公开(公告)号：US20130253852A1

公开(公告)日：2013-09-26

申请号：US13990024

申请日：2011-12-09

申请人： Toru Okada ,  Takayuki Fukuda

发明人： Toru Okada ,  Takayuki Fukuda

IPC分类号： G01L25/00

CPC分类号： G01L25/003 ,  G01M17/02 ,  G01M17/021

摘要： A crosstalk correction coefficient of a multi component force detector provided in a rolling resistance testing machine is calibrated. A method of calibrating a multi component force detector provided in a rolling resistance testing machine including a spindle shaft to which a tire is attached, a running drum with a simulation road surface on which the tire is pressed, and a rotation torque meter provided in a rotation shaft of the running drum; in which, in performing a process of calculating a force acting on the tire from a measurement value of the multi component force detector by using a crosstalk correction coefficient that corrects an influence of crosstalk occurring in the multi component force detector, the crosstalk correction coefficient is calibrated by using a rolling test data including a rotation torque measured by the rotation torque meter and a force measured by the multi component force detector.

摘要翻译： 在滚动阻力测试机中设置的多分力检测器的串扰校正系数被校准。 一种校准设置在滚动阻力试验机中的多分力测力机的方法，所述滚动阻力试验机包括安装有轮胎的主轴，具有轮胎压靠在其上的模拟路面的行驶滚筒， 运行滚筒的旋转轴; 其中，在通过使用校正多分力检测器中发生的串扰的影响的串扰校正系数执行从多分力检测器的测量值计算作用在轮胎上的力的处理时，串扰校正系数为 通过使用包括由旋转扭矩计测量的旋转扭矩和由多分力检测器测量的力的滚动测试数据进行校准。

公开(公告)号：US08434670B2

公开(公告)日：2013-05-07

申请号：US12485642

申请日：2009-06-16

申请人： Toru Okada ,  Satoshi Emoto

发明人： Toru Okada ,  Satoshi Emoto

IPC分类号： B23K3/00 ,  B23K3/04 ,  B23K1/00 ,  B23K1/018

CPC分类号： H05K3/3494 ,  B23K1/012 ,  B23K3/04 ,  H05K3/225 ,  H05K2201/10371 ,  H05K2203/081

摘要： A repair apparatus includes a heating head device configured to heat a soldering member, which is soldered to a circuit board. The heating head device includes a heating head and a contact member heated by the heating head. The contact member is formed of a material having a spring characteristic and a thermal conductivity higher than a thermal conductivity of the heating head. The contact member is configured to be brought into contact with a soldered surface of the soldering member with an elastic force so as to melt a solder joining the soldering member to the circuit board.

摘要翻译： 修理装置包括加热头装置，其被配置为加热焊接到电路板的焊接部件。 加热头装置包括加热头和由加热头加热的接触构件。 接触构件由具有比加热头的热导率高的弹簧特性和导热性的材料形成。 接触构件被配置成以弹性力与焊接构件的焊接表面接触，以便熔化将焊接构件接合到电路板的焊料。

公开(公告)号：US20120060356A1

公开(公告)日：2012-03-15

申请号：US13225902

申请日：2011-09-06

申请人： Tohru Harada ,  Mitsuo Takeuchi ,  Hirokazu Yamanishi ,  Yoshiaki Yanagida ,  Toru Okada

发明人： Tohru Harada ,  Mitsuo Takeuchi ,  Hirokazu Yamanishi ,  Yoshiaki Yanagida ,  Toru Okada

IPC分类号： G01R31/28 ,  B23P21/00

CPC分类号： H05K13/0486 ,  H01L24/75 ,  H01L24/81 ,  Y10T29/49004 ,  Y10T29/53022

摘要： An apparatus for mounting an electronic component includes a heating head that moves relative to the electronic component placed on a printed board, inclines according to the inclination of the electronic component, comes into contact with the electronic component, and heats a joining material that joins the printed board and the electronic component; a first sensor that measures the position and the inclination of the heating head; a second sensor that measures the position and the inclination of the printed board; and, a control unit that calculates the position and the inclination of the electronic component based on a measurement result of the first sensor in a state where the heating head is in contact with the electronic component, and determines the melted state of the joining material based on the measurement result of the second sensor and the position and the inclination of the electronic component.

