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    METHOD AND APPARATUS FOR COOLING AN EQUIPMENT ENCLOSURE THROUGH CLOSED-LOOP, LIQUID-ASSISTED AIR COOLING IN COMBINATION WITH DIRECT LIQUID COOLING
    24.
    发明申请
    METHOD AND APPARATUS FOR COOLING AN EQUIPMENT ENCLOSURE THROUGH CLOSED-LOOP, LIQUID-ASSISTED AIR COOLING IN COMBINATION WITH DIRECT LIQUID COOLING 有权
    用于通过闭环冷却设备外壳的方法和装置，液体辅助的空气冷却与直接液体冷却的组合

    公开(公告)号：US20070002536A1

    公开(公告)日：2007-01-04

    申请号：US11427384

    申请日：2006-06-29

    申请人： Shawn Hall ,  Shurong Tian ,  Paul Coteus ,  John Karidis ,  Evan Colgan ,  Robert Guernsey

    发明人： Shawn Hall ,  Shurong Tian ,  Paul Coteus ,  John Karidis ,  Evan Colgan ,  Robert Guernsey

    IPC分类号： H05K7/20

    CPC分类号： H05K7/20754 ,  G06F1/20 ,  G06F2200/201

    摘要： A method and an apparatus for cooling, preferably within an enclosure, a diversity of heat-generating components, with at least some of the components having high-power densities and others having low-power densities. Heat generated by the essentially relatively few high-power-density components, such as microprocessor chips for example, is removed by direct liquid cooling, whereas heat generated by the more numerous low-power or low-watt-density components, such as memory chips for example, is removed by liquid-assisted air cooling in the form of a closed loop comprising a plurality of heating and cooling zones that alternate along the air path.

    摘要翻译： 优选地在外壳内冷却发热部件的多样性的方法和装置，其中至少一些部件具有高功率密度，而其它部件具有低功率密度。 由基本相对较少的高功率密度组件（例如微处理器芯片）产生的热量通过直接液体冷却而被去除，而由更多的低功率或低功率密度组件产生的热量，例如存储芯片 例如，通过液体辅助空气冷却以封闭回路的形式除去，包括沿着空气路径交替的多个加热和冷却区域。

    Thermal interposer for thermal management of semiconductor devices
    26.
    发明申请
    Thermal interposer for thermal management of semiconductor devices 失效
    用于半导体器件热管理的热插入器

    公开(公告)号：US20050280128A1

    公开(公告)日：2005-12-22

    申请号：US10872575

    申请日：2004-06-18

    申请人： Lawrence Mok ,  Evan Colgan ,  Minhua Lu ,  Da-Yuan Shih

    发明人： Lawrence Mok ,  Evan Colgan ,  Minhua Lu ,  Da-Yuan Shih

    IPC分类号： H01L23/02 ,  H01L23/427

    CPC分类号： H01L23/427 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/10158 ,  H01L2924/15311

    摘要： A thermal interposer is provided for attachment to a surface of a semiconductor device. In one embodiment, the thermal interposer includes an upper plate having a bottom surface with a plurality of grooves and made of a material having high thermal conductivity, and a lower plate having a top surface with a plurality of grooves and made of a material having a coefficient of thermal expansion that is substantially the same as the coefficient of thermal expansion of the material of a semiconductor device that is bonded to the bottom surface of the lower plate. The bottom surface of the upper plate is hermetically bonded to the top surface of the lower plate so that a vapor chamber is formed by the upper and lower plates, and walls of the grooves on the top surface of the lower plate extend to within less than 250 microns from walls of the grooves on the bottom surface of the upper plate comprise a plurality of second walls the first walls.

