-
21.发明授权公开(公告)号：US08020390B2
公开(公告)日：2011-09-20
申请号：US12479798
申请日：2009-06-06
IPC分类号： F25B1/00
CPC分类号： F25B25/00 , F25B27/007 , F25B2400/24 , F25D16/00 , H05K7/20745
摘要： Energy-efficient data center cooling techniques that utilize free cooling and/or solar cooling are provided. In one aspect, a cooling system is provided including a cooling tower; one or more modular refrigeration chiller units; and a water loop that can be selectively directed through the cooling tower, through one or more of the modular refrigeration chiller units or through a combination thereof. Another cooling system is provided including a solar cooling unit; one or more modular refrigeration chiller units; and a water loop that can be selectively directed through the solar cooling unit, through one or more of the modular refrigeration chiller units or through a combination thereof.
摘要翻译： 提供了利用免费冷却和/或太阳能冷却的节能数据中心冷却技术。 一方面，提供一种包括冷却塔的冷却系统; 一个或多个模块式冷冻机组; 以及可以选择性地通过冷却塔引导通过一个或多个模块式制冷机组或通过其组合的水回路。 提供另一个冷却系统，包括太阳能冷却单元; 一个或多个模块式冷冻机组; 以及可以选择性地通过太阳能冷却单元，通过一个或多个模块式冷冻机组或通过其组合引导的水回路。
-
22.发明申请公开(公告)号：US20090326879A1
公开(公告)日：2009-12-31
申请号：US12146852
申请日：2008-06-26
CPC分类号： G06F1/206 , G06F17/5004 , G06F2217/80 , H05K7/20836 , Y02D10/16
摘要： Techniques for modeling a data center are provided. In one aspect, a method for modeling a data center is provided. The method comprises the following steps. Spatially dense three-dimensional thermal distribution and air flow measurements made in the data center using a mobile off-line surveying system are obtained. A temperature and air flow model for the data center is created using the spatially dense three-dimensional thermal distribution and air flow measurements. The temperature and air flow model is used to make thermal distribution and air flow predictions of the data center. The thermal distribution and air flow predictions are compared with the thermal distribution and air flow measurements made using the mobile off-line surveying system to produce a validated model for the data center.
摘要翻译： 提供了数据中心建模技术。 在一方面，提供了一种用于建模数据中心的方法。 该方法包括以下步骤。 获得了使用移动离线测量系统在数据中心进行的空间密集三维热分布和气流测量。 使用空间密集的三维热分布和空气流量测量，创建数据中心的温度和气流模型。 温度和气流模型用于对数据中心进行热分布和气流预测。 将热分布和气流预测与使用移动离线测量系统进行的热分布和气流测量进行比较，以生成数据中心的验证模型。
-
公开(公告)号：US20080288193A1
公开(公告)日：2008-11-20
申请号：US11750325
申请日：2007-05-17
申请人： Alan Claassen , Hendrik F. Hamann , Madhusudan K. Iyengar , Martin Patrick O'Boyle , Michael Alan Schappert , Theodore Gerard van Kessel
发明人： Alan Claassen , Hendrik F. Hamann , Madhusudan K. Iyengar , Martin Patrick O'Boyle , Michael Alan Schappert , Theodore Gerard van Kessel
IPC分类号： G01R21/00
CPC分类号： H05K7/20836
摘要： Techniques for improving on data center best practices are provided. In one aspect, an exemplary methodology for analyzing energy efficiency of a data center having a raised-floor cooling system with at least one air conditioning unit is provided. The method comprises the following steps. An initial assessment is made of the energy efficiency of the data center based on one or more power consumption parameters of the data center. Physical parameter data obtained from one or more positions in the data center are compiled into one or more metrics, if the initial assessment indicates that the data center is energy inefficient. Recommendations are made to increase the energy efficiency of the data center based on one or more of the metrics.
