公开(公告)号：US07350685B2

公开(公告)日：2008-04-01

申请号：US11041301

申请日：2005-01-25

申请人： Takayoshi Matsumura ,  Hidehiko Kira ,  Kenji Kobae ,  Norio Kainuma

发明人： Takayoshi Matsumura ,  Hidehiko Kira ,  Kenji Kobae ,  Norio Kainuma

IPC分类号： B23K1/06

CPC分类号： H05K3/328 ,  B23K20/10 ,  B23K2101/40 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/75 ,  H01L2224/75343 ,  H01L2224/75755 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/014 ,  H05K2201/10674 ,  H05K2203/0285 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： The method is capable of securely mounting an electronic component on a circuit board by applying ultrasonic vibration. The method comprises the step of applying ultrasonic vibrations to the electronic component so as to flip-chip-bond the electronic component to the circuit board having electrodes. Portions of the circuit board, which correspond to peaks of amplitude of vibrations transmitted to the circuit board, are pressed when the ultrasonic vibrations are applied to the electronic component.

摘要翻译： 该方法能够通过施加超声波振动将电子部件牢固地安装在电路板上。 该方法包括对电子部件施加超声波振动以将电子部件倒装芯片连接到具有电极的电路板的步骤。 当将超声波振动施加到电子部件时，电路板的与发送到电路板的振动的振幅的峰值对应的部分被按压。

公开(公告)号：US20060097028A1

公开(公告)日：2006-05-11

申请号：US11062789

申请日：2005-02-23

申请人： Norio Kainuma ,  Hidehiko Kira ,  Kenji Kobae ,  Takayoshi Matsumura

发明人： Norio Kainuma ,  Hidehiko Kira ,  Kenji Kobae ,  Takayoshi Matsumura

IPC分类号： B23K1/06

CPC分类号： B23K20/10 ,  B23K2101/40 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A method of ultrasonic mounting can increase mounting efficiency by using high-frequency ultrasound and can also mount large semiconductor chips. The method ultrasonically bonds a semiconductor chip 52 to a substrate 50 using an ultrasonic mounting apparatus including a horn 15 that propagates ultrasonic vibration of an ultrasonic vibrator, the horn 15 being made of a ceramic that has a higher vibration propagation speed than metal. The method includes steps of disposing the substrate 50 on a stage 13, disposing the semiconductor chip 52 on the substrate 50, and placing the semiconductor chip 52 in contact with a convex part 15a provided on the horn 15 and applying ultrasonic vibration to bond the semiconductor chip 52 to the substrate 50.

摘要翻译： 一种超声波安装方法可以通过使用高频超声波提高安装效率，还可以安装大型半导体芯片。 该方法使用包括传播超声波振动器的超声波振动的喇叭15的超声波安装装置将半导体芯片52超声波接合到基板50，喇叭15由具有比金属更高的振动传播速度的陶瓷制成。 该方法包括以下步骤：将基板50设置在台13上，将半导体芯片52配置在基板50上，将半导体芯片52与设置在喇叭15上的凸部15a接触并施加超声波振动， 半导体芯片52到基板50。

公开(公告)号：US20060091185A1

公开(公告)日：2006-05-04

申请号：US11041301

申请日：2005-01-25

申请人： Takayoshi Matsumura ,  Hidehiko Kira ,  Kenji Kobae ,  Norio Kainuma

发明人： Takayoshi Matsumura ,  Hidehiko Kira ,  Kenji Kobae ,  Norio Kainuma

IPC分类号： B23K1/06

CPC分类号： H05K3/328 ,  B23K20/10 ,  B23K2101/40 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/75 ,  H01L2224/75343 ,  H01L2224/75755 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/014 ,  H05K2201/10674 ,  H05K2203/0285 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： The method is capable of securely mounting an electronic component on a circuit board by applying ultrasonic vibration. The method comprises the step of applying ultrasonic vibrations to the electronic component so as to flip-chip-bond the electronic component to the circuit board having electrodes. Portions of the circuit board, which correspond to peaks of amplitude of vibrations transmitted to the circuit board, are pressed when the ultrasonic vibrations are applied to the electronic component.

