公开(公告)号：US20150116933A1

公开(公告)日：2015-04-30

申请号：US14528564

申请日：2014-10-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yeonwoo KIM ,  Hosaeng KIM ,  Hoon PARK ,  Jinwoo JUNG

IPC: H05K5/04 ,  H05K5/00 ,  G06F1/16

CPC classification number: G06F1/1656 ,  G06F1/1613 ,  G06F1/1643 ,  G06F1/169 ,  G06F1/1698 ,  H01Q1/24 ,  H01Q1/243 ,  H01Q1/44 ,  H04B1/3888 ,  H04M1/0202 ,  H05K5/0004 ,  H05K5/04

Abstract: A case including metal for an electronic device and an electronic device having the same are provided. The electronic device includes a case comprising an injection-molded part including a plurality of holes, and a metal part formed under the injection-molded part, and the metal part being partially exposed through the plurality of holes. The metal part is divided into a plurality of parts via a cut portion formed in a portion of the metal part not exposed through the plurality of holes, and at least one of the plurality of the divided metal parts is utilized as a component element related to a specific function of the electronic device.

Abstract translation: 提供了一种包括用于电子设备的金属和具有该金属的电子设备的壳体。 该电子装置包括：包括多个孔的注射成型部的壳体和形成在注射成型部下方的金属部，该金属部通过多个孔部分露出。 金属部分经由形成在未暴露在多个孔中的金属部分的部分中的切割部分分成多个部分，并且多个分割的金属部分中的至少一个被用作与 电子设备的具体功能。