公开(公告)号：US07891538B2

公开(公告)日：2011-02-22

申请号：US12542800

申请日：2009-08-18

申请人： Russell A. Budd ,  Frank R. Libsch ,  Jae-Woong Nah

发明人： Russell A. Budd ,  Frank R. Libsch ,  Jae-Woong Nah

IPC分类号： B23K31/02

CPC分类号： B23K1/0016 ,  B23K3/0623 ,  B23K3/087 ,  B23K2101/40 ,  B23K2101/42 ,  H01L21/4853 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/11005 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2924/0001 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01076 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3025 ,  H05K3/3478 ,  H05K2203/0113 ,  H05K2203/0292 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K2203/0557 ,  H05K2203/105 ,  H01L2924/00 ,  H01L2224/05599

摘要： A mask having a plurality of through holes and a mold having a plurality of cavities are provided, and the through holes and the cavities are aligned. Conductive balls are dispensed into the aligned through holes and cavities. Substantially one ball is dispensed into each aligned through hole and cavity, and the mask with the holes and the cavities in the mold are configured and dimensioned such that the balls are substantially flush with, or recessed below, an outer surface of the mask. The mask is removed, the conductive balls are aligned with pads of a semiconductor device, and the conductive balls are transferred to the pads by fluxless reflow in a formic acid environment. Vibrational, electrostatic, and direct transfer aspects are also disclosed.

摘要翻译： 提供具有多个通孔的掩模和具有多个空腔的模具，并且通孔和空腔对齐。 导电球被分配到对准的通孔和空腔中。 基本上一个球被分配到每个对齐的通孔和空腔中，并且具有孔和模具中的空腔的掩模被配置和定尺寸使得球与掩模的外表面基本上齐平或凹入下方。 去除掩模，导电球与半导体器件的焊盘对准，并且通过无甲醛回流在甲酸环境中将导电球转移到焊盘。 还公开了振动，静电和直接转印方面。

公开(公告)号：US20100072263A1

公开(公告)日：2010-03-25

申请号：US12627249

申请日：2009-11-30

申请人： Peter Alfred Gruber ,  Paul Alfred Lauro ,  Jae-Woong Nah

发明人： Peter Alfred Gruber ,  Paul Alfred Lauro ,  Jae-Woong Nah

IPC分类号： B23K1/20 ,  B23K31/02

CPC分类号： B23K1/0016 ,  H01L21/4853 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/0554 ,  H01L2224/05567 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/1183 ,  H01L2224/1184 ,  H01L2224/11848 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/81192 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  Y10T428/24612 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A method for forming alloy deposits at selected areas on a receiving substrate includes the steps of: providing an alloy carrier including at least a first decal including a first plurality of openings and a second decal including a second plurality of openings, the first and second decals being arranged such that each of the first plurality of openings is in alignment with a corresponding one of the second plurality of openings; filling the first and second plurality of openings with molten alloy; cooling the molten alloy to thereby form at least first and second plugs, the first plug having a first surface and a second surface substantially parallel to one another, the second plug having a third surface and a fourth surface substantially parallel to one another; removing at least one of the first and second decals to at least partially expose the first and second plugs; aligning the alloy carrier with the receiving substrate so that the first and second plugs correspond to the selected areas on the receiving substrate; and transferring the first plug to a first of the selected areas and the second plug to a second of the selected areas.

摘要翻译： 一种用于在接收基板上的选定区域形成合金沉积物的方法，包括以下步骤：提供合金载体，该合金载体包括至少包括第一多个开口的第一贴花和包括第二多个开口的第二贴花，第一和第二贴花 被布置成使得所述第一多个开口中的每一个与所述第二多个开口中的对应的一个开口对准; 用熔融合金填充第一和第二多个开口; 冷却所述熔融合金，从而形成至少第一和第二塞子，所述第一塞子具有基本上彼此平行的第一表面和第二表面，所述第二塞子具有基本上彼此平行的第三表面和第四表面; 去除所述第一和第二贴花中的至少一个以至少部分地暴露所述第一和第二插塞; 将合金载体与接收基板对准，使得第一和第二插塞对应于接收基板上的选定区域; 以及将所述第一插头转移到所选择的区域中的第一个，并且将所述第二插头转移到所选择的区域中的第二个。

