摘要:
An ion electrode extraction assembly comprising an ion source 20 and at least one electrode 50 having a gap through which a beam of extracted ions passes in use. An electrode manipulator assembly 55 is provided to move the electrode so as to vary the width of the gap transversely to the ion beam, move the electrode transversely to the ion beam, and move the electrode in the direction of the ion beam. The three degrees of movement being carried out independently of one another.
摘要:
A fluid bearing and seal for an ion implanter is disclosed. The fluid bearing has a stator attached to a base and a moving member provided over the stator so that a fluid bearing can be formed between the opposing surfaces of the stator and the moving member. Either the base or the stator has a locating member extending normal to the bearing surface and the other one of either the base or the stator has a recess shaped to receive the locating member. A fluid seal enables the member to slide in the recess in the normal direction to seal off an enclosed volume between the member and the other one of either the stator or the base. A plurality of fixtures are distributed at points in a plane parallel to the bearing surface to fix the locating member and the other one of either the stator or the base together at these points to form the enclosed volume. The number of the fixtures is the minimum necessary so that the bearing surface of the stator remains undistorted. A fluid controller controls the supply of a fluid to the enclosed volume to maintain the planar bearing surface undistorted under the loading of the moving member.
摘要:
An ion implantation system for producing silicon wafers having relatively low defect densities, e.g., below about 1×106/cm2, includes a fluid port in the ion implantation chamber for introducing a background gas into the chamber during the ion implantation process. The introduced gas, such as water vapor, reduces the defect density of the top silicon layer that is separated from the buried silicon dioxide layer.
摘要翻译:用于生产具有相对较低缺陷密度(例如低于约1×10 6 / cm 2)的硅晶片的离子注入系统包括离子注入室中的流体端口,用于在离子注入工艺期间将背景气体引入室中。 引入的气体,例如水蒸气,降低了与掩埋二氧化硅层分离的顶部硅层的缺陷密度。
摘要:
An apparatus used to control a workpiece inside a vacuum chamber. The workpiece is supported on a workpiece holder in the vacuum chamber. The workpiece is isolated from the atmosphere outside of the vacuum chamber by differentially pumped vacuum seals and an integral air bearing support. The differentially pumped vacuum seals and integral air bearing support allow for multiple independent motions to be transmitted to the workpiece supported by the workpiece holder. The workpiece holder motions provided are (1) rotation about the X axis, (2) translation back and forth along the Y direction of an X-Y plane on the surface of the workpiece holder, and (3) rotation of the workpiece in the X-Y plane about its Z axis. Concentric seals, oval for the translation motion and circular for the rotational motion, are differentially pumped through common ports to provide successively decreasing pressure and gas flow in order to reduce the gas load into the vacuum vessel to a negligible rate.
摘要:
A guide tube for an ion beam in an ion implanter which is located adjacent a semiconductor wafer being implanted has an outwardly tapering central bore, thereby alleviating problems of beam strike as the ion beam passes through the guide tube.
摘要:
A guide tube for an ion beam in an ion implanter which is located adjacent a semiconductor wafer being implanted has an outwardly tapering central bore, thereby alleviating problems of beam strike as the ion beam passes through the guide tube.
摘要:
Semiconductor processing apparatus is disclosed which provides for movement of a scanning arm 60 of a substrate or wafer holder 180, in at least two generally orthogonal directions (so-called X-Y scanning). Scanning in a first direction is longitudinally through an aperture 55 in a vacuum chamber wall. The arm 60 is reciprocated by one or more linear motors 90A, 90B. The arm 60 is supported relative to a slide 100 using gimballed air bearings so as to provide cantilever support for the arm relative to the slide 100. A compliant feedthrough 130 into the vacuum chamber for the arm 60 then acts as a vacuum seal and guide but does not itself need to provide bearing support. A Faraday 450 is attached to the arm 60 adjacent the substrate holder 180 to allow beam profiling to be carried out both prior to and during implant. The Faraday 450 can instead or additionally be mounted adjacent the rear of the substrate holder or at 90° to it to allow beam profiling to be carried out prior to implant, with the substrate support reversed or horizontal and out of the beam line.
摘要:
An implanter provides two-dimensional scanning of a substrate relative to an implant beam so that the beam draws a raster of scan lines on the substrate. The beam current is measured at turnaround points off the substrate and the current value is used to control the subsequent fast scan speed so as to compensate for the effect of any variation in beam current on dose uniformity in the slow scan direction. The scanning may produce a raster of non-intersecting uniformly spaced parallel scan lines and the spacing between the lines is selected to ensure appropriate dose uniformity.
摘要:
A back scattered ion receiver is mounted on the process chamber of an ion implanter to receive beam ions back scattered from a wafer mounted on the wafer holder in the chamber. Minima in the intensity of back scattered ions as the wafer on the holder is moved relative to the beam direction, can be used to obtain an accurate calibration of the true beam direction. Beam direction error can then be compensated for when operating holder tilt and twist mechanisms so as to bring a process wafer accurately into the required orientation relative to the true beam. If the crystallographic alignment and orientation of process wafers has been precharacterised, this data can be used to control the wafer holder to align process wafers crystallographically to the process beam.
摘要:
An apparatus used to control a workpiece inside a vacuum chamber. The workpiece is supported on a workpiece holder in the vacuum chamber. The workpiece is isolated from the atmosphere outside of the vacuum chamber by differentially pumped vacuum seals and an integral air bearing support. The differentially pumped vacuum seals and integral air bearing support allow for multiple independent motions to be transmitted to the workpiece supported by the workpiece holder. The workpiece holder motions provided are (1) rotation about the X axis, (2) translation back and forth along the Y direction of an X-Y plane on the surface of the workpiece holder, and (3) rotation of the workpiece in the X-Y plane about its Z axis. Concentric seals, oval for the translation motion and circular for the rotational motion, are differentially pumped through common ports to provide successively decreasing pressure and gas flow in order to reduce the gas load into the vacuum vessel to a negligible rate.