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    RESIN LAYER FORMATION METHOD, RESIN LAYER FORMATION DEVICE, DISK AND DISK MANUFACTURING METHOD
    23.
    发明申请
    RESIN LAYER FORMATION METHOD, RESIN LAYER FORMATION DEVICE, DISK AND DISK MANUFACTURING METHOD 失效
    树脂层形成方法，树脂层形成装置，盘和制造方法

    公开(公告)号：US20120076947A1

    公开(公告)日：2012-03-29

    申请号：US13310469

    申请日：2011-12-02

    申请人： Tomokazu Ito ,  Hisashi Nishigaki ,  Tsukasa Kawakami ,  Haruka Narita ,  Yoji Takizawa ,  Takumi Hanada ,  Munenori Iwami

    发明人： Tomokazu Ito ,  Hisashi Nishigaki ,  Tsukasa Kawakami ,  Haruka Narita ,  Yoji Takizawa ,  Takumi Hanada ,  Munenori Iwami

    IPC分类号： B05D1/36 ,  B05D3/06

    CPC分类号： B05C11/08 ,  B05D1/005 ,  B05D7/56 ,  G11B7/266 ,  Y10T156/10 ,  Y10T428/31504

    摘要： A resin layer formation method and device for making a resin layer uniform on a substrate before lamination or on a substrate is provided. Adhesive is coated at an inner circumference side while rotating a substrate at low speed. A first adhesive layer is formed on the surface of the substrate by rotating at high speed. A step difference section is formed around a rotation center of the substrate by irradiating ultraviolet on an area in the inner circumference side of the first adhesive layer to hardening the area. Adhesive is coated at the rotation center side from the step difference section on the substrate, and a second adhesive layer is formed on the first adhesive layer by rotating the substrate at high speed. The first adhesive layer and the second adhesive layer are integrated to form a uniform adhesive layer.

    摘要翻译： 提供了一种树脂层形成方法和用于在层压之前或基板上在基板上使树脂层均匀的树脂层形成方法和装置。 在低速旋转基板的同时，在内周侧涂布粘合剂。 通过高速旋转在基板的表面上形成第一粘合剂层。 通过在第一粘合剂层的内周侧的区域上照射紫外线来硬化该区域，在基板的旋转中心周围形成台阶差分部。 在基板上的台阶差部分的旋转中心侧涂覆粘合剂，并且通过高速旋转基板，在第一粘合剂层上形成第二粘合剂层。 第一粘合剂层和第二粘合剂层被一体化以形成均匀的粘合剂层。

    D-SERINE DEHYDRATASE AND USE THEREOF
    25.
    发明申请
    D-SERINE DEHYDRATASE AND USE THEREOF 审中-公开
    D-丝氨酸脱水酶及其用途

    公开(公告)号：US20100190196A1

    公开(公告)日：2010-07-29

    申请号：US12445642

    申请日：2007-10-16

    申请人： Tohru Yoshimura ,  Tomokazu Ito

    发明人： Tohru Yoshimura ,  Tomokazu Ito

    IPC分类号： C12Q1/26 ,  C12N9/02 ,  C07H21/04 ,  C12N15/63 ,  C12N1/21 ,  C12P21/06

    CPC分类号： C12Q1/527 ,  C12N9/88 ,  G01N2333/988

    摘要： A novel D-serine quantification method that can overcome various disadvantages of a conventional D-serine quantification method; a novel enzyme that can be used in the D-serine quantification method; a gene encoding the enzyme; and the like. Specifically, a novel D-serine dehydratase including (a) a protein having an amino acid sequence set forth in SEQ ID NO: 1 or (b) a protein having an amino acid sequence homologous to the amino acid sequence set forth in SEQ ID NO: 1 and having a D-serine dehydratase activity; and a D-serine quantification method including the steps of reacting a sample with the enzyme, quantifying ammonia or pyruvic acid produced by the reaction, and calculating the amount of D-serine in the sample based on a value produced by the quantification.

    摘要翻译： 一种可以克服常规D-丝氨酸定量方法的各种缺点的新型D-丝氨酸定量方法; 可用于D-丝氨酸定量方法的新型酶; 编码酶的基因; 等等。 具体而言，是一种新型的D-丝氨酸脱水酶，其包含（a）具有SEQ ID NO：1所示的氨基酸序列的蛋白质或（b）具有与SEQ ID NO：1所示的氨基酸序列同源的氨基酸序列的蛋白质 1，具有D-丝氨酸脱水酶活性; 和D-丝氨酸定量方法，其包括使样品与酶反应，定量由反应产生的氨或丙酮酸，并根据定量产生的值计算样品中D-丝氨酸的量。