公开(公告)号：US20100028612A1

公开(公告)日：2010-02-04

申请号：US12181852

申请日：2008-07-29

申请人： Peter Alfred Gruber ,  Paul Alfred Lauro ,  Jae-Woong Nah

发明人： Peter Alfred Gruber ,  Paul Alfred Lauro ,  Jae-Woong Nah

IPC分类号： B32B3/02 ,  B23K31/02

CPC分类号： B23K1/0016 ,  H01L21/4853 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/0554 ,  H01L2224/05567 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/1183 ,  H01L2224/1184 ,  H01L2224/11848 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/81192 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  Y10T428/24612 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A method for forming alloy deposits at selected areas on a receiving substrate includes the steps of: providing an alloy carrier including at least a first decal including a first plurality of openings and a second decal including a second plurality of openings, the first and second decals being arranged such that each of the first plurality of openings is in alignment with a corresponding one of the second plurality of openings; filling the first and second plurality of openings with molten alloy; cooling the molten alloy to thereby form at least first and second plugs, the first plug having a first surface and a second surface substantially parallel to one another, the second plug having a third surface and a fourth surface substantially parallel to one another; removing at least one of the first and second decals to at least partially expose the first and second plugs; aligning the alloy carrier with the receiving substrate so that the first and second plugs correspond to the selected areas on the receiving substrate; and transferring the first plug to a first of the selected areas and the second plug to a second of the selected areas.

公开(公告)号：US20090302096A1

公开(公告)日：2009-12-10

申请号：US12542800

申请日：2009-08-18

申请人： Russell A. Budd ,  Frank R. Libsch ,  Jae-Woong Nah

发明人： Russell A. Budd ,  Frank R. Libsch ,  Jae-Woong Nah

IPC分类号： B23K1/20

CPC分类号： B23K1/0016 ,  B23K3/0623 ,  B23K3/087 ,  B23K2101/40 ,  B23K2101/42 ,  H01L21/4853 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/11005 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2924/0001 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01076 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3025 ,  H05K3/3478 ,  H05K2203/0113 ,  H05K2203/0292 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K2203/0557 ,  H05K2203/105 ,  H01L2924/00 ,  H01L2224/05599

摘要： A mask having a plurality of through holes and a mold having a plurality of cavities are provided, and the through holes and the cavities are aligned. Conductive balls are dispensed into the aligned through holes and cavities. Substantially one ball is dispensed into each aligned through hole and cavity, and the mask with the holes and the cavities in the mold are configured and dimensioned such that the balls are substantially flush with, or recessed below, an outer surface of the mask. The mask is removed, the conductive balls are aligned with pads of a semiconductor device, and the conductive balls are transferred to the pads by fluxless reflow in a formic acid environment. Vibrational, electrostatic, and direct transfer aspects are also disclosed.

摘要翻译： 提供具有多个通孔的掩模和具有多个空腔的模具，并且通孔和空腔对齐。 导电球被分配到对准的通孔和空腔中。 基本上一个球被分配到每个对齐的通孔和空腔中，并且具有孔和模具中的空腔的掩模被配置和定尺寸使得球与掩模的外表面基本上齐平或凹入下方。 去除掩模，导电球与半导体器件的焊盘对准，并且通过无甲醛回流在甲酸环境中将导电球转移到焊盘。 还公开了振动，静电和直接转印方面。

公开(公告)号：US20090197103A1

公开(公告)日：2009-08-06

申请号：US12254768

申请日：2008-10-20

申请人： Da-Yuan Shih ,  Donald W. Henderson ,  Sung K. Kang ,  Minhua Lu ,  Jae-Woong Nah ,  Kamalesh Srivastava

发明人： Da-Yuan Shih ,  Donald W. Henderson ,  Sung K. Kang ,  Minhua Lu ,  Jae-Woong Nah ,  Kamalesh Srivastava