    摘要翻译： 提供了用于附接到半导体器件的表面的热插入件。 在一个实施例中，热插入件包括具有多个凹槽并由具有高导热性的材料制成的底表面的上板，以及具有多个凹槽的顶表面的下板，并由具有 热膨胀系数与结合到下板的底面的半导体器件的材料的热膨胀系数基本相同。 上板的底面与下板的顶面密封，从而通过上板和下板形成蒸气室，下板顶表面上的槽的壁延伸到小于 在上板的底表面上的槽的壁250微米包括多个第二壁和第一壁。

    Apparatus and methods for cooling semiconductor integrated circuit package structures
    27.
    发明申请
    Apparatus and methods for cooling semiconductor integrated circuit package structures 失效
    用于冷却半导体集成电路封装结构的装置和方法

    公开(公告)号：US20050189568A1

    公开(公告)日：2005-09-01

    申请号：US10789500

    申请日：2004-02-27

    申请人： Evan Colgan ,  Jeffrey Gelorme ,  Kamal Sikka ,  Hilton Toy ,  Jeffrey Zitz

    发明人： Evan Colgan ,  Jeffrey Gelorme ,  Kamal Sikka ,  Hilton Toy ,  Jeffrey Zitz

    IPC分类号： H01L23/367 ,  H01L29/739

    CPC分类号： H01L23/367 ,  H01L2924/0002 ,  H01L2924/00

    摘要： Apparatus and methods are provided for thermally coupling a semiconductor chip directly to a heat conducting device (e.g., a copper heat sink) using a thermal joint that provides increased thermal conductivity between the heat conducting device and high power density regions of the semiconductor chip, while minimizing or eliminating mechanical stress due to the relative displacement due to the difference in thermal expansion between the semiconductor chip and the heat conducting device.

    摘要翻译： 提供了使用在热传导装置和半导体芯片的高功率密度区域之间提供增加的热导率的热接头将半导体芯片直接热耦合到导热装置（例如，铜散热器）的装置和方法，同时 最小化或消除由于半导体芯片和导热装置之间的热膨胀差异而导致的相对位移的机械应力。

    Mechanical packaging and thermal management of flat mirror arrays
    28.
    发明授权
    Mechanical packaging and thermal management of flat mirror arrays 失效
    平面镜阵列的机械包装和热管理

    公开(公告)号：US5721602A

    公开(公告)日：1998-02-24

    申请号：US540860

    申请日：1995-10-11

    申请人： Chandrasekhar Narayan ,  Evan Colgan ,  Kei-Hsiung Yang ,  Robert L. Melcher ,  Lawrence S. Mok ,  Leathen Shi ,  Thomas M. Cipolla

    发明人： Chandrasekhar Narayan ,  Evan Colgan ,  Kei-Hsiung Yang ,  Robert L. Melcher ,  Lawrence S. Mok ,  Leathen Shi ,  Thomas M. Cipolla

    IPC分类号： G02F1/13 ,  G02F1/133 ,  G02F1/1333 ,  G02F1/136 ,  G09F9/00 ,  H04N5/74

    CPC分类号： G02F1/133385 ,  G02F1/133308 ,  G02F1/136 ,  G02F2001/133322 ,  G02F2001/133325

    摘要： A liquid crystal element, a packaging structure providing thermal and alignment control, a display device including the same, and methods of fabrication and assembly are provided. The liquid crystal element includes: a semiconductor wafer, having microcircuitry and an array of reflective pixels; a layer of electro-optical responsive liquid crystal medium, of uniform thickness, disposed on the reflective pixels; a transparent conductive layer positioned on the liquid crystal, being substantially parallel to the reflective layers, to ensure a uniform thickness of the liquid crystal; and an insulative transparent layer provided on the conductive layer. The liquid crystal element is laminated to an optically flat substrate to limit the out-of-plane distortions thereof. The structure formed by element and substrate are disposed in a substrate holder which is mounted to a wiring board, and coupled to voltage sources for actuating the liquid crystal. During mounting, an aligning fixture is used to ensure proper orientation of the element relative to the related optical elements. Once the element is positioned, a heat sink is coupled to the rear surface of the substrate holder to dissipate heat.

