公开(公告)号：US20100028612A1

公开(公告)日：2010-02-04

申请号：US12181852

申请日：2008-07-29

申请人： Peter Alfred Gruber ,  Paul Alfred Lauro ,  Jae-Woong Nah

发明人： Peter Alfred Gruber ,  Paul Alfred Lauro ,  Jae-Woong Nah

IPC分类号： B32B3/02 ,  B23K31/02

CPC分类号： B23K1/0016 ,  H01L21/4853 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/0554 ,  H01L2224/05567 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/1183 ,  H01L2224/1184 ,  H01L2224/11848 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/81192 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  Y10T428/24612 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A method for forming alloy deposits at selected areas on a receiving substrate includes the steps of: providing an alloy carrier including at least a first decal including a first plurality of openings and a second decal including a second plurality of openings, the first and second decals being arranged such that each of the first plurality of openings is in alignment with a corresponding one of the second plurality of openings; filling the first and second plurality of openings with molten alloy; cooling the molten alloy to thereby form at least first and second plugs, the first plug having a first surface and a second surface substantially parallel to one another, the second plug having a third surface and a fourth surface substantially parallel to one another; removing at least one of the first and second decals to at least partially expose the first and second plugs; aligning the alloy carrier with the receiving substrate so that the first and second plugs correspond to the selected areas on the receiving substrate; and transferring the first plug to a first of the selected areas and the second plug to a second of the selected areas.

公开(公告)号：US20090039140A1

公开(公告)日：2009-02-12

申请号：US11834438

申请日：2007-08-06

申请人： Raschid Jose Bezama ,  Russell Alan Budd ,  Evan George Colgan ,  Peter Alfred Gruber ,  Valerie Oberson

发明人： Raschid Jose Bezama ,  Russell Alan Budd ,  Evan George Colgan ,  Peter Alfred Gruber ,  Valerie Oberson

IPC分类号： B23K37/00 ,  B22C9/00

CPC分类号： B23K3/0638 ,  B23K2101/40 ,  H05K3/3457 ,  H05K2203/0113 ,  H05K2203/0126 ,  H05K2203/0338 ,  H05K2203/1178

摘要： A solder mold for transferring solder to a wafer includes a substrate, a plurality of solder cavities for holding solder, and a plurality of ventilation channels formed between the plurality of solder cavities.

摘要翻译： 用于将焊料转移到晶片的焊接模具包括：衬底，用于保持焊料的多个焊料腔，以及在所述多个焊料腔之间形成的多个通气通道。

公开(公告)号：US07906420B2

公开(公告)日：2011-03-15

申请号：US12627249

申请日：2009-11-30

申请人： Peter Alfred Gruber ,  Paul Alfred Lauro ,  Jae-Woong Nah

发明人： Peter Alfred Gruber ,  Paul Alfred Lauro ,  Jae-Woong Nah

IPC分类号： H01L21/44

CPC分类号： B23K1/0016 ,  H01L21/4853 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/0554 ,  H01L2224/05567 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/1183 ,  H01L2224/1184 ,  H01L2224/11848 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/81192 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  Y10T428/24612 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A method for forming alloy deposits at selected areas on a receiving substrate includes the steps of: providing an alloy carrier including at least a first decal including a first plurality of openings and a second decal including a second plurality of openings, the first and second decals being arranged such that each of the first plurality of openings is in alignment with a corresponding one of the second plurality of openings; filling the first and second plurality of openings with molten alloy; cooling the molten alloy to thereby form at least first and second plugs, the first plug having a first surface and a second surface substantially parallel to one another, the second plug having a third surface and a fourth surface substantially parallel to one another; removing at least one of the first and second decals to at least partially expose the first and second plugs; aligning the alloy carrier with the receiving substrate so that the first and second plugs correspond to the selected areas on the receiving substrate; and transferring the first plug to a first of the selected areas and the second plug to a second of the selected areas.