IPC分类号： B32B15/04 ,  B23K1/20 ,  C22C13/00

CPC分类号： B23K1/0016 ,  B23K1/008 ,  B23K1/203 ,  B23K2101/42 ,  C22C13/00 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L24/94 ,  H01L2224/0346 ,  H01L2224/03464 ,  H01L2224/0381 ,  H01L2224/0401 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05613 ,  H01L2224/05618 ,  H01L2224/0562 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/11003 ,  H01L2224/1131 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/13111 ,  H01L2224/16227 ,  H01L2224/16503 ,  H01L2224/81191 ,  H01L2224/81395 ,  H01L2224/81411 ,  H01L2224/81439 ,  H01L2224/81444 ,  H01L2224/81447 ,  H01L2224/81455 ,  H01L2224/81815 ,  H01L2224/94 ,  H01L2924/14 ,  H01L2924/35121 ,  H01L2924/3656 ,  H05K3/3463 ,  Y10T428/31678 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01083 ,  H01L2924/01082 ,  H01L2924/00012 ,  H01L2224/11 ,  H01L2924/01051 ,  H01L2924/00

摘要： A solder joint comprising a solder capture pad on a substrate having a circuit; and a lead free solder selected from the group comprising Sn—Ag—Cu solder and Sn—Ag solder adhered to the solder capture pad; the solder selected from the group comprising between 0.1 to 2.0% by weight Sb or Bi, and 0.5 to 3.0% Ag. Formation of voids at an interface between the solder and the solder capture pad is suppressed, by including Zn. Interlayer dielectric delamination is suppressed, and electromigration characteristics are greatly improved. Methods for forming solder joints using the solders.

摘要翻译： 一种焊接接头，包括在具有电路的基板上的焊料捕获垫; 以及选自Sn-Ag-Cu焊料和Sn-Ag焊料的焊料的无铅焊料粘附到焊料捕获垫上; 选自包含0.1至2.0重量％的Sb或Bi和0.5至3.0％Ag的组的焊料。 焊料和焊料捕捉垫之间的界面上的空隙形成通过包含Zn而被抑制。 层间电介质分层被抑制，电迁移特性大大提高。 使用焊料形成焊点的方法。

公开(公告)号：US09273408B2

公开(公告)日：2016-03-01

申请号：US13612812

申请日：2012-09-12

申请人： Bing Dang ,  Michael A. Gaynes ,  Paul A. Lauro ,  Jae-Woong Nah

发明人： Bing Dang ,  Michael A. Gaynes ,  Paul A. Lauro ,  Jae-Woong Nah

IPC分类号： B23K1/20 ,  C25D5/02 ,  H01L21/02 ,  H01L23/00 ,  C25D7/12 ,  H05K3/34

CPC分类号： H01L24/11 ,  C25D5/022 ,  C25D7/123 ,  H01L21/02107 ,  H01L24/13 ,  H01L24/16 ,  H01L24/742 ,  H01L24/81 ,  H01L2224/11001 ,  H01L2224/11002 ,  H01L2224/11312 ,  H01L2224/1141 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/1162 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16225 ,  H01L2224/81801 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12042 ,  H05K3/3436 ,  H05K2201/10734 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01026 ,  H01L2924/00

摘要： Solder bumps are provided on round wafers through the use of injection molded solder. Copper pillars or ball limiting metallurgy are formed over I/O pads within the channels of a patterned mask layer. Solder is injected over the pillars or BLM, filling the channels. Molten solder can be injected in cavities formed in round wafers without leakage using a carrier assembly that accommodates wafers that have been previously subjected to mask layer deposition and patterning. One such carrier assembly includes an elastomeric body portion having a round recess, the walls of the recess forming a tight seal with the round wafer. Other carrier assemblies employ adhesives applied around the peripheral edges of the wafers to ensure sealing between the carrier assemblies and wafers.

