公开(公告)号：US10886219B2

公开(公告)日：2021-01-05

申请号：US16478409

申请日：2018-01-10

Applicant: TDK CORPORATION

Inventor： Kazuhiro Yoshikawa ,  Mitsuhiro Tomikawa ,  Kenichi Yoshida

IPC: H01L23/528 ,  H01L23/28 ,  H01L23/64 ,  H01L49/02

Abstract: An electronic component mounting package includes a semiconductor element which is disposed such that an active surface faces a main surface of a wiring portion, and which is electrically connected to the wiring portion via a first terminal; and a thin film passive element which is disposed between the active surface of the semiconductor element and the main surface of the wiring portion when seen in a lamination direction, and which is electrically connected to the semiconductor element. A part of the first terminal is disposed on an outer side with respect to the thin film passive element in a plan view. A length of the first terminal in the lamination direction disposed on the outer side with respect to the thin film passive element is larger than a thickness of the thin film passive element in the lamination direction.

公开(公告)号：US10153092B2

公开(公告)日：2018-12-11

申请号：US15725860

申请日：2017-10-05

Applicant: TDK CORPORATION

Inventor： Michihiro Kumagae ,  Akifumi Kamijima ,  Norihiko Matsuzaka ,  Junki Nakamoto ,  Kazuhiro Yoshikawa ,  Kenichi Yoshida

IPC: H01G4/33 ,  H01G4/018 ,  H01G4/005 ,  H01G4/30 ,  H01G4/012 ,  H01G4/224 ,  H01G4/008 ,  H01G4/12

Abstract: A thin-film capacitor including a stacked body having a lower electrode layer, a plurality of dielectric layers stacked on the lower electrode layer, one or more internal electrode layers interposed between the dielectric layers, and an upper electrode layer that is stacked on the opposite side of the lower electrode layer with the dielectric layers and the internal electrode layers interposed between, and a cover layer that covers the stacked body. The stacked body includes opening portions that have the lower electrode layer, opens upward in a stacking direction, and has a side surface formed to include an inclined surface. The cover layer is stacked on the inclined surface of the stacked body. A curved surface with a predetermined shape is formed on the inclined surface for each pair of layers including the dielectric layer forming the inclined surface and the electrode layer, forming the inclined surface.