁干扰,易于变化,而且可以提供高效的散热和小型化的散热结构。
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公开(公告)号:USD619925S1
公开(公告)日:2010-07-20
申请号:US29353351
申请日:2010-01-07
Applicant: Wen-Hsien Lee
Designer: Wen-Hsien Lee
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公开(公告)号:USD992654S1
公开(公告)日:2023-07-18
申请号:US29817738
申请日:2021-12-03
Applicant: Wen-Hsien Lee
Designer: Wen-Hsien Lee
Abstract: FIG. 1 is a perspective view of a toy steam locomotive showing my new design;
FIG. 2 is another perspective view thereof;
FIG. 3 is a front elevation view thereof;
FIG. 4 is a rear elevation view thereof;
FIG. 5 is a left side elevation view thereof;
FIG. 6 is a right side elevation view thereof;
FIG. 7 is a top plan view thereof; and,
FIG. 8 is a bottom plan view thereof.
The broken lines shown in the drawings depict portions of the article that form no part of the claimed design.-
公开(公告)号:USD990582S1
公开(公告)日:2023-06-27
申请号:US29796491
申请日:2021-06-24
Applicant: Wen-Hsien Lee
Designer: Wen-Hsien Lee
Abstract: FIG. 1 is a perspective view of a toy showing my new design;
FIG. 2 is another perspective view thereof;
FIG. 3 is still another perspective view thereof;
FIG. 4 is the other perspective view thereof;
FIG. 5 is a front elevation view thereof;
FIG. 6 is a rear elevation view thereof;
FIG. 7 is a left side elevation view thereof;
FIG. 8 is a right side elevation view thereof;
FIG. 9 is a top plan view thereof; and,
FIG. 10 is a bottom view thereof.
The broken lines shown in the drawings depict portions of the article that form no part of the claimed design.-
公开(公告)号:USD962357S1
公开(公告)日:2022-08-30
申请号:US29752185
申请日:2020-09-25
Applicant: Wen Hsien Lee
Designer: Wen Hsien Lee
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公开(公告)号:USD891533S1
公开(公告)日:2020-07-28
申请号:US29668888
申请日:2018-11-02
Applicant: Wen-Hsien Lee
Designer: Wen-Hsien Lee
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公开(公告)号:USD872813S1
公开(公告)日:2020-01-14
申请号:US29665707
申请日:2018-10-05
Applicant: Wen-Hsien Lee
Designer: Wen-Hsien Lee
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公开(公告)号:USD836729S1
公开(公告)日:2018-12-25
申请号:US29582000
申请日:2016-10-24
Applicant: Wen-Hsien Lee
Designer: Wen-Hsien Lee
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公开(公告)号:USD713477S1
公开(公告)日:2014-09-16
申请号:US29472739
申请日:2013-11-15
Applicant: Wen-Hsien Lee
Designer: Wen-Hsien Lee
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公开(公告)号:USD681134S1
公开(公告)日:2013-04-30
申请号:US29435214
申请日:2012-10-22
Applicant: Wen-Hsien Lee
Designer: Wen-Hsien Lee
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