摘要翻译： 通过使用注射成型焊料在圆形晶片上提供焊料凸块。 在图案化掩模层的通道内的I / O焊盘上形成铜柱或极限极限冶金。 焊料注入柱子或BLM，填充通道。 可以使用容纳预先经过掩模层沉积和图案化的晶片的载体组件将熔融的焊料注入到圆形晶片形成的空腔中而不发生泄漏。 一个这样的载体组件包括具有圆形凹部的弹性体主体部分，凹部的壁与圆形晶片形成紧密密封。 其他载体组件使用施加在晶片的周边边缘周围的粘合剂，以确保载体组件和晶片之间的密封。

公开(公告)号：US20150147846A1

公开(公告)日：2015-05-28

申请号：US14525069

申请日：2014-10-27

申请人： Claudius FEGER ,  Michael A. Gaynes ,  Jae-Woong Nah ,  Da-Yuan Shih

发明人： Claudius FEGER ,  Michael A. Gaynes ,  Jae-Woong Nah ,  Da-Yuan Shih

IPC分类号： H01L23/00 ,  H01L21/56

CPC分类号： H01L24/81 ,  H01L21/463 ,  H01L21/563 ,  H01L23/49816 ,  H01L23/544 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/743 ,  H01L24/83 ,  H01L24/92 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2223/54486 ,  H01L2224/11462 ,  H01L2224/13082 ,  H01L2224/13147 ,  H01L2224/1605 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/2741 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/8113 ,  H01L2224/81132 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/814 ,  H01L2224/81801 ,  H01L2224/81815 ,  H01L2224/83192 ,  H01L2224/83856 ,  H01L2224/9211 ,  H01L2224/94 ,  H01L2924/01029 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2224/11 ,  H01L2224/27 ,  H01L2224/81 ,  H01L2224/83

摘要： A preassembly semiconductor device comprises chip soldering structures on a semiconductor chip and substrate soldering structures on a substrate corresponding to the chip soldering structures. The substrate soldering structures extend toward the chip soldering structures for forming solder connections with the chip soldering structures. The chip and the substrate are in preassembly positions relative to one another. The height of the substrate soldering structures is greater than the height of the chip soldering structures. A pre-applied underfill is contiguous with the substrate and is sufficiently thick so as to extend substantially no further than the full height of the substrate soldering structures. In another embodiment the height of the chip soldering structures is greater than the height of the substrate soldering structures and the pre-applied underfill is contiguous with the semiconductor chip and sufficiently thick so as to extend substantially no further than the full height of the chip soldering structures. A process comprises manufacturing semiconductor assemblies from these devices by soldering the chip and the substrate to one another

摘要翻译： 预组装半导体器件包括半导体芯片上的芯片焊接结构和对应于芯片焊接结构的衬底上的衬底焊接结构。 衬底焊接结构朝着芯片焊接结构延伸，以形成与芯片焊接结构的焊接连接。 芯片和衬底相对于彼此处于预组装位置。 基板焊接结构的高度大于芯片焊接结构的高度。 预先施加的底部填充物与基底相邻并且足够厚以便基本上不超过基底焊接结构的全高度延伸。 在另一个实施例中，芯片焊接结构的高度大于衬底焊接结构的高度，并且预先施加的底部填充物与半导体芯片邻接并且足够厚以便基本上不超过芯片焊接的全部高度 结构。 一种方法包括通过将芯片和衬底彼此焊接来从这些器件制造半导体组件

公开(公告)号：US08870051B2

公开(公告)日：2014-10-28

申请号：US13463412

申请日：2012-05-03

申请人： Peter J. Brofman ,  Jae-Woong Nah ,  Katsuyuki Sakuma

发明人： Peter J. Brofman ,  Jae-Woong Nah ,  Katsuyuki Sakuma

IPC分类号： B23K37/04

CPC分类号： B23K31/02 ,  B23K1/0016 ,  B23K3/047 ,  B23K35/0222 ,  B23K37/04 ,  B23K2101/40 ,  H01L24/81 ,  H01L2924/10253 ,  H01L2924/1305 ,  H01L2924/15787 ,  H01L2924/00

摘要： A flip chip assembly apparatus includes at least one warpage-suppressor assembly. Each warpage-suppressor assembly can include a side heater, a deformable material pad, and an actuator assembly for moving the side heater and the deformable material pad. Each side heater provides additional heat to peripheral solder balls during bonding of two substrates, thereby facilitating the reflow of the peripheral solder balls. Each deformable material pad contacts, and presses down on, a surface of one of the two substrates under bonding. The deformable material pad(s) can prevent or minimize warpage of the contacted substrate.

