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公开(公告)号：US20110044008A1
公开(公告)日：2011-02-24
申请号：US12543872
申请日：2009-08-19
申请人： Richard Barina , Bruce Desrosiers , Michael French , David L. Hager , Michael S. June , John Pl Scavuzzo , Scott Womble
发明人： Richard Barina , Bruce Desrosiers , Michael French , David L. Hager , Michael S. June , John Pl Scavuzzo , Scott Womble
IPC分类号： H05K7/20
CPC分类号： H01L23/4006 , H01L2023/4081 , H01L2924/0002 , H01L2924/00
摘要： Apparatus for securing or retaining a heatsink. The heatsink retention apparatus includes a heatsink module that cooperates with first and second spring loaded latches secure to a circuit board on opposing sides of a heat-generating component. The heatsink module includes a handle pivotally secured to opposing sides of the heatsink body, and bails pivotally secured to the handle. In addition, the bails extend downward to dispose a lower bail member adjacent the spring loaded latches. As the handle pivots between a first position to raise the bails and a second position to lower the bails, the bails automatically move from a locked position to an unlocked position. Each of the spring loaded latches include a hook and at least one pre-loaded spring to transfer a minimum downforce to the lower bail members when the bails are raised. Accordingly, embodiments may be operated from the top of the heatsink without the use of tools, while providing a desired downforce over a range of heatsink heights.
摘要翻译： 用于固定或保持散热器的装置。 散热器保持装置包括散热模块，该散热器模块与在发热部件的相对侧上固定到电路板的第一和第二弹簧加载闩锁配合。 散热器模块包括可枢转地固定到散热器主体的相对侧的手柄，以及枢转地固定到手柄的导轨。 此外，吊环向下延伸以配置邻近弹簧加载的闩锁的下部吊环构件。 当手柄在第一位置上升起腿部和第二个位置以降低皮条之间时，该皮带自动地从锁定位置移动到解锁位置。 每个弹簧加载的闩锁包括钩子和至少一个预加载的弹簧，用于当提升绳索时将最小的下压力传递到下部吊钩构件。 因此，实施例可以在不使用工具的情况下从散热器的顶部操作，同时在一定范围的散热器高度上提供期望的下压力。
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22.发明授权Controlling the speed of cooling fans for multiple computer systems based on altitude/fluid density measurements from a centralized sensor 有权根据集中传感器的高度/流体密度测量，控制多台计算机系统的冷却风扇的速度公开(公告)号：US07538509B1
公开(公告)日：2009-05-26
申请号：US12192983
申请日：2008-08-15
IPC分类号： H02P5/68
CPC分类号： G06F1/20 , H05K7/20836 , Y10S388/929
摘要： The present invention can include an automated method controlling the fan speed of computer system cooling fans with altitude and/or fluid density data from a centralized sensor. Such a method can utilize a centralized sensor to determine the altitude/fluid density within an enclosed area. The centralized sensor can be positioned so as to be unaffected by extraneous activities within the enclosed area. The determined altitude/fluid density can be conveyed to a computer system containing one or more cooling fans. The computer system can be located within the enclosed area. Then, the computer system can determine the need for adjusting the speed of the cooling fans based on the altitude/fluid density. When the need for adjustment exists, the speed of the cooling fans can be adjusted in accordance with the altitude/fluid density.
摘要翻译： 本发明可以包括一种自动化方法，其控制来自集中式传感器的高度和/或流体密度数据的计算机系统冷却风扇的风扇速度。 这种方法可以利用集中传感器来确定封闭区域内的高度/流体密度。 集中传感器可以定位成不受封闭区域内的外部活动的影响。 确定的高度/流体密度可被传送到包含一个或多个冷却风扇的计算机系统。 计算机系统可以位于封闭区域内。 然后，计算机系统可以根据高度/流体密度确定调整冷却风扇速度的需要。 当需要调整时，可以根据高度/流体密度来调节冷却风扇的速度。
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23.发明授权Method and structure to provide balanced mechanical loading of devices in compressively loaded environments 失效在压缩负载环境中提供均衡的机械负载装置的方法和结构公开(公告)号：US07518235B2
公开(公告)日：2009-04-14
申请号：US10906809
申请日：2005-03-08
申请人： Patrick A. Coico , David L. Edwards , Benjamin V. Fasano , Lewis S. Goldmann , Ellyn M. Ingalls , Michael S. June , Hilton T. Toy , Paul A. Zucco
发明人： Patrick A. Coico , David L. Edwards , Benjamin V. Fasano , Lewis S. Goldmann , Ellyn M. Ingalls , Michael S. June , Hilton T. Toy , Paul A. Zucco
IPC分类号： H01L23/34
CPC分类号： H01L23/4006 , H01L2023/405 , H01L2023/4062 , H01L2023/4081 , H01L2224/16 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2224/0401
摘要： An integrated circuit chip mounting structure includes a chip carrier electrically connected to a circuit board with an integrated circuit chip mounted on the chip carrier. In addition, a thermally conductive device is thermally connected to the chip and a set of compressible support members are provided to transmit a portion of an applied compressive load from the thermally conductive device to the chip and chip carrier.