摘要翻译： 该方法能够通过施加超声波振动将电子部件牢固地安装在电路板上。 该方法包括对电子部件施加超声波振动以将电子部件倒装芯片连接到具有电极的电路板的步骤。 当将超声波振动施加到电子部件时，电路板的与发送到电路板的振动的振幅的峰值对应的部分被按压。

公开(公告)号：US20090243006A1

公开(公告)日：2009-10-01

申请号：US12402881

申请日：2009-03-12

申请人： Tetsuya TAKAHASHI ,  Kenji Kobae ,  Shuichi Takeuchi ,  Yoshiyuki Satoh ,  Hidehiko Kira ,  Takayoshi Matsumura

发明人： Tetsuya TAKAHASHI ,  Kenji Kobae ,  Shuichi Takeuchi ,  Yoshiyuki Satoh ,  Hidehiko Kira ,  Takayoshi Matsumura

IPC分类号： H01L29/84 ,  H01L23/12 ,  H01L21/50

CPC分类号： B81B3/0078 ,  B81B2201/042 ,  B81B2203/0109 ,  B81B2203/0307 ,  B81C1/00126 ,  H01L24/14 ,  H01L2224/1134 ,  H01L2224/1403 ,  H01L2224/73204 ,  H01L2924/07811 ,  H01L2924/1461 ,  H01L2924/00

摘要： According to an aspect of the invention, an electronic part includes a substrate having a first planar surface, a first bump affixed to the first planar surface of the substrate, a second bump affixed to the first planar surface of the substrate a predetermined distance from the first bump, a MEMS chip including a element, the MEMS chip coupled to the first bump and the second bump, the MEMS chip distanced from the first planar surface, an adhesive region bonding with the first bump, the substrate and the MEMS chip.

摘要翻译： 根据本发明的一个方面，电子部件包括具有第一平坦表面的基板，固定到基板的第一平面表面的第一凸起，固定到基板的第一平面表面的第二凸起，距离基板的预定距离 第一凸块，包括元件的MEMS芯片，耦合到第一凸块和第二凸块的MEMS芯片，与第一平坦表面分开的MEMS芯片，与第一凸块，基板和MEMS芯片结合的粘合区域。

公开(公告)号：US08169075B2

公开(公告)日：2012-05-01

申请号：US12402881

申请日：2009-03-12

申请人： Tetsuya Takahashi ,  Kenji Kobae ,  Shuichi Takeuchi ,  Yoshiyuki Satoh ,  Hidehiko Kira ,  Takayoshi Matsumura

发明人： Tetsuya Takahashi ,  Kenji Kobae ,  Shuichi Takeuchi ,  Yoshiyuki Satoh ,  Hidehiko Kira ,  Takayoshi Matsumura

IPC分类号： H01L29/40

CPC分类号： B81B3/0078 ,  B81B2201/042 ,  B81B2203/0109 ,  B81B2203/0307 ,  B81C1/00126 ,  H01L24/14 ,  H01L2224/1134 ,  H01L2224/1403 ,  H01L2224/73204 ,  H01L2924/07811 ,  H01L2924/1461 ,  H01L2924/00

摘要： According to an aspect of the invention, an electronic part includes a substrate having a first planar surface, a first bump affixed to the first planar surface of the substrate, a second bump affixed to the first planar surface of the substrate a predetermined distance from the first bump, a MEMS chip including a element, the MEMS chip coupled to the first bump and the second bump, the MEMS chip distanced from the first planar surface, an adhesive region bonding with the first bump, the substrate and the MEMS chip.

摘要翻译： 根据本发明的一个方面，电子部件包括具有第一平坦表面的基板，固定到基板的第一平面表面的第一凸起，固定到基板的第一平面表面的第二凸起，距离基板的预定距离 第一凸块，包括元件的MEMS芯片，耦合到第一凸块和第二凸块的MEMS芯片，与第一平坦表面分开的MEMS芯片，与第一凸块，基板和MEMS芯片结合的粘合区域。

公开(公告)号：US07581309B2

公开(公告)日：2009-09-01

申请号：US11375210

申请日：2006-03-15

申请人： Takayoshi Matsumura ,  Naoki Ishikawa ,  Hiroshi Kobayashi ,  Yasuo Moriya ,  Hidehiko Kira

发明人： Takayoshi Matsumura ,  Naoki Ishikawa ,  Hiroshi Kobayashi ,  Yasuo Moriya ,  Hidehiko Kira

IPC分类号： G11B5/48 ,  B23P11/00

CPC分类号： G11B5/4813 ,  Y10T29/49025 ,  Y10T29/49027 ,  Y10T29/49915 ,  Y10T29/49934 ,  Y10T29/49938 ,  Y10T29/53165

摘要： A method of assembling a carriage assembly is capable of suppressing deformation of spacer portions when suspensions are attached to carriage arms. The method of assembling a carriage assembly aligns fitting holes provided in front end portions of carriage arms and spacer holes provided in spacer portions of suspensions and places the suspensions onto the carriage arms, and then presses a ball with a diameter equal to or greater than an inner diameter of the spacer holes with a pressure-applying member to pass the ball through the spacer holes, thereby crimping spacer hole edge portions of the spacer portions and attaching the suspensions to the front end portions of the carriage arms. By applying ultrasonic vibration from two axial directions to the pressure-applying member, the pressure-applying member is caused to vibrate on a two-dimensional movement path on a predetermined plane and passes the ball through the spacer holes while causing the ball to rotate.

