公开(公告)号：US20140286733A1

公开(公告)日：2014-09-25

申请号：US14353634

申请日：2012-11-08

Applicant: SINFONIA TECHNOLOGY CO., LTD.

Inventor： Gengoro Ogura ,  Takaichi Hatano

IPC: H01L21/677

CPC classification number: H01L21/67775 ,  H01L21/67769

Abstract: There is provided a device capable of effectively increasing the number of wafers that is conveyed inside a wafer transport chamber and capable of improving the wafer conveyance processing capacity if an EFEM is used, without leading to a marked increase in installation area. A load port includes: a plurality of levels of loading tables are provided in the height direction; and wafers housed inside FOUP on top of each loading table is inserted into and removed from inside wafer transport chambers, in a state wherein each loading table is arranged at a wafer insertion/removal position on the front surface of the wafer transport chambers. The loading tables includes a transport mechanism that moves wafers forward and back in the front/rear direction, between a FOUP passing/receiving position at which the FOUP are handed over to a FOUP transport device and the wafer insertion/removal position.

Abstract translation: 提供了一种能够有效地增加在晶片传送室内传送的晶片数量的装置，并且能够在使用EFEM的情况下提高晶片传送处理能力，而不会导致安装面积的显着增加。 负载端口包括：在高度方向上设置多个装载台; 并且在每个装载台被布置在晶片传送室的前表面上的晶片插入/取出位置的状态下，将容纳在每个装载台顶部的FOUP内的晶片插入并移出晶片传送室内部。 装载台包括一个传送机构，它们在FOUP被传送到FOUP传输装置的FOUP通过/接收位置和晶片插入/取出位置之间沿前后方向向前移动晶片。