公开(公告)号：US20170186822A1

公开(公告)日：2017-06-29

申请号：US15303007

申请日：2016-02-22

Applicant: BOE TECHNOLOGY GROUP CO., LTD. ,  Ordos Yuansheng Optoelectronics Co., Ltd.

Inventor： Weilin Lai ,  Juanjuan Bai ,  Renrong Gai ,  Minghua Xuan

IPC: H01L27/32 ,  H01L51/00 ,  H01L51/50 ,  H01L51/56

CPC classification number: H01L27/3211 ,  H01L27/3213 ,  H01L27/3244 ,  H01L27/3281 ,  H01L51/0011 ,  H01L51/5012 ,  H01L51/504 ,  H01L51/56 ,  H01L2251/5315 ,  H01L2251/5323

Abstract: The present application discloses a light emitting diode, comprising a pixel unit comprising at least a first sub-pixel in a first region, a second sub-pixel in a second region and a third sub-pixel in a third region; a first electrode layer comprising a first sub-electrode for driving the first sub-pixel, a second sub-electrode for driving the second sub-pixel, and a third sub-electrode for driving the third sub-pixel; a second electrode layer opposite to the first electrode layer; and a light emitting unit between the first electrode layer and the second electrode layer. The light emitting unit comprises a first light emitting layer in the first sub-pixel for emitting light of a first color; a second light emitting layer in the second sub-pixel for emitting light of a second color; and a third light emitting layer in the third sub-pixel for emitting light of a third color. The second light emitting layer is in a same layer as the first light emitting layer. The third light emitting layer is in a layer different from the first light emitting layer and the second light emitting layer. The third light emitting layer has at least a continuous emissive layer extending throughout the third region. The first color, the second color, and the third color are three different colors.

公开(公告)号：US20160225800A1

公开(公告)日：2016-08-04

申请号：US14743472

申请日：2015-06-18

Applicant: BOE TECHNOLOGY GROUP CO., LTD. ,  Ordos Yuansheng Optoelectronics Co., Ltd.

Inventor： Zhiliang Jiang ,  Minghua Xuan ,  Renrong Gai ,  Bo Zhang ,  Fei Chen

IPC: H01L27/12

CPC classification number: H01L51/5246 ,  H01L21/02675 ,  H01L21/02686 ,  H01L21/428 ,  H01L21/449

Abstract: The present invention discloses a method and a system of flattening a surface formed by sealant of a packaging cover plate, as well as a packaging method, the method includes vibrating a high temperature sintered packaging cover plate by using a high frequency vibrator with a preset frequency, and irradiating the surface formed by sealant of the packaging cover plate by using a laser with preset power, so that a convex portion formed by the sealant is melted and flows to a concave portion formed by the sealant under vibration of the high frequency vibrator, thereby flattening the surface formed by sealant of the packaging cover plate.

Abstract translation: 本发明公开了一种使包装盖板的密封剂形成的表面平坦化的方法和系统以及包装方法，该方法包括使用具有预设频率的高频振动器来振动高温烧结包装盖板 并且通过使用具有预定功率的激光照射由包装盖板的密封剂形成的表面，使得由密封剂形成的凸部熔化并流到由高频振动器的振动下的密封剂形成的凹部， 从而使由包装盖板的密封剂形成的表面变平。