摘要翻译： 一种用于安装电子部件的装置包括：相对于放置在印刷电路板上的电子部件移动的加热头，根据电子部件的倾斜倾斜与电子部件接触，并加热连接到电子部件的接合材料 印刷电路板和电子元器件; 测量加热头的位置和倾斜度的第一传感器; 测量印刷板的位置和倾斜度的第二传感器; 以及控制单元，其基于在所述加热头与所述电子部件接触的状态下的所述第一传感器的测量结果来计算所述电子部件的位置和倾斜度，并且基于所述接合材料的熔融状态来确定 关于第二传感器的测量结果以及电子部件的位置和倾斜度。

公开(公告)号：US08089562B2

公开(公告)日：2012-01-03

申请号：US11642903

申请日：2006-12-20

申请人： Toru Okada ,  Hiroyuki Ebinuma

发明人： Toru Okada ,  Hiroyuki Ebinuma

IPC分类号： H04N5/18 ,  H04N5/57 ,  H04N5/16

CPC分类号： H04N5/53 ,  H04N7/015 ,  H04N21/42607

摘要： A signal processing circuit includes an auto gain control circuit and amplifies a signal with an amplification ratio determined based on a synchronous signal level having a positive potential with respect to a black level included in a high definition television video signal. In consequence, during the processing of the high definition television video signal, the signal processing is performed with a desired amplification ratio.

摘要翻译： 信号处理电路包括自动增益控制电路，并且以相对于包含在高清晰度电视视频信号中的黑电平具有正电位的同步信号电平确定的放大率来放大信号。 因此，在处理高分辨率电视视频信号期间，以期望的放大率进行信号处理。

公开(公告)号：US07963434B2

公开(公告)日：2011-06-21

申请号：US12774881

申请日：2010-05-06

申请人： Keiichi Yamamoto ,  Masakazu Takesue ,  Masanao Fujii ,  Toru Okada

发明人： Keiichi Yamamoto ,  Masakazu Takesue ,  Masanao Fujii ,  Toru Okada

IPC分类号： B23K1/018

CPC分类号： H05K3/303 ,  H05K3/3494 ,  H05K13/0486 ,  H05K2203/0195 ,  H05K2203/176 ,  Y02P70/613

摘要： A method and an apparatus for removing a micro component surely and leveling solder remaining on a substrate without imposing thermal damage to solder lands, the substrate and components on the periphery. A thermosetting adhesive (15) is provided on the surface (12a) of a micro component (12) opposite to the side of a substrate (11), and the distal end of a component holding pin (13) having cross-section area falling within the surface (12a) of the micro component (12) opposite to the side of the surface (11) is passed through the thermosetting adhesive (15) to abut against the surface (12a) of the micro component (12). Subsequently, solder (16) between the micro component (12) and the substrate (11) is heated to melt and the component holding pin (13) is moved in the direction receding from the substrate (11). Consequently, the micro component (12) is removed from the substrate (11).

摘要翻译： 一种用于清除微量部件并且保持在基板上的焊料平整化的方法和装置，而不会对焊接区，基板和外围部件造成热损伤。 在与基板（11）侧相对的微型部件（12）的表面（12a）上设置有热固性粘合剂（15），并且部件保持销（13）的前端具有截面积下降 在微组件（12）的与表面（11）侧相反的表面（12a）内通过热固性粘合剂（15）以抵靠微组件（12）的表面（12a）。 随后，加热微型部件（12）和基板（11）之间的焊料（16）熔化，使部件保持销（13）从基板（11）退出的方向移动。 因此，从基板（11）移除微型部件（12）。

公开(公告)号：US07717317B2

公开(公告)日：2010-05-18

申请号：US11864600

申请日：2007-09-28

申请人： Masanao Fujii ,  Toru Okada ,  Yutaka Noda ,  Ryoji Matsuyama ,  Hidehiko Kobayashi ,  Hisao Tanaka

发明人： Masanao Fujii ,  Toru Okada ,  Yutaka Noda ,  Ryoji Matsuyama ,  Hidehiko Kobayashi ,  Hisao Tanaka

IPC分类号： B23K31/02 ,  B23K37/00

CPC分类号： H01L21/4853 ,  B23K3/0623 ,  H01L2224/11334 ,  H05K3/3478 ,  H05K2203/0195 ,  H05K2203/041 ,  H05K2203/081 ,  H05K2203/082

