Multi-perspective wafer analysis using an acousto-optic deflector

    公开(公告)号:US11195267B1

    公开(公告)日:2021-12-07

    申请号:US16926395

    申请日:2020-07-10

    Abstract: Disclosed herein is a computerized system including scanning equipment configured to obtain multi-perspective scan data of a slice on a sample. The scanning equipment includes: (i) a light source configured to generate a light beam; (ii) an acousto-optic deflector (AOD) configured to focus the light beam such as to generate a beam train scanned along consecutive lines on the slice, in groups of n≥2 successively scanned lines, along each of which the beam train forms at least one illumination spot, respectively; and (iii) one or more detectors configured to sense light returned from the slice. The n≥2 lines are scanned different perspectives, respectively. The consecutive lines may be longitudinally displaced relative to one another, such as to overlap in 100·(n−1)/n % of widths thereof, so that the slice may be fully scanned in each of the perspectives.

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