公开(公告)号：US10405466B1

公开(公告)日：2019-09-03

申请号：US16008311

申请日：2018-06-14

Applicant: Ford Global Technologies, LLC

Inventor： Akash Changarankumarath Pradeepkumar ,  Alfredo R. Munoz ,  Michael W. Degner ,  Edward Chan-Jiun Jih ,  Guangyin Lei

IPC: H05K7/20 ,  H01L23/473 ,  H02M7/00 ,  B60K6/405 ,  B60L15/00 ,  B60L50/50

Abstract: According to one embodiment, a power-module assembly includes a power-module stack having coolant chambers interleaved with power modules and supply and return manifold channels extending axially along the stack. An endcap has a major side defining recessed inlet and outlet manifold cavities aligned with the channels and inlet and outlet ports disposed on one or more minor sides that are perpendicular to the major side.