摘要： The present invention relates to a ball capturing apparatus and method of capturing one ball from plural balls having the same size, and to a solder ball disposing apparatus and method of disposing a solder ball containing solder in a predetermined position on a circuit board, thereby reliably capturing one ball from the plural balls having the same size. The apparatus includes: a holding member 111 including a holding wall 111a air-tightly closing a space S that holds a plurality of balls B having the same size and in which a hole 1111 larger than a size of one ball and smaller than a size of two balls is formed in an upper part of the holding wall; blowup means 112 for blowing the balls B held in the holding member 111 upward; and capturing means 12 for capturing a ball B blown up by the blowup means 112 and reached the hole.

摘要翻译： 本发明涉及一种从具有相同尺寸的多个球捕获一个球的球捕获装置和方法，以及一种焊球设置装置和将含有焊料的焊球放置在电路板上的预定位置的方法，从而可靠地 从具有相同尺寸的多个球捕获一个球。 该装置包括：保持构件111，其包括保持壁111a，气密地封闭保持具有相同尺寸的多个球B的空间S，并且其中具有比一个球的尺寸大的孔1111，并且小于 在保持壁的上部形成有两个球; 用于将保持在保持构件111中的球B向上吹的吹出装置112; 以及捕获装置12，用于捕获由喷射装置112吹起的球B并到达该孔。

公开(公告)号：US20060072040A1

公开(公告)日：2006-04-06

申请号：US11242772

申请日：2005-10-04

申请人： Ikuo Osawa ,  Yoshifumi Yoshida ,  Hiroyuki Ebinuma ,  Toru Okada

发明人： Ikuo Osawa ,  Yoshifumi Yoshida ,  Hiroyuki Ebinuma ,  Toru Okada

IPC分类号： H03M1/12

CPC分类号： H04N5/14 ,  H04N5/08 ,  H04N5/126 ,  H04N9/64

摘要： A video signal processing circuit is supplied with an analog composite video signal formed by combining at least a luminance signal with a sync signal, and processes the analog composite video signal. The video signal processing circuit has an analog filter which removes high-frequency components from the analog composite video signal, a sync separation circuit which separates a sync signal from an output signal from the analog filter, an AD converter which performs AD conversion on the analog composite video signal, and a digital video signal processing circuit which performs predetermined video signal processing on the composite video signal digitized by the AD converter, by using the sync signal obtained by the sync separation circuit.

摘要翻译： 视频信号处理电路被提供有通过将至少亮度信号与同步信号组合而形成的模拟复合视频信号，并处理模拟复合视频信号。 视频信号处理电路具有从模拟复合视频信号中去除高频分量的模拟滤波器，将同步信号与来自模拟滤波器的输出信号分离的同步分离电路，对模拟信号进行AD转换的AD转换器 复合视频信号和数字视频信号处理电路，通过使用由同步分离电路获得的同步信号，对由AD转换器数字化的复合视频信号执行预定的视频信号处理。

公开(公告)号：US20050034960A1

公开(公告)日：2005-02-17

申请号：US10804040

申请日：2004-03-19

申请人： Koichi Shimamura ,  Kazuhisa Mishima ,  Toshiaki Otsuka ,  Toru Okada ,  Masanao Fujii

发明人： Koichi Shimamura ,  Kazuhisa Mishima ,  Toshiaki Otsuka ,  Toru Okada ,  Masanao Fujii

IPC分类号： H01L21/50 ,  B65G49/02

CPC分类号： B81C3/002 ,  Y10T29/53 ,  Y10T29/53174 ,  Y10T29/534 ,  Y10T29/53417

摘要： The present invention provides an apparatus combining a high-speed high-precision characteristic equivalent to that of a die bonder and a flexibility of coping quickly with a process variation and product variation along with size reduction and economics. This apparatus comprises a base unit including a body containing a device to be used in common among a plurality of processes for mounting and assembling parts, a mechanism for conveying a workpiece in a predetermined conveying direction and a mechanism for positioning the workpiece, a dedicated unit including an end effector, and a selected mechanism unit including a mechanism for moving the end effector in two axial directions perpendicular to the predetermined conveying direction to adjust a relative position between the end effector and the workpiece or a part. The moving mechanism is interchangeably attached on the base unit, and the end effector is interchangeably attached on the moving mechanism.