摘要翻译： 一种组装滑架组件的方法能够在将悬架连接到滑架臂时抑制间隔部分的变形。 组装滑架组件的方法将设置在滑架臂的前端部分的设置孔和设置在悬架的间隔部分中的间隔孔对准，并将悬架放置在滑架臂上，然后将直径等于或大于 具有加压构件的间隔孔的内径使球通过间隔孔，由此压接间隔件部分的间隔孔边缘部分并将悬架附接到托架臂的前端部。 通过将两个轴向的超声波振动施加到施加压力的构件，使压力施加构件在预定平面上的二维运动路径上振动，并使球通过间隔孔，同时使球旋转。

公开(公告)号：US20070186410A1

公开(公告)日：2007-08-16

申请号：US11442935

申请日：2006-05-30

申请人： Naoki Ishikawa ,  Hidehiko Kira ,  Hiroshi Kobayashi ,  Takayoshi Matsumura

发明人： Naoki Ishikawa ,  Hidehiko Kira ,  Hiroshi Kobayashi ,  Takayoshi Matsumura

IPC分类号： G11B5/48

CPC分类号： G11B5/4833 ,  Y10T29/49025 ,  Y10T29/49027 ,  Y10T29/4903 ,  Y10T29/49032

摘要： When crimping suspensions to carriage arms using a metal ball by applying ultrasonic vibration to a crimping tool, the suspensions can be crimped to the carriage arms without causing deformation to the suspensions and the like. A method of assembling a carriage assembly aligns attachment holes provided in front ends of carriage arms and crimping portions provided on suspensions to set the suspensions on the carriage arms and then presses a ball through crimping holes provided in the crimping portions while applying ultrasonic vibration to the crimping tool to crimp the suspensions to the carriage arms. When doing so, a ball, such as a ball whose surface has been subjected to a dimpling process, for which a load that acts on the ball when the ball passes through the crimping holes is low compared to a spherical ball is used to crimp the suspensions to the carriage arms.

摘要翻译： 当通过对压接工具施加超声波振动将金属球通过金属球压接到支架臂上时，可以将悬架卷曲到托架臂而不会使悬架等变形。 组装滑架组件的方法将设置在滑架臂的前端的设置孔和设置在悬架上的压接部对准，以将悬架设置在滑架臂上，然后通过设置在压接部分中的压接孔将球压入同时向超声波振动施加超声波振动 压接工具将悬架压接到托架臂上。 当这样做时，使用诸如球表面已经进行了凹坑处理的球，当球通过压接孔时作用在球上的负载与球形球相比较低， 悬挂在托架臂上。

公开(公告)号：US20070126104A1

公开(公告)日：2007-06-07

申请号：US11363199

申请日：2006-02-28

申请人： Takayoshi Matsumura ,  Naoki Ishikawa ,  Hiroshi Kobayashi ,  Hidehiko Kira

发明人： Takayoshi Matsumura ,  Naoki Ishikawa ,  Hiroshi Kobayashi ,  Hidehiko Kira

IPC分类号： H01L23/02

CPC分类号： G11B5/5569 ,  Y10T29/49025 ,  Y10T29/49027 ,  Y10T29/4903 ,  Y10T29/49032

摘要： A method of assembling a carriage assembly and an assembling apparatus that uses the same are capable of suppressing fluctuation in the crimped (deformed) states of spacer portions when suspensions are attached to carriage arms. The method of assembling a carriage assembly aligns fitting holes 10a provided in carriage arms 10 with spacer holes 12b of suspensions 12 and then passes a ball 20 with a diameter equal to or greater than an inner diameter of the spacer holes 12b through the spacer holes 12b to crimp edge portions of the spacer holes 12b in spacer portions 12a and thereby attach the suspensions 12 to the carriage arms 10. While the ball 20 is being pressed and sandwiched from both sides of the spacer holes 12b by two pressure-applying members 40a, 40b and ultrasonic vibration is applied to the two pressure-applying members 40a, 40b, the two pressure applying members 40a, 40b are moved so as to pass the ball 20 through the spacer holes 12b.

