公开(公告)号：US20230121298A1

公开(公告)日：2023-04-20

申请号：US17965932

申请日：2022-10-14

Applicant: DONGWOO FINE-CHEM CO., LTD. ,  KREEMO INC.

Inventor： Na Yeon KIM ,  Young Ju KIM ,  Yoon Ho HUH ,  In Seok JANG ,  Beak Jun SEONG ,  Jun Ho PARK ,  In Kyung HONG ,  John Joonho PARK

IPC: H01Q19/00 ,  H01Q5/55 ,  H01Q1/38 ,  H01Q5/385

Abstract: An antenna package includes an antenna device and a circuit board bonded to the antenna device. The circuit board includes a core layer, a feeding line formed on the core layer and bonded to the antenna device, and a CPW ground formed on the core layer to be physically separated from the feeding line and the antenna device.