公开(公告)号：US20220310722A1

公开(公告)日：2022-09-29

申请号：US17414332

申请日：2020-12-29

申请人： Chengdu BOE Optoelectronics Technology Co., Ltd. ,  BOE Technology Group Co., Ltd.

发明人： Linhong HAN ,  Yi ZHANG ,  Guangzhou ZHAO ,  Yiyang ZHANG ,  Yuqing YANG ,  Tingliang LIU ,  Pengfei YU ,  Yang ZHOU ,  Qun MA ,  Xiping LI ,  Shikai QIN ,  Weiyun HUANG ,  Yue LONG

IPC分类号： H01L27/32 ,  H01L51/56 ,  H01L51/52

摘要： Provided are a display motherboard, a preparation method thereof, a display substrate and a display device. The display motherboard includes a plurality of display substrate regions and a cutting region located at a periphery of each of the plurality of display substrate regions; the display motherboard includes a driving structure layer arranged in each of the plurality of display substrate regions and a marking structure layer arranged in each cutting region, wherein the marking structure layer includes a cutting mark layer; and a planarization layer arranged on the driving structure layer and the marking structure layer, and covering the marking structure layer.