公开(公告)号：US11456338B2

公开(公告)日：2022-09-27

申请号：US16850046

申请日：2020-04-16

Applicant: Samsung Display Co., Ltd.

Inventor： Seon Uk Lee ,  Kanguk Kim ,  Sanggab Kim ,  Donchan Cho ,  Tae Hyung Hwang ,  KyeongSu Ko ,  Sungwon Cho

IPC: H01L27/32 ,  H01L51/52 ,  H01L51/56

Abstract: Disclosed are display panels and methods of manufacturing substrates. The display panel comprises a lower display substrate that includes a plurality of light emitting elements, and an upper display substrate that includes a color control layer and is on the lower display substrate. The color control layer includes a plurality of walls each of which includes a wall base including an organic material and a reflective layer including a metallic material, and the color control layer also includes a plurality of color control parts which are disposed between the plurality of walls and at least one of which includes a quantum dot. The reflective layer surrounds at least a portion of a sidewall of the wall base, which results in an increase in luminous efficiency and an improvement in brightness.

公开(公告)号：US10969889B2

公开(公告)日：2021-04-06

申请号：US16559540

申请日：2019-09-03

Applicant: Samsung Display Co., Ltd.

Inventor： Yu-gwang Jeong ,  Sanggab Kim ,  Subin Bae ,  Sungwon Cho

IPC: G06F3/041 ,  H01L27/32 ,  H01L51/52 ,  H01L51/56 ,  G06F3/044 ,  H01L51/00

Abstract: Provided is an electronic apparatus. The electronic apparatus includes a base substrate which includes a front surface and a rear surface facing each other, and in which a module hole passing through the front and rear surfaces is defined, a thin film transistor disposed on the base substrate, a light emitting device including a first electrode connected to the thin film transistor, a second electrode disposed on the first electrode, and a light emitting pattern disposed between the first electrode and the second electrode, an encapsulation layer which covers the light emitting device, an input sensing unit disposed on the base substrate and including a plurality of first conductive patterns and second conductive patterns disposed on the first conductive patterns, and an insulation layer disposed between the first conductive patterns and the second conductive patterns. The encapsulation layer is disposed between the first conductive patterns and the second conductive patterns.