Image reading apparatus, image reading method and image processing apparatus
    21.
    发明授权
    Image reading apparatus, image reading method and image processing apparatus 有权
    图像读取装置,图像读取方法和图像处理装置

    公开(公告)号:US07787157B2

    公开(公告)日:2010-08-31

    申请号:US11280447

    申请日:2005-11-17

    IPC分类号: H04N1/40 H04N1/46

    CPC分类号: H04N1/4076

    摘要: An image reading apparatus is disclosed. The image reading apparatus provides plural sensors and a correction unit that corrects displacement of image data caused by intervals among the plural sensors and includes a first draft reading mode whose scanning direction by the sensors is the same as at the time of shading correction and a second draft reading mode whose scanning direction by the sensors is different from at the time of shading correction. The correction unit includes plural paths in which a different number of delay units are disposed in each path and changing over units that change over a connection between the sensors and the paths. The changing over units are changed over between at the time of reading image data and the shading correction in the first draft reading mode and at the time of reading image data in the second draft reading mode.

    摘要翻译: 公开了一种图像读取装置。 图像读取装置提供多个传感器和校正单元,其校正由多个传感器之间的间隔引起的图像数据的位移,并且包括第一通气读取模式,其由传感器的扫描方向与阴影校正时相同, 通过传感器的扫描方向不同于阴影校正时的通气读数模式。 校正单元包括多个路径,其中在每个路径中设置不同数量的延迟单元,并且改变在传感器和路径之间的连接上改变的单元。 在读取图像数据时,在第一原稿读取模式中和在第二稿件读取模式下读取图像数据时,改变单元之间的切换。

    Piezoelectric/electrostrictive film and method for producing the same
    25.
    发明授权
    Piezoelectric/electrostrictive film and method for producing the same 有权
    压电/电致伸缩薄膜及其制造方法

    公开(公告)号:US07713366B2

    公开(公告)日:2010-05-11

    申请号:US11552260

    申请日:2006-10-24

    IPC分类号: C03B29/00 B44C1/165 B44C1/175

    摘要: A piezoelectric/electrostrictive film is formed on a solid-phase support, the piezoelectric/electrostrictive film including an incompletely bonded region which is incompletely bonded in a predetermined pattern to the solid-phase support, and a bonded region which is bonded to the surface of the solid-phase support so that the incompletely bonded region can be separated. The piezoelectric/electrostrictive film is bonded to a substrate and is separated from the solid-phase support in the bonded region. As a result, the incompletely bonded region is transferred to the substrate. The transferred incompletely bonded region is used as a piezoelectric/electrostrictive film for manufacturing a piezoelectric/electrostrictive film device.

    摘要翻译: 在固相载体上形成压电/电致伸缩薄膜,压电/电致伸缩薄膜包含与固相载体以预定图案不完全结合的未完全结合的区域,以及键合区域, 固相载体,使得不完全结合的区域可以分离。 将压电/电致伸缩膜粘合到基底上,并与粘合区域中的固相载体分离。 结果,未完全结合的区域转移到基板。 转印的未完全结合区域用作压电/电致伸缩薄膜器件的压电/电致伸缩薄膜。

    CONFIGURATION DATA FEEDING DEVICE
    26.
    发明申请
    CONFIGURATION DATA FEEDING DEVICE 有权
    配置数据送料装置

    公开(公告)号:US20100066408A1

    公开(公告)日:2010-03-18

    申请号:US12625730

    申请日:2009-11-25

    IPC分类号: H03K19/173

    CPC分类号: H03K19/17748 H03K19/17764

    摘要: A configuration data feeding device for feeding configuration data to a plurality of FPGAs includes a memory for storing configuration data that are fed to the plurality of FPGAs, a plurality of interface units for outputting the configuration data read out from the memory, according to their specific configuration layouts, an interface selection unit for selecting, out of the plurality of interface units, an interface unit that is to be used for configuring each of the plurality of FPGAs, and a circuit-switching unit for switching the circuits that connect the FPGAs to the interface units depending upon the selection by the interface selection unit.

    摘要翻译: 用于将配置数据馈送到多个FPGA的配置数据馈送装置包括用于存储馈送到多个FPGA的配置数据的存储器,用于输出从存储器读出的配置数据的多个接口单元, 配置布局,用于从所述多个接口单元中选择要用于配置所述多个FPGA中的每一个的接口单元的接口选择单元,以及用于将连接所述FPGA的电路切换到 接口单元取决于接口选择单元的选择。

    DIELECTRIC DEVICE AND ITS MANUFACTURING METHOD
    29.
    发明申请
    DIELECTRIC DEVICE AND ITS MANUFACTURING METHOD 有权
    电介质器件及其制造方法

    公开(公告)号:US20080196227A1

    公开(公告)日:2008-08-21

    申请号:US11961218

    申请日:2007-12-20

    IPC分类号: H01L41/22

    摘要: A manufacturing method of a dielectric device includes steps described below. (1) Mixing step: Powders serving as a matrix and additive powders for sintering the matrix are mixed. (2) Mixture heat-treating step: The mixture of the matrix and the additive that has been subject to the mixing step is heat-treated. (3) Deposition layer formation step: The material powders obtained through the mixture heat-treating step are injected toward a substrate so as to form a deposition layer on the substrate. (4) Deposition layer heat-treating step: The deposition layer formed on the substrate through the deposition layer formation step is heat-treated so as to form the dielectric layer on the substrate.

    摘要翻译: 电介质器件的制造方法包括下述步骤。 (1)混合工序:将作为基质的粉末和烧结基质的添加剂粉末混合。 (2)混合热处理工序:将经过混合工序的基质和添加剂的混合物进行热处理。 (3)沉积层形成步骤将通过混合物热处理步骤获得的材料粉末注入基板,以在基板上形成沉积层。 (4)沉积层热处理工序:通过沉积层形成工序在基板上形成的沉积层进行热处理,以在基板上形成电介质层。