摘要翻译： 提供了改进数据中心最佳做法的技术。 一方面，提供了一种用于分析具有至少一个空调单元的具有高架地板冷却系统的数据中心的能量效率的示例性方法。 该方法包括以下步骤。 基于数据中心的一个或多个功耗参数，初步评估数据中心的能效。 如果初始评估指示数据中心是无效率的，则从数据中心中的一个或多个位置获取的物理参数数据被编译为一个或多个度量。 根据一个或多个指标，提出了提高数据中心能效的建议。
-
24.发明申请公开(公告)号：US20100307171A1
公开(公告)日：2010-12-09
申请号：US12479798
申请日：2009-06-06
CPC分类号： F25B25/00 , F25B27/007 , F25B2400/24 , F25D16/00 , H05K7/20745
摘要： Energy-efficient data center cooling techniques that utilize free cooling and/or solar cooling are provided. In one aspect, a cooling system is provided including a cooling tower; one or more modular refrigeration chiller units; and a water loop that can be selectively directed through the cooling tower, through one or more of the modular refrigeration chiller units or through a combination thereof. Another cooling system is provided including a solar cooling unit; one or more modular refrigeration chiller units; and a water loop that can be selectively directed through the solar cooling unit, through one or more of the modular refrigeration chiller units or through a combination thereof.
摘要翻译： 提供了利用免费冷却和/或太阳能冷却的节能数据中心冷却技术。 一方面，提供一种包括冷却塔的冷却系统; 一个或多个模块式冷冻机组; 以及可以选择性地通过冷却塔引导通过一个或多个模块式制冷机组或通过其组合的水回路。 提供另一个冷却系统，包括太阳能冷却单元; 一个或多个模块式冷冻机组; 以及可以选择性地通过太阳能冷却单元，通过一个或多个模块式冷冻机组或通过其组合引导的水回路。
-
公开(公告)号：US09043035B2
公开(公告)日：2015-05-26
申请号：US13305967
申请日：2011-11-29
申请人： Timothy J. Chainer , Milnes P. David , Madhusudan K. Iyengar , Pritish R. Parida , Roger R. Schmidt , Mark D. Schultz
发明人： Timothy J. Chainer , Milnes P. David , Madhusudan K. Iyengar , Pritish R. Parida , Roger R. Schmidt , Mark D. Schultz
CPC分类号： G05D7/0635 , G06F1/20 , G06F1/206 , G06F1/3206 , G11B33/144 , H05K7/20281 , H05K7/20781 , H05K7/2079 , H05K7/20836 , Y02D10/16
摘要： Cooling apparatuses and methods are provided which include one or more coolant-cooled structures associated with an electronics rack, a coolant loop coupled in fluid communication with one or more passages of the coolant-cooled structure(s), one or more heat exchange units coupled to facilitate heat transfer from coolant within the coolant loop, and N controllable components associated with the coolant loop or the heat exchange unit(s), wherein N≧1. The N controllable components facilitate circulation of coolant through the coolant loop or transfer of heat from the coolant via the heat exchange unit(s). A controller is coupled to the N controllable components, and dynamically adjusts operation of the N controllable components, based on Z input parameters and one or more specified constraints, to provide a specified cooling to the coolant-cooled structure(s), while limiting energy consumed by the N controllable components, wherein Z≧1.
