摘要:
A semiconductor wafer, having a relatively wide power supply line and ground line, and which can also prevent short-circuiting between these lines. Multiple integrated circuit formation regions, whereon integrated circuits have been formed, are disposed on a semiconductor wafer. A silicon oxide film is formed on a silicon substrate, and a ground line conductor is formed on the silicon oxide film. This ground line conductor is extended over scribe lines. A layer insulation film composed of silicon oxide film is deposited on the silicon oxide film with the ground line conductor interposed therebetween, and a power supply line conductor is formed on the layer insulation film to overlap the ground line conductor. The power supply line conductor is extended over scribe lines. In the integrated circuit formation regions, a power supply pad and the power supply line conductor are electrically connected. A ground pad and the ground line conductor are also electrically connected.
摘要:
A driving circuit of a pulse motor for use in a vehicle odometer is provided. The driving circuit includes a pulse source for providing drive pulses, in sequence, to a plurality of phase coils of the pulse motor, and a wave-shaper for shaping leading and trailing edges of each of the drive pulses so as to vary at a given rate in plural steps for noiseless smooth rotation of the pulse motor.
摘要:
A load driving device includes: an output power device for driving a load; a driving IC for controlling the output power device, wherein the driving IC is electrically coupled with the output power device through a wire or a connection member; and a first electrode substrate. The output power device and the driving IC are mounted on the first electrode substrate. In this case, the output power device is controlled with high speed, and a mounting area of the output power device and the driving IC is reduced.
摘要:
A semiconductor device includes: n transistor elements; n resistive elements; and n capacitive elements, each kind of elements coupled in series between the first and second terminals. The gate of each transistor element has a gate pad, and each transistor element includes transistor pads disposed on both sides. Each resistive element includes resistive pads disposed on both sides. Each capacitive element includes capacitive pads disposed on both sides. The gate pad other than the first stage transistor element, a corresponding resistive pad, and a corresponding capacitive pad are electrically coupled. One transistor pad, one resistive pad, and one capacitive pad in the first stage are electrically coupled. One transistor pad, one resistive pad, and one capacitive pad in the n-th stage are electrically coupled.
摘要:
An overheat-sensing circuit includes a temperature-sensing circuit for outputting a temperature-sensing voltage, a reference voltage generation circuit for outputting a reference voltage, and a comparison circuit that compares the temperature-sensing voltage with the reference voltage and outputs an overheat-sensing signal based on a result of the comparison. The reference voltage generation circuit outputs the reference voltage in accordance with a power supply voltage when the power supply voltage is within a predetermined voltage range. In contrast, the reference voltage generation circuit generates a limited voltage based on the power supply voltage and outputs the reference voltage in accordance with the limited voltage when the power supply voltage is outside the predetermined voltage range. This approach reduces a variation in an overheat-sensing temperature at which the comparison circuit outputs the overheat-sensing signal.
摘要:
In a power supply apparatus, a switching circuit selectively applies one of an input voltage of a power converting circuit and an output voltage of the power converting circuit to a voltage reducing power supply circuit. When the input voltage is applied to the power converting circuit, the switching circuit selects this input voltage, so that the output voltage of the voltage reducing power supply circuit can quickly rise. Thereafter, when the output voltage of the power converting circuit exceeds this output voltage, the switching circuit selects the output voltage of the power converting circuit. As a result, a difference between the input voltage and the output voltage of the voltage reducing power supply circuit is decreased. Thus, a power loss is lowered and noise produced in the power converting circuit is suppressed.
摘要:
An NPN bipolar transistor and a PNP bipolar transistor are formed in a semiconductor substrate. The NPN bipolar transistor has a p type emitter region, a p type collector region and an n type base region and is formed in an NPN forming region. The PNP bipolar transistor has an n type emitter region, an n type collector region and a p type base region and is formed in a PNP forming region. Only one conductive type burying region is formed in at least one of the NPN forming region and the PNP forming region. A current that flows from the p type emitter region to the n type base region flows in the n type base region in a direction perpendicular to the substrate.
摘要:
An over-voltage protection apparatus includes a power feed line. A load has a given low impedance. A current supplying device operates for supplying a current to the load via the power feed line. A load drive device operates for controlling the supply of the current to the load by the current supplying device. An over-voltage detecting device operates for detecting an over-voltage at the power feed line. A discharge command device operates for, when the over-voltage at the power feed line is detected by the over-voltage detecting device, controlling the load drive device to enable a discharge current to flow from the power feed line into the load and thereby to remove the over-voltage from the power feed line through discharge. A current detecting device operates for detecting the discharge current. A discharge continuing device operates for continuing the discharge and the flow of the discharge current from the power feed line in cases where the discharge current detected by the current detecting device exceeds a predetermined reference level.
摘要:
An alignment mark for determining a position of a thin film resistor formed on a semiconductor chip. The alignment mark is disposed on a capacitor formation region of the semiconductor chip. Because aluminum wiring members of the semiconductor chip are not disposed adjacent to the alignment mark within the capacitor formation region, the alignment mark can be precisely recognized. As a result, the position of the thin film resistor can be also precisely determined.
摘要:
An output MOS transistor and a current-detecting MOS transistor are connected commonly at their drains and gates. A gate voltage is fed to the gates of these transistors via signal lines. When the voltage of an output terminal is increased in response to excessive load current, a current-mirror circuit consisting of first and second transistors pulls in current from the signal line to reduce the gate voltage. Thus, the output current of output MOS transistor is limited within a predetermined level. Furthermore, a diode, provided in the signal line, produces a voltage drop equivalent to the base-emitter voltage of first transistor. By the function of this diode, the gate-source voltage of output MOS transistor is equalized with the gate-source voltage of current-detecting MOS transistor. As a result, the same operating point can be set for the output transistor and the current-detecting transistor.