公开(公告)号：US20190293674A1

公开(公告)日：2019-09-26

申请号：US16362818

申请日：2019-03-25

Applicant: Seiko Epson Corporation

Inventor： Taketo CHINO ,  Yoshikuni SAITO

IPC: G01P1/02 ,  H05K1/11 ,  H05K1/18 ,  H05K5/00

Abstract: A sensor unit includes a circuit board including, on a first surface, a plurality of electrode pads to which a plurality of mounting terminals of an inertial sensor are respectively attached via connecting members. The first surface of the circuit board includes an insulating layer provided on the outer side of the plurality of electrode pads in a plan view, includes, in a portion overlapping a center region further on the inner side than the mounting terminals of the inertial sensor in the plan view, a first region where the insulating layer is not provided, and includes, from the first region to the outer side of the inertial sensor in the plan view, a second region where the insulating layer is not provided.

公开(公告)号：US20190017852A1

公开(公告)日：2019-01-17

申请号：US16135510

申请日：2018-09-19

Applicant: Seiko Epson Corporation

Inventor： Masayasu SAKUMA ,  Yoshihiro KOBAYASHI ,  Shojiro KITAMURA ,  Taketo CHINO

IPC: G01D11/24 ,  G01C21/16 ,  G01C19/5769 ,  G01D11/30

Abstract: A sensor device includes a mounting member having fixation surfaces inside, and at least one electronic component directly or indirectly fixed to the fixation surfaces of the mounting member, and the mounting member constitutes a part of a casing for housing the electronic component. Further, the fixation surfaces are perpendicular to each other.

公开(公告)号：US20160195396A1

公开(公告)日：2016-07-07

申请号：US15070943

申请日：2016-03-15

Applicant: Seiko Epson Corporation

Inventor： Masayasu SAKUMA ,  Yoshihiro KOBAYASHI ,  Shojiro KITAMURA ,  Taketo CHINO ,  Michiharu OGAMI

IPC: G01C19/5783

CPC classification number: G01C19/5783

Abstract: A module includes a first rigid substrate including an analog circuit; a second rigid substrate including a digital circuit; a third rigid substrate including an angular velocity sensor; a first connecting portion that connects the first rigid substrate and the second rigid substrate so as to electrically connect the analog circuit and the digital circuit, and that has flexibility; and a second connecting portion that connects the first rigid substrate and the third rigid substrate so as to electrically connect the analog circuit and the angular velocity sensor, and that has flexibility.

Abstract translation: 模块包括包括模拟电路的第一刚性基板; 包括数字电路的第二刚性基板; 包括角速度传感器的第三刚性基板; 第一连接部，其连接第一刚性基板和第二刚性基板，以便电连接模拟电路和数字电路，并且具有柔性; 以及第二连接部，其连接所述第一刚性基板和所述第三刚性基板，以电连接所述模拟电路和所述角速度传感器，并且具有柔性。

公开(公告)号：US20140063753A1

公开(公告)日：2014-03-06

申请号：US14013772

申请日：2013-08-29

Applicant: Seiko Epson Corporation

Inventor： Taketo CHINO

IPC: H05K9/00

CPC classification number: H05K9/00 ,  H05K9/002

Abstract: An electronic module includes: a first substrate having first surface on which a first sensor element is provided and a second surface on which a circuit element is provided; a second substrate having a third surface on which a second sensor element is provided; a third substrate having a fifth surface on which a third sensor element is provided; a first connecting portion connecting the first substrate and the second substrate to each other; and a second connecting portion connecting the first substrate and the third substrate to each other. A shield layer is provided between the first sensor element and the circuit element.

Abstract translation: 电子模块包括：具有第一表面的第一基板和第二传感器元件，第二表面设置有电路元件; 具有第三表面的第二基板，其上设置有第二传感器元件; 具有第五表面的第三基板，其上设置有第三传感器元件; 连接第一基板和第二基板的第一连接部分; 以及将第一基板和第三基板彼此连接的第二连接部。 在第一传感器元件和电路元件之间提供屏蔽层。