摘要翻译： 提供了冷却装置和方法，其包括与电子机架相关联的一个或多个冷却剂冷却结构，与冷却剂冷却结构的一个或多个通道流体连通的冷却剂回路，一个或多个热交换单元 以促进从冷却剂回路内的冷却剂的热传递，以及与冷却剂回路或热交换单元相关联的N个可控部件，其中N≥1。 N个可控部件促使冷却剂循环通过冷却剂回路或通过热交换单元从冷却剂传递热量。 控制器耦合到N个可控组件，并且基于Z输入参数和一个或多个指定的约束来动态调整N个可控组件的操作，以向冷却剂冷却的结构提供特定的冷却，同时限制能量 由N个可控部件消耗，其中Z≥1。
-
26.发明授权Thermal transfer structures coupling electronics card(s) to coolant-cooled structure(s) 有权将电子卡耦合到冷却剂冷却结构的热转印结构公开(公告)号：US08913384B2
公开(公告)日：2014-12-16
申请号：US13527947
申请日：2012-06-20
申请人： Milnes P. David , David P. Graybill , Madhusudan K. Iyengar , Vinod Kamath , Bejoy J. Kochuparambil , Pritish R. Parida , Roger R. Schmidt , Mark E. Steinke
发明人： Milnes P. David , David P. Graybill , Madhusudan K. Iyengar , Vinod Kamath , Bejoy J. Kochuparambil , Pritish R. Parida , Roger R. Schmidt , Mark E. Steinke
CPC分类号： H05K7/20745 , H05K7/2079 , H05K13/00
摘要： Cooling apparatuses and coolant-cooled electronic systems are provided which include thermal transfer structures configured to engage with a spring force one or more electronics cards with docking of the electronics card(s) within a respective socket(s) of the electronic system. A thermal transfer structure of the cooling apparatus includes a thermal spreader having a first thermal conduction surface, and a thermally conductive spring assembly coupled to the conduction surface of the thermal spreader and positioned and configured to reside between and physically couple a first surface of an electronics card to the first surface of the thermal spreader with docking of the electronics card within a socket of the electronic system. The thermal transfer structure is, in one embodiment, metallurgically bonded to a coolant-cooled structure and facilitates transfer of heat from the electronics card to coolant flowing through the coolant-cooled structure.
摘要翻译： 提供冷却装置和冷却剂冷却的电子系统，其包括热传递结构，其被配置成与弹簧力接合一个或多个电子卡，其中电子卡在电子系统的相应插座内对接。 冷却装置的热传递结构包括具有第一热传导表面的散热器和耦合到散热器的导电表面的导热弹簧组件，并被定位和配置成驻留在物理上耦合电子器件的第一表面 卡到散热器的第一表面，使电子卡在电子系统的插座内对接。 在一个实施例中，热传递结构是冶金结合到冷却剂冷却结构，并且有助于将热量从电子卡传递到流过冷却剂冷却结构的冷却剂。
-
公开(公告)号：US08880225B2
公开(公告)日：2014-11-04
申请号：US13276247
申请日：2011-10-18
CPC分类号： H05K7/20836 , G05D23/1932
摘要： A method, system, and computer program product for controlling data center cooling. In an example embodiment the method includes calculating, using a processor, an over-provisioning factor, where the over-provisioning factor is a function of a ratio of a rated cooling power to a calculated cooling power of a set of cooling units, the set of cooing units comprising at least one cooling unit. The method proceeds by adjusting the data-center cooling until the over-provisioning factor is substantially equal to a target over-provisioning factor.
摘要翻译： 一种用于控制数据中心冷却的方法，系统和计算机程序产品。 在示例实施例中，该方法包括使用处理器计算过度供应因子，其中过度供应因子是额定冷却功率与一组冷却单元的计算的冷却功率的比率的函数，该组 包括至少一个冷却单元的冷却单元。 该方法通过调整数据中心冷却来进行，直到过度供应因子基本上等于目标过度供应因子。
-
公开(公告)号：US20140071626A1
公开(公告)日：2014-03-13
申请号：US13613753
申请日：2012-09-13
申请人： Levi A. Campbell , Richard C. Chu , Milnes P. David , Michael J. Ellsworth, JR. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Milnes P. David , Michael J. Ellsworth, JR. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
CPC分类号： H05K7/20309 , B23P15/26 , F28D9/0025 , F28D15/02 , F28F3/046 , F28F3/12 , F28F9/02 , H05K7/203 , H05K7/20809 , Y10T29/4935 , Y10T29/49359 , Y10T29/49396
摘要： A vapor condenser is provided which includes a three-dimensional folded structure which defines, at least in part, a set of coolant-carrying channels and a set of vapor condensing channels, with the coolant-carrying channels being interleaved with and extending parallel to the vapor condensing channels. The folded structure includes a thermally conductive sheet with multiple folds in the sheet. One side of the sheet is a vapor condensing surface, and the opposite side of the sheet is a coolant-cooled surface, with at least a portion of the coolant-cooled surface defining the coolant-carrying channels, and being in contact with coolant within the coolant-carrying channels. The vapor condenser further includes, in one embodiment, a top plate, and first and second end manifolds which are coupled to opposite ends of the folded structure and in fluid communication with the coolant-carrying channels to facilitate flow of coolant through the coolant-carrying channels.
