公开(公告)号：US20210315073A1

公开(公告)日：2021-10-07

申请号：US17011043

申请日：2020-09-03

Applicant: LG Electronics Inc.

Inventor： Chaehyun BAEK ,  Sunghun SIM ,  Junghyeong HA ,  Jongseong JI

IPC: H05B6/70 ,  H05B6/72

Abstract: A transfer connector for a cooking appliance includes a body that extends in a first direction and defines a hollow portion therein, a base that is coupled to the body and defines a communication hole in communication with the hollow portion, an electric connection part electrically connected to an external power source and extended in the first direction and penetrating through the hollow portion and the communication hole, and a dielectric material disposed in the hollow portion between an inner circumferential surface of the body and an outer circumferential surface of the electric connection part. The inner circumferential surface of the body surrounds the dielectric material, and the dielectric material surrounds the outer circumferential surface of the electric connection part.

公开(公告)号：US20210315068A1

公开(公告)日：2021-10-07

申请号：US17027071

申请日：2020-09-21

Applicant: LG Electronics Inc.

Inventor： Chuhyoung CHO ,  Seongho SON ,  Younghwan KWACK ,  Seonho JEON ,  Jongseong JI

IPC: H05B6/12 ,  H05B6/06

Abstract: An induction heating type cooktop includes a case, an upper plate coupled to a top of the case and configured to support an object, a working coil disposed inside the case and configured to heat the object, a thin film arranged at a top surface of the upper plate or a bottom surface of the upper plate, at least one temperature sensor configured to measure a temperature of at least one of components of the induction heating type cooktop, the components including the thin film, and a microcontroller unit (MCU) configured to drive the working coil and to control an output of the working coil based on whether the temperature satisfies at least one condition that is preset for the at least one of the components.

公开(公告)号：US20210313871A1

公开(公告)日：2021-10-07

申请号：US17082450

申请日：2020-10-28

Applicant: LG ELECTRONICS INC.

Inventor： Younghwan KWACK ,  Seongho Son ,  Seonho Jeon ,  Chuhyoung Cho ,  Jongseong JI

IPC: H02M1/08

Abstract: A method is provided for operating a resonant power conversion apparatus The method may include charging a capacitor connected to a power source in parallel, and determining a discharge time point and a discharge period of a discharge circuit, where the discharge circuit includes a resistor and a switch connected in series and is connected to the capacitor in parallel. The method may also include outputting, by a switch control circuit, a switch control signal by determining the switch control signal based on the discharge time point and the discharge period, and discharging the charged capacitor through the resistor based on the switch control signal applied to the switch. A resonant power conversion apparatus for performing the above-described method is provided.

公开(公告)号：US20210259060A1

公开(公告)日：2021-08-19

申请号：US17006464

申请日：2020-08-28

Applicant: LG Electronics Inc.

Inventor： Younghwan KWACK ,  Jongseong JI ,  Seongho SON ,  Seonho JEON ,  Chuhyoung CHO

IPC: H05B6/06 ,  H05B6/04 ,  H05B6/12

Abstract: An induction heating type cooktop includes: a case, a cover plate coupled to a top of the case and having an upper plate that is configured to support a target object, a thin film disposed on at least one of a top of the upper plate or a bottom of the upper plate, a working coil provided in the case and configured to inductively heat the thin film, a memory storing information on one or more correlations between a temperature of the thin film and a plurality of components of an equivalent circuit associated with the thin film, the plurality of components including an inductor component and a resistor component, and a controller configured to operate the working coil and determine estimated temperature information corresponding to the inductor component and the resistor component of the equivalent circuit.

公开(公告)号：US20210195699A1

公开(公告)日：2021-06-24

申请号：US16849584

申请日：2020-04-15

Applicant: LG Electronics Inc.

Inventor： Seonho JEON ,  Seongho SON ,  Younghwan KWACK ,  Chuhyoung CHO ,  Jongseong JI

IPC: H05B6/06 ,  F24C15/10 ,  H05B6/12 ,  H05B1/02

Abstract: An induction heating type cooktop includes an upper plate coupled to a top side of a case and configured to place an object to be heated on a top of the upper plate, a working coil disposed inside the case to heat the object, a thin film disposed on at least one of a top surface or a bottom surface of the upper plate, an insulator disposed between the bottom surface of the upper plate and the working coil, and a temperature sensor configured to measure a temperature of at least one of the thin film or the upper plate by a plurality of thermocouples.