摘要:
A communications device may include a connector block. The connector block may include a port. The port may be sized and configured to couple an optical fiber plug. The communications device may include an optical subassembly that may be connected to the connector block. The connector block may include a mount. The mount may be sized and configured to align the connector block and the optical subassembly. The mount may be configured as an EMI shield.
摘要:
An electrical connector having an electrical interface assembly electrical processing circuitry, and an EMI barrier. The electrical interface assembly has a plurality of electrical contacts for interfacing with a receptacle when the electrical connector is connected to a corresponding receptacle. The electrical processing circuitry is for processing electrical signals received from at least some of the plurality of electrical contacts and/or to be sent to the plurality of electrical contacts. The EMI barrier substantially contains the electrical processing circuitry except at a number of EMI barrier openings. The largest of these EMI barrier openings is where the electrical contacts pass through the connector.
摘要:
In one example, an optical subassembly positioning plate is provided that includes a substantially flat body that defines at least one edge. A port is defined in the body. The port is configured to receive and secure an optical subassembly in an x-direction and a y-direction when said optical subassembly positioning plate is positioned within an optoelectronic transceiver module. A plurality of fingers is defined along at least one edge of the body. Each of the plurality of fingers is configured to contact a shell of the optoelectronic transceiver module so as to bias a flange of the optical subassembly against a portion of the shell of the optoelectronic transceiver module such that the optical subassembly is substantially retained in a z-direction when the optical subassembly positioning plate is positioned within the optoelectronic transceiver module.
摘要:
This disclosure concerns EMI control in electronics systems. In one example, an electromagnetic radiation containment system is provided for use in connection with functional modules and an associated card cage disposed in the chassis of an electronic equipment enclosure. The electromagnetic radiation containment system includes conductive elements uniformly distributed about the perimeter of a functional module configured to be received within the card cage, and further includes grounding elements in electrical communication with the chassis so that when the functional module is positioned within a slot of the card cage, at least some of the conductive elements are in electrical communication with the grounding elements. Electrical communication between the conductive elements and circuitry of the functional module facilitates EMI control in the electronic equipment enclosure.
摘要:
In one example, an optical transceiver is provided that includes a ROSA and a TOSA received within a block portion of an OSA block. The OSA block also includes two groups of adjustable elements, one group for each of the ROSA and the TOSA. The adjustable elements of the first group engage the block portion so as to contact the ROSA, and the adjustable elements of the second group engage the block portion so as to contact the TOSA. The position of the adjustable elements in each respective group can then be varied as necessary to locate and/or maintain the ROSA and TOSA in desired positions and orientations relative to, for example, respective optical connector ports of the optical transceiver.
摘要:
A card cage system is provided that includes a middle card guide interposed between two end card guides in an electronic equipment enclosure. Each of the card guides includes one or more channels adapted to receive a card edge. The middle card guide includes a removable adapter element that can permit insertion of two single wide cards in a side-by-side arrangement. When the adapter element is removed, a double-wide card can be received in the middle card guide such that it straddles the middle card guide. One or more elongate members can also be inserted in any of the card guides to add vertical or lateral stability. Thus, the card guide can be readily customized to accommodate a variety of card types and sizes, in various arrangements.
摘要:
A card guide is provided that is suitable for use in connection with a card cage system of an electronic equipment enclosure. The card guide includes one or more engagement elements configured to interact with corresponding structure of the chassis of the electronic equipment enclosure so that the card guide lacks any degree of freedom when the card guide is positioned within a fully assembled electronic equipment enclosure. At least one of the engagement elements is configured and arranged to enage the corresponding structure of the chassis in a permanent snap-fit type arrangement.
摘要:
Lead frame connectors for connecting optical sub-assemblies to printed circuit boards in optical transceiver modules. The lead frame connectors include a stamped and bent conductive lead structure that is encased in an insert injection molded plastic casing. The plastic casing provides electrical insulation for the conductors in the lead frame as well as mechanical support for the finished component. The lead frame connectors connect to the leads associated with the optical sub-assemblies and are surface mounted onto the printed circuit board to establish connectivity between the optical sub-assembly and the printed circuit board. The lead frame assemblies are generally more reliable and less expensive than using flexible printed circuit board structures to establish electrical connectivity between optical sub-assemblies and transceiver printed circuit boards.
摘要:
The principles of the present invention provide for a plastic ROSA that has a metallic EMI shroud covering a portion of the plastic ROSA. The combination of the plastic ROSA and the EMI shroud provides the unexpected result of having EMI shielding substantially similar to a metal ROSA.
摘要:
The case temperature measurement device for an optoelectronic transceiver includes a case with at least one thermally conductive wall, at least one optical component at least partially disposed within the case, circuitry electrically coupled to the optical component. The circuitry includes a temperature sensor coupled to the circuitry. The case temperature measurement device also includes at least one protrusion formed on the wall of the case of the optoelectronic transceiver. The protrusion is thermally coupled to temperature sensor via a thermal pad. A method for estimating case temperature of the optoelectronic transceiver based on an internal temperature measurement and knowledge of the relationship between the measured internal temperature and the actual case temperature, and compensating for the effects of variable heat sources within the transceiver upon this estimate.