摘要翻译： 组装滑架组件的方法和使用该组件的组装装置能够抑制当悬架被附接到滑架臂时间隔部分的卷曲（变形）状态的波动。 组装滑架组件的方法将设置在托架臂10中的装配孔10a与悬架12的间隔孔12b对齐，然后将直径等于或大于间隔孔12b的内径的球20通过 间隔孔12b将间隔孔12b的边缘部分压接在间隔部分12a中，从而将悬架12附接到托架臂10上。 当通过两个压力施加构件40a，40b将两个压力施加构件40a和40b以及超声波振动施加到两个压力施加构件40a，40b上时，球20被压制并夹在间隔孔12b的两侧， 移动施加构件40a，40b以使球20穿过间隔孔12b。

公开(公告)号：US07506427B2

公开(公告)日：2009-03-24

申请号：US11363199

申请日：2006-02-28

申请人： Takayoshi Matsumura ,  Naoki Ishikawa ,  Hiroshi Kobayashi ,  Hidehiko Kira

发明人： Takayoshi Matsumura ,  Naoki Ishikawa ,  Hiroshi Kobayashi ,  Hidehiko Kira

IPC分类号： G11B5/127 ,  H04R31/00

CPC分类号： G11B5/5569 ,  Y10T29/49025 ,  Y10T29/49027 ,  Y10T29/4903 ,  Y10T29/49032

摘要： A method of assembling a carriage assembly is disclosed. The method is are capable of suppressing fluctuation in the crimped (deformed) states of spacer portions when suspensions are attached to carriage arms. The method aligns fitting holes 10a provided in carriage arms 10 with spacer holes 12b of suspensions 12. Then the method passes a ball 20 with a diameter equal to or greater than an inner diameter of the spacer holes 12b through the spacer holes 12b to crimp edge portions of the spacer holes 12b in spacer portions 12a and thereby attach the suspensions 12 to the carriage arms 10. While the ball 20 is being pressed and sandwiched from both sides of the spacer holes 12b by two pressure-applying members 40a, 40b an ultrasonic vibration is applied to the two pressure-applying members 40a, 40b, the two pressure applying members 40a, 40b are moved so as to pass the ball 20 through the spacer holes 12b.

摘要翻译： 公开了一种组装滑架组件的方法。 该方法能够抑制当悬架附接到托架臂时间隔部分的卷曲（变形）状态的波动。 该方法将设置在托架臂10中的装配孔10a与悬架12的间隔孔12b对准。然后，该方法将直径等于或大于间隔孔12b的内径的球20通过间隔孔12b传递到卷边 隔离部分12a中的间隔孔12b的部分，从而将悬架12附接到托架臂10.当通过两个加压构件40a，40b将球20挤压并夹在隔离孔12b的两侧时，超声波 对两个施压部件40a，40b施加振动，使两个加压部件40a，40b移动，使球20通过间隔孔12b。

公开(公告)号：US20070119045A1

公开(公告)日：2007-05-31

申请号：US11375210

申请日：2006-03-15

申请人： Takayoshi Matsumura ,  Naoki Ishikawa ,  Hiroshi Kobayashi ,  Yasuo Moriya ,  Hidehiko Kira

发明人： Takayoshi Matsumura ,  Naoki Ishikawa ,  Hiroshi Kobayashi ,  Yasuo Moriya ,  Hidehiko Kira

IPC分类号： G11B5/48 ,  G11B21/16 ,  G11B5/127 ,  B23P19/00 ,  G11C5/12

CPC分类号： G11B5/4813 ,  Y10T29/49025 ,  Y10T29/49027 ,  Y10T29/49915 ,  Y10T29/49934 ,  Y10T29/49938 ,  Y10T29/53165

摘要： A method of assembling a carriage assembly is capable of suppressing deformation of spacer portions when suspensions are attached to carriage arms. The method of assembling a carriage assembly aligns fitting holes provided in front end portions of carriage arms and spacer holes provided in spacer portions of suspensions and places the suspensions onto the carriage arms, and then presses a ball with a diameter equal to or greater than an inner diameter of the spacer holes with a pressure-applying member to pass the ball through the spacer holes, thereby crimping spacer hole edge portions of the spacer portions and attaching the suspensions to the front end portions of the carriage arms. By applying ultrasonic vibration from two axial directions to the pressure applying member, the pressure applying member is caused to vibrate on a two dimensional movement path on a predetermined plane and passes the ball through the spacer holes while causing the ball to rotate.

摘要翻译： 一种组装滑架组件的方法能够在将悬架连接到滑架臂时抑制间隔部分的变形。 组装滑架组件的方法将设置在滑架臂的前端部分的设置孔和设置在悬架的间隔部分中的间隔孔对准，并将悬架放置在滑架臂上，然后将直径等于或大于 具有加压构件的间隔孔的内径使球通过间隔孔，由此压接间隔件部分的间隔孔边缘部分并将悬架附接到托架臂的前端部。 通过将两个轴向的超声波振动施加到压力施加构件，使压力施加构件在预定平面上的二维运动路径上振动，并使球通过间隔孔，同时使球旋转。