摘要翻译： 一种用于在接收基板上的选定区域形成合金沉积物的方法包括以下步骤：提供合金载体，其包括至少包括第一多个开口的第一贴花和包括第二多个开口的第二贴花，第一和第二贴花 被布置成使得所述第一多个开口中的每一个与所述第二多个开口中的对应的一个开口对准; 用熔融合金填充第一和第二多个开口; 冷却所述熔融合金，从而形成至少第一和第二塞子，所述第一塞子具有基本上彼此平行的第一表面和第二表面，所述第二塞子具有基本上彼此平行的第三表面和第四表面; 去除所述第一和第二贴花中的至少一个以至少部分地暴露所述第一和第二插塞; 将合金载体与接收基板对准，使得第一和第二插塞对应于接收基板上的选定区域; 以及将所述第一插头转移到所选择的区域中的第一个，并且将所述第二插头转移到所选择的区域中的第二个。

公开(公告)号：US20100086739A1

公开(公告)日：2010-04-08

申请号：US12244067

申请日：2008-10-02

申请人： Russell A. Budd ,  Bing Dang ,  William S. Graham ,  Peter Alfred Gruber ,  Richard Levine ,  Da-Yuan Shih

发明人： Russell A. Budd ,  Bing Dang ,  William S. Graham ,  Peter Alfred Gruber ,  Richard Levine ,  Da-Yuan Shih

IPC分类号： B32B3/12 ,  B23K31/02

CPC分类号： B23K1/0016 ,  B23K1/20 ,  B23K26/364 ,  B23K2101/40 ,  H05K1/111 ,  H05K3/3457 ,  H05K2201/09381 ,  H05K2201/0969 ,  H05K2201/09745 ,  H05K2203/043 ,  Y02P70/611 ,  Y10T428/24479

摘要： A microcavity structure is provided. The structure comprises a cavity layout that enables centering of reflowed solder at each of one or more interconnect locations and protrusion of the reflowed solder sufficiently from the cavity to facilitate wetting. Techniques are also provided for producing a microcavity structure, for using injection molded solder (IMS) for micro bumping, as well as for using injection molded solder (IMS) for three-dimensional (3D) packaging.

摘要翻译： 提供微腔结构。 该结构包括空腔布局，其能够使一个或多个互连位置中的每一个处的回流焊料居中并且使回流焊料从空腔充分突出以促进润湿。 还提供了用于制造微腔结构的技术，用于使用用于微型凸起的注射成型焊料（IMS）以及用于三维（3D）封装的注射成型焊料（IMS）。

公开(公告)号：US06708872B2

公开(公告)日：2004-03-23

申请号：US10107985

申请日：2002-03-27

申请人： Peter Alfred Gruber ,  Chon Cheong Lei

发明人： Peter Alfred Gruber ,  Chon Cheong Lei

IPC分类号： B23K3102

CPC分类号： B23K3/0638 ,  B23K2101/42 ,  H05K3/3468 ,  H05K2201/10424 ,  H05K2203/0113 ,  H05K2203/0338 ,  H05K2203/043 ,  H05K2203/128

摘要： There is provided a method for applying solder to an element on a surface of a substrate. The method comprises the steps of (a) placing a mold over the surface, where the mold includes a conduit that contains the solder, and (b) heating the solder to a molten state so that the solder flows from the conduit onto the element. The conduit enjoys two degrees of horizontal freedom with respect to the surface such that the conduit becomes substantially aligned with the element when the solder is in the molten state. There is also provided a system for applying solder to an element on a surface of a substrate.