摘要翻译： 本发明提供了一种结合了与模具接合机相当的高速高精度特性和快速应对的灵活性的设备，以及工艺变化和产品变化以及尺寸减小和经济性。 该装置包括：基座单元，包括：主体，其包含用于安装和组装部件的多个工艺中共同使用的装置;用于沿预定输送方向输送工件的机构和用于定位工件的机构;专用单元 包括端部执行器，以及选择的机构单元，其包括用于在垂直于预定输送方向的两个轴向方向上移动末端执行器的机构，以调节端部执行器和工件或部件之间的相对位置。 移动机构可互换地安装在基座单元上，并且端部执行器可互换地附接在移动机构上。

公开(公告)号：US06848154B2

公开(公告)日：2005-02-01

申请号：US10459955

申请日：2003-06-12

申请人： Masanao Fujii ,  Toru Okada ,  Masayuki Kitajima ,  Hidehiko Kobayashi ,  Seiichi Shimoura

发明人： Masanao Fujii ,  Toru Okada ,  Masayuki Kitajima ,  Hidehiko Kobayashi ,  Seiichi Shimoura

IPC分类号： G11B5/596 ,  G11B5/55 ,  G11B21/10 ,  G11B21/21 ,  H01L41/09 ,  H02N2/00 ,  H04R17/00

CPC分类号： G11B5/5552 ,  H01L41/0993 ,  H01L41/313 ,  Y10T29/42 ,  Y10T29/49005 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913

摘要： In a method of producing a micro-actuator, a first adhesive is applied to a movable plate, and a movable electrode is placed on the first adhesive. A second adhesive is applied to the movable electrode, and a piezoelectric element is placed on the second adhesive. Next, a third adhesive is applied to an actuator base, a base electrode is placed on the third adhesive, and the third adhesive is semi-cured in the same manner as above. A fourth adhesive is applied to the base electrode, the piezoelectric element is placed on the fourth adhesive, and the fourth adhesive is semi-cured in the same manner as above. Finally, the adhered laminate thus obtained is placed into a heating furnace and heated at a predetermined temperature for a predetermined period of time to thereby fully cure the adhesives.

摘要翻译： 在制造微致动器的方法中，将第一粘合剂施加到可动板上，将可动电极放置在第一粘合剂上。 将第二粘合剂施加到可动电极上，并将压电元件放置在第二粘合剂上。 接下来，将第三粘合剂施加到致动器基座，将基极放置在第三粘合剂上，并且以与上述相同的方式将第三粘合剂半固化。 将第四粘合剂施加到基底电极上，将压电元件放置在第四粘合剂上，并且以与上述相同的方式将第四粘合剂半固化。 最后，将如此得到的粘合层叠体放入加热炉中并在预定温度下加热预定的时间，从而使粘合剂完全固化。

公开(公告)号：US5985303A

公开(公告)日：1999-11-16

申请号：US691561

申请日：1996-08-02

申请人： Toru Okada ,  Kenji Kuranari

发明人： Toru Okada ,  Kenji Kuranari

IPC分类号： A01N47/46 ,  A01N25/10

CPC分类号： A01N47/46

摘要： The invention provides a shelf-life extender for upholding the freshness of food, such as meat, vegetables, fruits, etc., in retail packages or in a refrigerator for an extended period of time. An isothiocyanic acid compound is supported on a matrix such as a natural mucilaginous polysaccharide or a solid organic acid and the supported compound is packaged in synthetic resin film or nonwoven fabric. The invention further provides an aqueous gel composition comprising a specified surfactant, an isothiocyanic acid compound, and a gelling agent and a hydrophobic gel composition comprising a specified hydrophobic dispersion medium, an isothiocyanic acid compound, and a gelling agent.

摘要翻译： 本发明提供了一种保质期延长剂，用于在零售包装或冰箱中长期保持食物的新鲜度，例如肉类，蔬菜，水果等。 将异硫氰酸化合物负载在天然粘液多糖或固体有机酸等基质上，将负载的化合物包装在合成树脂膜或无纺布中。 本发明还提供一种含有特定表面活性剂，异硫氰酸化合物和胶凝剂的水凝胶组合物和包含特定疏水分散介质，异硫氰酸化合物和胶凝剂的疏水性凝胶组合物。