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公开(公告)号:US11506907B2
公开(公告)日:2022-11-22
申请号:US16699971
申请日:2019-12-02
Applicant: TRIPLE WIN TECHNOLOGY (SHENZHEN) CO. LTD.
Inventor: Yu-Shuai Li , Shin-Wen Chen , Jing-Wei Li , Jian-Chao Song , Sheng-Jie Ding
Abstract: A mechanism to render a lens module immune to trembling and jarring includes a carrier, a support element movably mounted on the carrier, and a driving element. The driving element includes a conductive structure arranged on the carrier, a plurality of positive pads on the carrier, and a plurality of shape memory alloy (SMA) wires. The SMA wires are electrically connected to the positive pads and the conductive structure. When currents flow into the SMA wires via the positive pads, the SMA wires deform upon heating and pull on the conductive structure, thus the conductive structure drives the support element to rotate in a plane parallel to the carrier. A lens module and an electronic device including the mechanism are also disclosed.
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公开(公告)号:US10712642B2
公开(公告)日:2020-07-14
申请号:US16182565
申请日:2018-11-06
Applicant: TRIPLE WIN TECHNOLOGY (SHENZHEN) CO. LTD.
Inventor: Shuai-Peng Li , Jing-Wei Li , Shin-Wen Chen , Sheng-Jie Ding
Abstract: An optical projection module with improved heat dissipation includes a circuit board having a first surface and a second surface opposite the first surface. A semiconductor substrate is mounted on the first surface. The semiconductor substrate has a third surface facing the first surface and a fourth surface opposite to the third surface. A light source and an optical member are mounted on the fourth surface. The optical member includes a lens holder. The lens holder defines a receiving space for receiving the light source. The lens holder further defines at least one escaping hole. A heat dissipation block is received in each escaping hole.
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