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57 条记录 (耗时 0.042 秒)

    POLISHING PAD
    21.
    发明申请
    POLISHING PAD 有权
    抛光垫

    公开(公告)号：US20090104850A1

    公开(公告)日：2009-04-23

    申请号：US12065219

    申请日：2006-08-22

    申请人： Kazuyuki Ogawa ,  Tetsuo Shimomura ,  Yoshiyuki Nakai ,  Masahiko Nakamori ,  Takatoshi Yamada

    发明人： Kazuyuki Ogawa ,  Tetsuo Shimomura ,  Yoshiyuki Nakai ,  Masahiko Nakamori ,  Takatoshi Yamada

    IPC分类号： B24B1/00 ,  B24B7/20

    CPC分类号： B24B37/24 ,  B24D3/32 ,  C08G18/36 ,  C08G2101/00 ,  Y10T428/24 ,  Y10T428/249953

    摘要： An object of the present invention is to provide a polishing pad excellent in polishing rate and superior in longevity without generating center slow. Another object of the present invention is to provide a method of manufacturing a semiconductor device with the polishing pad. Disclosed is a polishing pad having a polishing layer consisting of a polyurethane foam having fine cells, wherein a high-molecular-weight polyol component that is a starting component of the polyurethane foam contains a hydrophobic high-molecular-weight polyol A having a number-average molecular weight of 550 to 800 and a hydrophobic high-molecular-weight polyol B having a number-average molecular weight of 950 to 1300 in an A/B ratio of from 10/90 to 50/50 by weight.

    摘要翻译： 本发明的目的是提供一种抛光速度优异且寿命长的抛光垫，而不产生中心慢。 本发明的另一个目的是提供一种用抛光垫制造半导体器件的方法。 公开了一种抛光垫，其具有由具有细孔的聚氨酯泡沫构成的抛光层，其中作为聚氨酯泡沫的起始组分的高分子量多元醇成分含有数均分子量的疏水性高分子量多元醇A， 平均分子量为550〜800的疏水性高分子量多元醇B，A / B比为10/90〜50/50的数均分子量为950〜1300的疏水性高分子量多元醇B.

    Polishing pad
    22.
    发明授权
    Polishing pad 有权
    抛光垫

    公开(公告)号：US08309466B2

    公开(公告)日：2012-11-13

    申请号：US12065219

    申请日：2006-08-22

    申请人： Kazuyuki Ogawa ,  Tetsuo Shimomura ,  Yoshiyuki Nakai ,  Masahiko Nakamori ,  Takatoshi Yamada

    发明人： Kazuyuki Ogawa ,  Tetsuo Shimomura ,  Yoshiyuki Nakai ,  Masahiko Nakamori ,  Takatoshi Yamada

    IPC分类号： H01L21/302 ,  H01L21/461 ,  B32B5/00 ,  B32B3/26

    CPC分类号： B24B37/24 ,  B24D3/32 ,  C08G18/36 ,  C08G2101/00 ,  Y10T428/24 ,  Y10T428/249953

    摘要： A polishing pad has an excellent polishing rate and is superior in longevity without generating center slow. A method of manufacturing a semiconductor device with the polishing pad is also provided. The polishing pad has a polishing layer consisting of a polyurethane foam having fine cells, wherein a high-molecular-weight polyol component that is a starting component of the polyurethane foam contains a hydrophobic high-molecular-weight polyol A having a number-average molecular weight of 550 to 800 and a hydrophobic high-molecular-weight polyol B having a number-average molecular weight of 950 to 1300 in an A/B ratio of from 10/90 to 50/50 by weight.

    摘要翻译： 抛光垫具有优异的抛光速率，寿命长，不会产生中心慢。 还提供了一种制造具有抛光垫的半导体器件的方法。 抛光垫具有由具有细小细胞的聚氨酯泡沫构成的抛光层，其中作为聚氨酯泡沫的起始成分的高分子量多元醇成分含有具有数均分子量的疏水性高分子量多元醇A 重量为550〜800的疏水性高分子量多元醇B，A / B比为10/90〜50/50的数均分子量为950〜1300的疏水性高分子量多元醇B.

    Method of producing polishing pad
    27.
    发明授权
    Method of producing polishing pad 有权
    抛光垫的生产方法

    公开(公告)号：US07329170B2

    公开(公告)日：2008-02-12

    申请号：US11366238

    申请日：2006-03-02

    申请人： Koichi Ono ,  Tetsuo Shimomura ,  Masahiko Nakamori ,  Takatoshi Yamada ,  Shigeru Komai ,  Masayuki Tsutsumi

    发明人： Koichi Ono ,  Tetsuo Shimomura ,  Masahiko Nakamori ,  Takatoshi Yamada ,  Shigeru Komai ,  Masayuki Tsutsumi

    IPC分类号： B24B1/00

    CPC分类号： B24B37/26 ,  B24B37/22 ,  B24D3/28 ,  B24D11/001 ,  B24D11/008

    摘要： A method of producing a polishing pad having a polishing layer is characterized in that the polishing layer is produced by a photolithographic method including: forming a sheet molding from a curing composition containing at least an initiator and an energy ray-reactive compound to be cured with energy rays; exposing the sheet molding to energy rays to induce modification thereof, to change the solubility of the sheet molding in a solvent; and developing the sheet molding after irradiation with energy rays, to partially remove the curing composition with a solvent thereby forming a concave and convex pattern at least one surface.