摘要翻译： 集成电路芯片安装结构包括芯片载体，其电连接到具有安装在芯片载体上的集成电路芯片的电路板。 此外，导热装置热连接到芯片，并且提供一组可压缩支撑构件以将施加的压缩载荷的一部分从导热装置传递到芯片和芯片载体。
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24.发明授权Apparatus including a thermal bus on a circuit board for cooling components on a daughter card releasably attached to the circuit board 有权一种在电路板上包括热母线的设备，用于冷却可释放地附接到电路板的子卡上的组件公开(公告)号：US07106595B2
公开(公告)日：2006-09-12
申请号：US10941361
申请日：2004-09-15
IPC分类号： H05K7/20
CPC分类号： H01L23/3672 , G06F1/185 , G06F1/20 , H01L2924/0002 , H01L2924/00
摘要： A daughter card includes a number of circuit modules generating heat and a spring member transmitting the heat to a thermal bus extending along a circuit board adjacent to one side or to each side of a connector to which the daughter card is releasably attached. One or more contact surfaces of the spring member releasably contact one or more mating surfaces of a thermal bus at a side of the connector or at both sides of the connector. A heat pipe may additionally be used to direct heat from the thermal bus to a heat absorber.
摘要翻译： 子卡包括产生热量的多个电路模块和将热量传递到沿着电路板延伸的热母线的弹簧构件，所述热母线与子卡可释放地连接的连接器的一侧或每侧相邻。 弹簧构件的一个或多个接触表面可释放地接触热连接器一侧或连接器两侧的热母线的一个或多个匹配表面。 还可以使用热管将热量从热母线引导到吸热器。
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公开(公告)号：US20090116190A1
公开(公告)日：2009-05-07
申请号：US11936104
申请日：2007-11-07
IPC分类号： H05K7/20
CPC分类号： H05K7/20727 , G06F1/20
摘要： Computer chassis configured for controlled airflow including at least one component board; a segmented curtain suspended across a region of airflow in the computer chassis above the component board; and at least one component mounted on the component board displacing at least one segment of the segmented curtain creating an airflow channel under the displaced segment. Segmented curtains for controlling airflow in a computer chassis including one or more segments capable of being displaced by components mounted on a component board in the computer chassis; and one or more fasteners for suspending the segmented curtain across a region of airflow in the computer chassis. Controlling airflow in a computer chassis including inserting a component board into the computer chassis; displacing, a segment of a segmented curtain thereby creating an airflow channel; and providing airflow through the airflow channel created by the displacement of the segment of the segmented curtain.
摘要翻译： 配置用于受控气流的计算机机箱，包括至少一个组件板; 分段幕帘悬挂在组件板上方的计算机机箱中的气流区域; 以及安装在所述部件板上的至少一个部件移动所述分段幕的至少一个部分，从而在所述移位部分下面形成气流通道。 用于控制计算机机箱中的气流的分段帘幕，包括能够被安装在计算机机箱中的部件板上的部件移位的一个或多个部分; 以及一个或多个紧固件，用于将分段的帘幕悬挂在计算机机箱中的气流区域中。 控制计算机机箱中的气流，包括将组件板插入计算机机箱; 移位分段帘幕的一段，从而形成气流通道; 并且通过由分段帘幕的段的位移产生的气流通道提供气流。
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公开(公告)号：US07339793B2
公开(公告)日：2008-03-04
申请号：US11748020
申请日：2007-05-14
IPC分类号： H05K7/20
CPC分类号： H01L23/367 , G06F1/184 , G06F1/185 , G06F1/186 , G06F1/20 , H01L2924/0002 , H01L2924/00
摘要： A heat sink device for conventional memory modules, such as DIMMs, that is configured to be positioned between adjacent memory modules mounted in substantially parallel connectors on a printed circuit board. Each heat sink device includes thermally conductive first and second members configured to thermally couple with electronic components of a conventional memory module. The first and second members may be resiliently biased away from one another so that the resilient bias causes the members to abut respective electronic components when placed between adjacent memory modules. A separate wedge, or a lever-mounted wedge, may be provided for insertion between the members to urge them away from one another and into abutting relationship with electronic components on facing surfaces of the adjacent memory modules. When abutting opposing electronic components, a single heat sink device facilitates heat dissipation from both of the adjacent memory modules.
摘要翻译： 用于常规存储器模块（例如DIMM）的散热装置，其被配置为定位在安装在印刷电路板上的基本上平行的连接器中的相邻存储器模块之间。 每个散热装置包括配置成与常规存储器模块的电子部件热耦合的导热第一和第二部件。 第一和第二构件可以被弹性地偏离彼此偏离，使得当放置在相邻的存储器模块之间时，弹性偏置使得构件邻接相应的电子部件。 可以提供单独的楔形物或杠杆安装的楔形物，用于插入在构件之间以将它们彼此远离并且与邻近的存储器模块的相对表面上的电子部件邻接。 当抵靠相对的电子部件时，单个散热器件便于从两个相邻的存储器模块散热。
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