公开(公告)号：US20060041069A1

公开(公告)日：2006-02-23

申请号：US10528476

申请日：2003-10-09

申请人： Naoko Sumi ,  Hiroki Kamiya ,  Masanori Okazaki ,  Yukio Kobayashi ,  Yoshitaka Samura

发明人： Naoko Sumi ,  Hiroki Kamiya ,  Masanori Okazaki ,  Yukio Kobayashi ,  Yoshitaka Samura

IPC分类号： C08F8/00

CPC分类号： C08F114/18 ,  C08F14/22 ,  C08L27/12 ,  C08L2205/02 ,  C08L2666/04

摘要： The present invention provides: a first sealing material for semiconductor device which sealing material is excellent in plasma resistance and inexpensive; and a second sealing material for semiconductor device and a method of manufacturing this sealing material wherein the sealing material has a good surface smoothness and a good dimensional precision. The first sealing material contains a fluororubber as a rubber component wherein the fluororubber inevitably contains a cured product of a fluorine-based elastic copolymer of a specific composition. The second sealing material is obtained by crosslinking, with ionizing radiation, a fluororubber preform containing a fluororubber component (a) (comprising a specific fluorine-based elastic copolymer) and a non-elastic fluororesin component (b) (comprising a vinylidene fluoride (co)polymer) in a specific ratio.

摘要翻译： 本发明提供一种半导体装置用密封材料，其密封材料具有优异的等离子体电阻和廉价; 以及用于半导体器件的第二密封材料和该密封材料的制造方法，其中密封材料具有良好的表面平滑度和良好的尺寸精度。 第一密封材料含有氟橡胶作为橡胶组分，其中氟橡胶不可避免地含有具体组成的氟基弹性共聚物的固化产物。 第二密封材料通过电离辐射与包含氟橡胶组分（a）（包含特定氟基弹性共聚物）和非弹性氟树脂组分（b）（包含偏二氟乙烯（共聚物））的氟橡胶预成型体交联而获得 ）聚合物）。