摘要翻译： 倒装芯片组装装置包括至少一个翘曲抑制组件。 每个翘曲抑制组件可以包括侧加热器，可变形材料垫和用于移动侧加热器和可变形材料垫的致动器组件。 每个侧面加热器在两个基板的接合期间向外围焊球提供额外的热量，从而便于外围焊球的回流。 每个可变形材料焊盘在粘合下接触并压下两个基板之一的表面。 可变形材料垫可以防止或最小化接触的基底的翘曲。

公开(公告)号：US20130330880A1

公开(公告)日：2013-12-12

申请号：US13494667

申请日：2012-06-12

申请人： Bing Dang ,  Jae-Woong Nah

发明人： Bing Dang ,  Jae-Woong Nah

IPC分类号： H01L21/78

CPC分类号： H01L24/97 ,  H01L21/4853 ,  H01L23/49816 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/75315 ,  H01L2224/7598 ,  H01L2224/81005 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81815 ,  H01L2224/83104 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/0401

摘要： Solder is simultaneously transferred from a mold to a plurality of 3D assembled modules to provide solder bumps on the modules. The mold includes cavities containing injected molten solder or preformed solder balls. A fixture including resilient pressure pads and vacuum lines extending through the pads applies pressure to the modules when they are positioned on the mold. Following reflow and solder transfer to the modules, the fixture is displaced with respect to the mold. The modules, being attached to the fixture by vacuum pressure through the pads, are displaced from the mold with the fixture.

摘要翻译： 焊料同时从模具转移到多个3D组装模块，以在模块上提供焊料凸块。 模具包括注入的熔融焊料或预制焊球的腔体。 包括弹性压力垫和延伸穿过垫的真空管线的夹具在模具定位时对模块施加压力。 在回流和焊料传递到模块之后，夹具相对于模具移位。 通过真空压力通过垫连接到固定装置上的模块通过夹具从模具中移位。

公开(公告)号：US08496159B2

公开(公告)日：2013-07-30

申请号：US13154412

申请日：2011-06-06

申请人： Claudius Feger ,  Mark H. McLeod ,  Jae-Woong Nah ,  Eric D. Perfecto

发明人： Claudius Feger ,  Mark H. McLeod ,  Jae-Woong Nah ,  Eric D. Perfecto

IPC分类号： B23K3/00 ,  B23K3/06

CPC分类号： B23K1/0016 ,  B23K1/20 ,  B23K3/0623 ,  B23K2101/42 ,  H01L21/6835 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L2221/68372 ,  H01L2224/03464 ,  H01L2224/0401 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/11002 ,  H01L2224/11312 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/11849 ,  H01L2224/11902 ,  H01L2224/13023 ,  H01L2224/13082 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/1403 ,  H01L2224/14505 ,  H01L2224/16237 ,  H01L2224/94 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2224/03 ,  H01L2224/11 ,  H01L2924/00012 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01083 ,  H01L2924/01049 ,  H01L2924/01079 ,  H01L2924/00 ,  H01L2224/05552 ,  H01L2224/81805

摘要： Solder bumps of uniform height are provided on a substrate through the use of injection molded solder. Copper pillars or ball limiting metallurgy are formed over I/O pads within the channels of a patterned layer of photoresist. Solder is injected over the pillars or BLM, filling the channels. The solder, which does not contain flux, is allowed to solidify. It forms a plurality of solder structures (bumps) of equal heights. Solder injection and solidification are preferably carried out in a nitrogen environment or a forming gas environment. Molten solder can be injected in channels formed in round wafers without spillage using a carrier assembly that accommodates such wafers and a fill head.

摘要翻译： 通过使用注射成型的焊料在基板上设置均匀高度的焊料凸块。 在图案化的光致抗蚀剂层的通道内的I / O焊盘上形成铜柱或极限极限冶金。 焊料注入柱子或BLM，填充通道。 允许不含焊剂的焊料固化。 它形成相同高度的多个焊料结构（凸块）。 焊接注入和固化优选在氮气环境或形成气体环境中进行。 可以使用容纳这种晶片和填充头的载体组件将熔融焊料注入到以圆形晶片形成的通道中而不会溢出。