摘要翻译： 提供了将焊料施加到基板表面上的元件的方法。 该方法包括以下步骤：（a）将模具放置在表面上，其中模具包括含有焊料的导管，和（b）将焊料加热至熔融状态，使得焊料从导管流到元件上。 导管相对于表面具有两度的水平自由度，使得当焊料处于熔融状态时，导管变得基本上与元件对齐。 还提供了一种用于将焊料施加到衬底表面上的元件的系统。

公开(公告)号：US06452117B2

公开(公告)日：2002-09-17

申请号：US09871555

申请日：2001-05-31

申请人： Brian Eugene Curcio ,  Peter Alfred Gruber ,  Frederic Maurer ,  Konstantinos I. Papathomas ,  Mark David Poliks

发明人： Brian Eugene Curcio ,  Peter Alfred Gruber ,  Frederic Maurer ,  Konstantinos I. Papathomas ,  Mark David Poliks

IPC分类号： H01R1204

CPC分类号： H05K3/4069 ,  H01L21/486 ,  H01L23/49827 ,  H01L23/49833 ,  H01L2924/0002 ,  H05K3/0094 ,  H05K3/246 ,  H05K3/4602 ,  H05K2201/0305 ,  H05K2201/0347 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/09827 ,  H05K2201/09863 ,  H05K2203/0126 ,  H05K2203/085 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/53191 ,  H01L2924/00

摘要： High aspect ratio (5:1-30:1) and small (5 &mgr;m-125 &mgr;m) diameter holes in a dielectric substrate are provided, which are filled with a solidified conductive material, as well as a method of filling such holes using pressure and vacuum. In certain embodiments, the holes are lined with conductive material and/or capped with a conductive material. The invention also contemplates a chip carrier formed by such material.

摘要翻译： 提供介电基片中的高纵横比（5：1-30：1）和小（5毫米-125毫米）直径的孔，填充有凝固的导电材料，以及使用压力填充这些孔的方法 和真空。 在某些实施例中，孔用导电材料衬里和/或用导电材料封盖。 本发明还考虑由这种材料形成的芯片载体。

公开(公告)号：US06294745B1

公开(公告)日：2001-09-25

申请号：US08859680

申请日：1997-05-20

申请人： Peter Alfred Gruber

发明人： Peter Alfred Gruber

IPC分类号： H01R1204

CPC分类号： B23K35/0222 ,  H01L21/4853 ,  H01L24/11 ,  H01L2224/11003 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19043 ,  H05K3/3436 ,  H05K3/3468 ,  H05K2201/10378 ,  H05K2201/10424 ,  H05K2203/0113 ,  H05K2203/0338 ,  H05K2203/128 ,  Y02P70/613 ,  H01L2924/00

摘要： A solder decal is produced by a method wherein a decal strip having a plurality of anchor holes is aligned with a mold having a plurality of cells. Liquid solder is injected into the anchor holes and mold cells, and is then allowed to cool to solidify therein. The mold may be separated from the decal strip to form the solder decal containing solder beads each having a stem mechanically joined to the strip at respective ones of the anchor holes. Various forms of the solder decal are used for transferring the solder beads to a substrate or chip, or effecting temporary connections for conducting burn-in and testing, or accommodating thermal mismatch for example.

摘要翻译： 通过一种方法产生焊锡贴花，其中具有多个锚定孔的贴花带与具有多个电池的模具对准。 将液体焊料注入锚定孔和模具细胞中，然后使其冷却固化。 模具可以与贴花带分离以形成含有焊料珠的焊料贴花，每个焊料珠都具有在相应的锚定孔处机械连接到带材的茎。 使用各种形式的焊锡贴花将焊料珠转移到基板或芯片，或者实现用于进行老化和测试的临时连接，或者例如适应热失配。

公开(公告)号：US06231333B1

公开(公告)日：2001-05-15

申请号：US08518874

申请日：1995-08-24

申请人： Peter Alfred Gruber ,  Egon Max Kummer ,  Bernie Hernandez ,  Thomas George Ference ,  Arthur Richard Zingher

发明人： Peter Alfred Gruber ,  Egon Max Kummer ,  Bernie Hernandez ,  Thomas George Ference ,  Arthur Richard Zingher

