公开(公告)号：US09435967B2

公开(公告)日：2016-09-06

申请号：US14993049

申请日：2016-01-11

Applicant: INTEL CORPORATION

Inventor： Henning Braunisch ,  Shawna M. Liff ,  Peter L. Chang

IPC: G02B6/12 ,  G02B6/42

CPC classification number: G02B6/4261 ,  G02B6/12 ,  G02B6/4201 ,  G02B6/4239 ,  G02B6/4246 ,  G02B6/4256 ,  G02B6/4257 ,  G02B6/4269 ,  G02B6/4278 ,  G02B6/4292 ,  G02B6/46 ,  Y10T29/49128

Abstract: Embodiments of the present disclosure provide optical connection techniques and configurations. In one embodiment, an apparatus includes a receptacle for mounting on a surface of a package substrate, the receptacle having a pluggable surface to receive an optical coupler plug such that the optical coupler plug is optically aligned with one or more optical apertures of an optoelectronic assembly that is configured to emit and/or receive light using the one or more optical apertures in a direction that is substantially perpendicular to the surface of the package substrate when the optoelectronic assembly is affixed to the package substrate. Other embodiments may be described and/or claimed.

Abstract translation: 本公开的实施例提供光学连接技术和配置。 在一个实施例中，一种装置包括用于安装在封装基板的表面上的插座，该插座具有可插接表面以接收光耦合器插头，使得光耦合器插头与光电组件的一个或多个光学孔径光学对准 其被配置为当所述光电组件固定到所述封装衬底时，使用所述一个或多个光学孔在基本上垂直于所述封装衬底的表面的方向上发射和/或接收光。 可以描述和/或要求保护其他实施例。

公开(公告)号：US20160124166A1

公开(公告)日：2016-05-05

申请号：US14993049

申请日：2016-01-11

Applicant: INTEL CORPORATION

Inventor： Henning Braunisch ,  Shawna M. Liff ,  Peter L. Chang

IPC: G02B6/42

CPC classification number: G02B6/4261 ,  G02B6/12 ,  G02B6/4201 ,  G02B6/4239 ,  G02B6/4246 ,  G02B6/4256 ,  G02B6/4257 ,  G02B6/4269 ,  G02B6/4278 ,  G02B6/4292 ,  G02B6/46 ,  Y10T29/49128

Abstract: Embodiments of the present disclosure provide optical connection techniques and configurations. In one embodiment, an apparatus includes a receptacle for mounting on a surface of a package substrate, the receptacle having a pluggable surface to receive an optical coupler plug such that the optical coupler plug is optically aligned with one or more optical apertures of an optoelectronic assembly that is configured to emit and/or receive light using the one or more optical apertures in a direction that is substantially perpendicular to the surface of the package substrate when the optoelectronic assembly is affixed to the package substrate. Other embodiments may be described and/or claimed.