    摘要翻译： 一种制造具有抛光层的抛光垫的方法的特征在于，抛光层通过光刻法制造，包括：由至少含有引发剂和能量射线反应性化合物的固化组合物形成片状模制品，以使其固化 能量射线 将片材模制物暴露于能量射线以引起其修饰，以改变片材模制品在溶剂中的溶解度; 并且在用能量射线照射之后显影片材成型体，用溶剂部分地除去固化组合物，从而在至少一个表面上形成凹凸图案。

    Method of producing polishing pad
    28.
    发明申请
    Method of producing polishing pad 有权
    抛光垫的生产方法

    公开(公告)号：US20060148392A1

    公开(公告)日：2006-07-06

    申请号：US11366238

    申请日：2006-03-02

    申请人： Koichi Ono ,  Tetsuo Shimomura ,  Masahiko Nakamori ,  Takatoshi Yamada ,  Shigeru Komai ,  Masayuki Tsutsumi

    发明人： Koichi Ono ,  Tetsuo Shimomura ,  Masahiko Nakamori ,  Takatoshi Yamada ,  Shigeru Komai ,  Masayuki Tsutsumi

    IPC分类号： B24D11/00

    CPC分类号： B24B37/26 ,  B24B37/22 ,  B24D3/28 ,  B24D11/001 ,  B24D11/008

    摘要： A method of producing a polishing pad having a polishing layer is characterized in that the polishing layer is produced by a photolithographic method including: forming a sheet molding from a curing composition containing at least an initiator and an energy ray-reactive compound to be cured with energy rays; exposing the sheet molding to energy rays to induce modification thereof, to change the solubility of the sheet molding in a solvent; and developing the sheet molding after irradiation with energy rays, to partially remove the curing composition with a solvent thereby forming a concave and convex pattern at least one surface.

    摘要翻译： 一种制造具有抛光层的抛光垫的方法的特征在于，抛光层通过光刻法制造，包括：由至少含有引发剂和能量射线反应性化合物的固化组合物形成片状模制品，以使其固化 能量射线 将片材模制物暴露于能量射线以引起其修饰，以改变片材模制品在溶剂中的溶解度; 并且在用能量射线照射之后显影片材成型体，用溶剂部分地除去固化组合物，从而在至少一个表面上形成凹凸图案。

    Polishing pad, method of producing the same, and cushion layer for polishing pad
    29.
    发明授权
    Polishing pad, method of producing the same, and cushion layer for polishing pad 有权
    抛光垫，其制造方法和抛光垫用缓冲层

    公开(公告)号：US07192340B2

    公开(公告)日：2007-03-20

    申请号：US10432410

    申请日：2001-11-28

    申请人： Koichi Ono ,  Tetsuo Shimomura ,  Masahiko Nakamori ,  Takatoshi Yamada ,  Shigeru Komai ,  Masayuki Tsutsumi

    发明人： Koichi Ono ,  Tetsuo Shimomura ,  Masahiko Nakamori ,  Takatoshi Yamada ,  Shigeru Komai ,  Masayuki Tsutsumi

    IPC分类号： B24D11/00

    CPC分类号： B24B37/26 ,  B24B37/22 ,  B24D3/28 ,  B24D11/001 ,  B24D11/008

    摘要： The polishing pad of this invention is a polishing pad effecting stable planarizing processing, at high polishing rate, materials requiring surface flatness at high level, such as a silicon wafer for semiconductor devices, a magnetic disk, an optical lens etc. This invention provides a polishing pad which can be subjected to surface processing to form a sheet or grooves, is excellent in thickness accuracy, attains a high polishing rate, achieves a uniform polishing rate, and also provides a polishing pad which is free of quality variations resulting from an individual variation, easily enables a change the surface patterns, enables fine surface pattern, is compatible with various materials to be polished, is free of burrs upon forming the pattern. This invention provides a polishing pad which can have abrasive grains mixed at very high density without using slurry, and generates few scratches by preventing aggregation of abrasive grains dispersed therein. The polishing pad of this invention has a polishing layer formed from a curing composition to be cured with energy rays, the polishing layer being formed surface pattern thereon by photolithography. The polishing pad of this invention comprises a polishing layer resin having abrasive grains dispersed therein, the resin containing ionic groups in the range of 20 to 1500 eq/ton.

    摘要翻译： 本发明的研磨垫是在高抛光速度下进行稳定的平坦化处理的抛光垫，例如需要高水平的表面平坦度的材料，例如半导体器件的硅晶片，磁盘，光学透镜等。本发明提供了一种 可进行表面处理以形成片材或沟槽的抛光垫具有优异的厚度精度，达到高抛光速率，达到均匀的抛光速率，并且还提供一种抛光垫，该抛光垫没有由个体产生的质量变化 变化，容易使表面图案发生变化，使精细表面图案与各种待抛光材料兼容，在形成图案时无毛刺。 本发明提供一种抛光垫，其可以在不使用浆料的情况下具有以非常高的密度混合的磨料颗粒，并且通过防止分散在其中的磨料颗粒的聚集而产生少量划痕。 本发明的抛光垫具有由能量射线固化的固化组合物形成的抛光层，该抛光层通过光刻形成在其上的表面图案。 本发明的抛光垫包括其中分散有磨粒的抛光层树脂，含有离子基团的树脂在20至1500eq / ton的范围内。