    摘要翻译： 提供液晶元件，提供热和对准控制的封装结构，包括该液晶元件的显示装置，以及制造和组装方法。 液晶元件包括：具有微电路的半导体晶片和反射像素阵列; 设置在反射像素上的均匀厚度的电光响应液晶介质层; 位于液晶上的透明导电层基本上平行于反射层，以确保液晶的均匀厚度; 以及设置在导电层上的绝缘透明层。 将液晶元件层压到光学平面基板上以限制其平面外失真。 由元件和基板形成的结构设置在安装到布线板上的基板保持器中，并连接到用于致动液晶的电压源。 在安装期间，使用对准夹具来确保元件相对于相关光学元件的正确取向。 一旦元件被定位，散热器耦合到衬底保持器的后表面以散热。

    METHOD AND APPARATUS FOR COOLING AN EQUIPMENT ENCLOSURE THROUGH CLOSED-LOOP LIQUID-ASSISTED AIR COOLING IN COMBINATION WITH DIRECT LIQUID COOLING
    29.
    发明申请
    METHOD AND APPARATUS FOR COOLING AN EQUIPMENT ENCLOSURE THROUGH CLOSED-LOOP LIQUID-ASSISTED AIR COOLING IN COMBINATION WITH DIRECT LIQUID COOLING 审中-公开
    通过闭环液体辅助空气冷却与直接液体冷却组合来冷却设备外壳的方法和装置

    公开(公告)号：US20080055856A1

    公开(公告)日：2008-03-06

    申请号：US11862308

    申请日：2007-09-27

    申请人： Shawn Hall ,  Shurong Tian ,  Paul Coteus ,  John Karidis ,  Evan Colgan ,  Robert Guernsey

    发明人： Shawn Hall ,  Shurong Tian ,  Paul Coteus ,  John Karidis ,  Evan Colgan ,  Robert Guernsey

    IPC分类号： H05K7/20 ,  H05K5/02

    CPC分类号： H05K7/20754 ,  G06F1/20 ,  G06F2200/201

    摘要： A method and an apparatus for cooling, preferably within an enclosure, a diversity of heat-generating components, with at least some of the components having high-power densities and others having low-power densities. Heat generated by the essentially relatively few high-power-density components, such as microprocessor chips for example, is removed by direct liquid cooling, whereas heat generated by the more numerous low-power or low-watt-density components, such as memory chips for example, is removed by liquid-assisted air cooling in the form of a closed loop comprising a plurality of heating and cooling zones that alternate along the air path.

    摘要翻译： 优选地在外壳内冷却发热部件的多样性的方法和装置，其中至少一些部件具有高功率密度，而其它部件具有低功率密度。 由基本相对较少的高功率密度组件（例如微处理器芯片）产生的热量通过直接液体冷却而被去除，而由更多的低功率或低功率密度组件产生的热量，例如存储芯片 例如，通过液体辅助空气冷却以封闭回路的形式除去，包括沿着空气路径交替的多个加热和冷却区域。

    Apparatus and Methods for Cooling Semiconductor Integrated Circuit Package Structures
    30.
    发明申请
    Apparatus and Methods for Cooling Semiconductor Integrated Circuit Package Structures 失效
    用于冷却半导体集成电路封装结构的装置和方法

    公开(公告)号：US20080042264A1

    公开(公告)日：2008-02-21

    申请号：US11927145

    申请日：2007-10-29

    申请人： Evan Colgan ,  Jeffrey Gelorme ,  Kamal Sikka ,  Hilton Toy ,  Jeffrey Zitz

    发明人： Evan Colgan ,  Jeffrey Gelorme ,  Kamal Sikka ,  Hilton Toy ,  Jeffrey Zitz

    IPC分类号： H01L23/36

    CPC分类号： H01L23/367 ,  H01L2924/0002 ,  H01L2924/00

    摘要： Apparatus and methods are provided for thermally coupling a semiconductor chip directly to a heat conducting device (e.g., a copper heat sink) using a thermal joint that provides increased thermal conductivity between the heat conducting device and high power density regions of the semiconductor chip, while minimizing or eliminating mechanical stress due to the relative displacement due to the difference in thermal expansion between the semiconductor chip and the heat conducting device.

    摘要翻译： 提供了使用在热传导装置和半导体芯片的高功率密度区域之间提供增加的热导率的热接头将半导体芯片直接热耦合到导热装置（例如，铜散热器）的装置和方法，同时 最小化或消除由于半导体芯片和导热装置之间的热膨胀差异而导致的相对位移的机械应力。