摘要翻译： 提供了一种蒸汽冷凝器，其包括三维折叠结构，其至少部分地限定一组冷却剂传送通道和一组蒸气冷凝通道，其中冷却剂传送通道与 蒸汽冷凝通道。 折叠结构包括在片材中具有多个折叠的导热片。 片材的一侧是蒸汽冷凝表面，并且片材的相对侧是冷却剂冷却的表面，冷却剂冷却表面的至少一部分限定了冷却剂传送通道，并与冷却剂内部的冷却剂接触 冷却液承载通道。 蒸气冷凝器在一个实施例中还包括顶板，以及第一和第二端部歧管，其连接到折叠结构的相对端并与冷却剂承载通道流体连通以便于冷却剂流过冷却剂携带 频道
-
公开(公告)号：US20130000736A1
公开(公告)日：2013-01-03
申请号：US13172765
申请日：2011-06-29
申请人： Patrick A. Coico , David P. Graybill , Allan R. Hoeft , Madhusudan K. Iyengar , Roger R. Schmidt , Gerard V. Weber, JR.
发明人： Patrick A. Coico , David P. Graybill , Allan R. Hoeft , Madhusudan K. Iyengar , Roger R. Schmidt , Gerard V. Weber, JR.
IPC分类号： F17D3/00
CPC分类号： H05K7/20836 , F17D3/00 , H05K7/20 , H05K7/20181 , H05K7/20745 , Y10T137/0324 , Y10T137/6851
摘要： An air flow control assembly, system, and method for controlling air flow to a server rack. An example air flow control assembly includes a retractable barrier configured to block the air flow, at least partially, from passing through a perforated floor tile to the server rack. The air flow control assembly also includes a barrier mount configured to secure the retractable barrier proximate the perforated floor tile.
摘要翻译： 用于控制到服务器机架的空气流的气流控制组件，系统和方法。 示例性空气流量控制组件包括可缩回屏障，所述可伸缩屏障被配置为阻挡空气流，至少部分地阻止穿过穿孔的地板砖到服务器机架。 空气流量控制组件还包括被配置为将可伸缩的屏障固定在穿孔地板砖附近的阻挡安装座。
-
30.发明授权公开(公告)号：US07978473B2
公开(公告)日：2011-07-12
申请号：US12706912
申请日：2010-02-17
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Bruce K. Furman , Madhusudan K. Iyengar , Paul A. Lauro , Roger R. Schmidt , Da-Yuan Shih , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Bruce K. Furman , Madhusudan K. Iyengar , Paul A. Lauro , Roger R. Schmidt , Da-Yuan Shih , Robert E. Simons
CPC分类号： H01L23/4735 , H01L23/473 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/00
摘要： A cooling apparatus and method of fabrication are provided for facilitating removal of heat from a heat-generating electronic device. The method of fabrication includes: obtaining a solder material; disposing the solder material on a surface to be cooled; and reflowing and shaping the solder material disposed on the surface to be cooled to configure the solder material as a base with a plurality of fins extending therefrom. In addition to being in situ-configured on the surface to be cooled, the base is simultaneously metallurgically bonded to the surface to be cooled. The solder material, configured as the base with a plurality of fins extending therefrom, is a single, monolithic structure thermally attached to the surface to be cooled via the metallurgical bonding thereof to the surface to be cooled.
摘要翻译： 提供冷却装置和制造方法以便于从发热电子装置中除去热量。 制造方法包括：获得焊料材料; 将焊料材料设置在要冷却的表面上; 回流和成形设置在待冷却表面上的焊料材料，以将焊料材料构成为具有从其延伸的多个翅片的基底。 除了在待冷却的表面上原位配置，基底同时冶金结合到待冷却的表面上。 构造为具有从其延伸的多个翅片的基底的焊料材料是通过其被冶金结合到要冷却的表面热连接到要冷却的表面的单个整体结构。
-
-
-
-
-
-
-
-
-
搜索结果
232 条记录 (耗时 0.031 秒)