Flexures and method for creating flexures in a wafer
    21.
    发明授权
    Flexures and method for creating flexures in a wafer 失效
    用于在晶片中产生弯曲的弯曲和方法

    公开(公告)号:US4919993A

    公开(公告)日:1990-04-24

    申请号:US317159

    申请日:1989-02-27

    Abstract: Flexures, and a method for creating flexures, for use in micromechanical sensors such as accelerometers in which a first member is pivotally connected to a second member. In one aspect, the invention provides first and second flexures connecting the first and second members, the flexures permitting rotation about a common hinge axis. The flexures have a crossed configuration that provides increased stability. Each flexure is made by etching grooves in the opposite wafer surface, the positions and depths of the grooves being selected so as to form a flexure therebetween.

    Abstract translation: 弯曲和用于产生弯曲的方法,用于微机械传感器,例如加速度计,其中第一构件枢转地连接到第二构件。 一方面,本发明提供了连接第一和第二构件的第一和第二挠曲件,该挠曲件允许围绕公共铰链轴线旋转。 弯曲具有提供更高稳定性的交叉配置。 每个挠曲通过在相对的晶片表面中蚀刻凹槽来制成,选择凹槽的位置和深度以在它们之间形成挠曲。

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