IPC分类号： B29C3500

CPC分类号： B23K3/0607 ,  B29C31/041 ,  B29C33/0022 ,  B29C39/24 ,  B29C39/42 ,  B29C2791/006 ,  H05K3/3457 ,  Y10S425/812

摘要： An apparatus and method utilize vacuum injected molding of a liquid in a plurality of mold cells for solidification therein. An injection head includes spaced apart vacuum and injection slots positionable atop a mold plate in flow communication with the mold cells therein. Relative axial sliding is effected between the injection head and the mold plate for sequentially evacuating gas from the mold cells using a continuous vacuum followed in turn by sequentially injecting into the evacuated mold cells the liquid from a continuous source thereof. Sliding of the injection head over the mold plate automatically provides self valving for sequentially evacuating and filling the mold cells from the same side of the mold plate. In a preferred embodiment, the vacuum and injection slots are linked together at the mold plate so that surface tension of the liquid restrains flow of the liquid from the injection slot to the vacuum slot while allowing gas flow therebetween for effecting the vacuum in the mold cells.

摘要翻译： 一种设备和方法利用在多个模具室中的液体的真空注射成型用于固化。 注射头包括间隔开的真空和注射槽，其定位在模具板的顶部，与其中的模具池流动连通。 在注射头和模板之间进行相对的轴向滑动，用于使用连续真空从模具室中依次排出气体，然后依次将来自连续的源的液体注入到抽空的模具中。 注射头在模具板上滑动自动提供自动阀，用于从模具板的同一侧依次抽空和填充模具单元。 在优选实施例中，真空和注入槽在模板处连接在一起，使得液体的表面张力限制液体从注入槽流到真空槽，同时允许气体在其间流动以实现模具室中的真空 。

公开(公告)号：US08561880B2

公开(公告)日：2013-10-22

申请号：US13371430

申请日：2012-02-11

申请人： Peter Alfred Gruber ,  Paul Alfred Lauro ,  Jae-Woong Nah

发明人： Peter Alfred Gruber ,  Paul Alfred Lauro ,  Jae-Woong Nah

IPC分类号： B23K31/02

CPC分类号： B22D29/02 ,  B22C9/061 ,  B22D21/027 ,  B22D23/00 ,  B22D25/02

摘要： A process and tools for forming and/or releasing metal preforms, metal shapes and solder balls is described incorporating flexible molds or sheets, injection molded metal such as solder and in the case of solder balls, a liquid or gaseous environment to reduce or remove metal oxides prior to or during metal (solder) reflow to increase surface tension to form spherical or substantially spherical solder-balls.

摘要翻译： 描述了用于形成和/或释放金属预成型件，金属形状和焊球的工艺和工具，其包括柔性模具或片材，注射成型金属如焊料，以及在焊球的情况下，液体或气体环境以减少或去除金属 金属（焊料）回流之前或期间的氧化物，以增加表面张力以形成球形或基本上球形的焊球。

公开(公告)号：US20100025862A1

公开(公告)日：2010-02-04

申请号：US12181882

申请日：2008-07-29

申请人： Peter Alfred Gruber ,  Jae-Woong Nah

发明人： Peter Alfred Gruber ,  Jae-Woong Nah

IPC分类号： H01L23/52 ,  H01L21/00

CPC分类号： H01L23/49894 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/49811 ,  H01L23/49816 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/81192 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01055 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/00

摘要： Techniques for interconnecting an IC chip and a receiving substrate are provided. A method includes the steps of: providing the IC chip, the IC chip including at least a first connection site formed thereon; providing the receiving substrate, the receiving substrate including at least a second connection site formed thereon; forming an alloy structure on at least a portion of an upper surface of the second connection site; orienting the IC chip relative to the receiving substrate so that the at least first connection site is aligned with the alloy deposit formed on the at least second connection site; and forming an electrical connection between the first and second connection sites, the electrical connection comprising a volume of electrically conductive fusible material, wherein a majority of the volume of electrically conductive fusible material is supplied from the alloy structure.