公开(公告)号：US11239122B2

公开(公告)日：2022-02-01

申请号：US16717307

申请日：2019-12-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngki Jung ,  Jinho Kim ,  Sangmin Shin ,  Changjoon Lee

IPC: H01L25/16 ,  H01L21/66 ,  H01L27/12

Abstract: A display module including a glass substrate; a thin film transistor layer disposed in a first area of the glass substrate; a plurality of connection pads disposed in a second area extending from the first area of the glass substrate and electrically connected to the thin film transistor layer; a plurality of test pads disposed in a third area extending from the second area of the glass substrate and electrically connected to the plurality of connection pads, respectively, and a plurality of connection wirings electrically connecting the plurality of connection pads and the plurality of test pads.

公开(公告)号：US11189675B2

公开(公告)日：2021-11-30

申请号：US16680764

申请日：2019-11-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Changkyu Chung ,  Changjoon Lee ,  Kyungwoon Jang ,  Gyun Heo ,  Youngjun Moon ,  Kwangrae Jo ,  Soonmin Hong ,  Daesuck Hwang

IPC: H01L27/32 ,  H01L27/15 ,  H05B33/10 ,  H05B45/20

Abstract: A display module, a display apparatus including a display module, and a method of manufacturing a display module are provided. The method of manufacturing a display module includes forming a non-conductive layer that includes a fluxing function on a substrate, providing a plurality of light-emitting diodes (LEDs) on the substrate, wherein each LED of the plurality of LEDs has a first electrode pad and a second electrode pad spaced apart by a predetermined interval, and the substrate has a plurality of connection pads that are configured to electrically connect to the first electrode pads and the second electrode pads; thermally compressing the plurality of LEDs; and electrically connecting the plurality of LEDs and the substrate via a plurality of soldering members that are provided on at least one of the plurality of LEDs or the substrate.