    Method for manufacturing composite structure body
    26.
    发明申请
    Method for manufacturing composite structure body 审中-公开
    复合结构体制造方法

    公开(公告)号：US20060141144A1

    公开(公告)日：2006-06-29

    申请号：US11360187

    申请日：2006-02-17

    申请人： Hironori Hatono ,  Masakatsu Kiyohara ,  Katsuhiko Mori ,  Tatsuro Yokoyama ,  Atsushi Yoshida ,  Tomokazu Ito ,  Jun Akedo

    发明人： Hironori Hatono ,  Masakatsu Kiyohara ,  Katsuhiko Mori ,  Tatsuro Yokoyama ,  Atsushi Yoshida ,  Tomokazu Ito ,  Jun Akedo

    IPC分类号： B05D1/12

    CPC分类号： C23C30/00 ,  C23C24/04 ,  Y10T428/249967 ,  Y10T428/26 ,  Y10T428/265 ,  Y10T428/31678 ,  Y10T428/31681

    摘要： A method for manufacturing a composite structure body, comprising the steps of bombarding brittle material fine particles and ductile material fine particles separately or simultaneously against a surface of a substrate with high velocities such that an anchor portion biting said substrate surface is formed; the brittle material fine particles are simultaneously distorted or fractured by impact of the bombardment; mutual rejoining of the fine particles is made through intermediary of a newly generated active surface formed by the distortion or fracture; and thereby forming a structure body, above the anchor portion, in which crystals of the brittle material and crystals and/or microstructures of the ductile material fine particles are dispersed.

    摘要翻译： 一种复合结构体的制造方法，其特征在于，包括以高速度分别或同时地将脆性材料细颗粒和延性材料细颗粒轰击到基板的表面，形成咬合所述基板表面的锚定部分的步骤; 脆性材料细颗粒通过轰击的冲击同时变形或断裂; 通过由变形或断裂形成的新生成的活性表面的介质来进行微粒的相互重合; 从而在脆性材料的晶体和延展性材料微粒的微结构分散的锚固部分上方形成结构体。

    Common-mode choke coil
    27.
    发明申请
    Common-mode choke coil 有权
    共模扼流线圈

    公开(公告)号：US20060097835A1

    公开(公告)日：2006-05-11

    申请号：US11264032

    申请日：2005-11-02

    申请人： Toshio Tomonari ,  Tomokazu Ito ,  Toshihiro Kuroshima

    发明人： Toshio Tomonari ,  Tomokazu Ito ,  Toshihiro Kuroshima

    IPC分类号： H01F5/00

    CPC分类号： H01F17/0013 ,  H01F2017/0093 ,  H03H2001/0092

    摘要： A common-mode choke coil has first and second coil parts, a first inductance part, and a second inductance part. The first coil part and the second coil part are magnetically coupled to each other. The first inductance part is electrically connected in series to the first coil part and is not substantially magnetically coupled to the first coil part. The second inductance part is electrically connected in series to the second coil part and is not substantially magnetically coupled to the second coil part. The first inductance part and the second inductance part are not substantially magnetically coupled to each other.

    摘要翻译： 共模扼流线圈具有第一和第二线圈部分，第一电感部分和第二电感部分。 第一线圈部分和第二线圈部分彼此磁耦合。 第一电感部分与第一线圈部分串联电连接，并且基本上不与第一线圈部分磁耦合。 第二电感部件与第二线圈部分串联电连接，并且基本上不与第二线圈部分磁耦合。 第一电感部分和第二电感部分实质上并不彼此磁耦合。

    Coil component and method for producing same
    28.
    发明授权
    Coil component and method for producing same 有权
    线圈部件及其制造方法

    公开(公告)号：US09236171B2

    公开(公告)日：2016-01-12

    申请号：US13880039

    申请日：2011-10-14

    申请人： Tomokazu Ito ,  Hitoshi Ohkubo ,  Yoshihiro Maeda ,  Makoto Morita ,  Toshiyuki Anbo ,  Kyohei Tonoyama ,  Manabu Ohta

    发明人： Tomokazu Ito ,  Hitoshi Ohkubo ,  Yoshihiro Maeda ,  Makoto Morita ,  Toshiyuki Anbo ,  Kyohei Tonoyama ,  Manabu Ohta

    IPC分类号： H01F5/00 ,  H01F27/28 ,  H01F3/08 ,  H01F17/04 ,  H01F27/32 ,  H01F41/04 ,  H01F27/255

    CPC分类号： H01F3/08 ,  H01F5/003 ,  H01F17/04 ,  H01F27/255 ,  H01F27/324 ,  H01F41/04 ,  H01F2017/048 ,  Y10T29/4902 ,  Y10T29/49075

    摘要： A coil component includes: an insulating resin layer provided between a first planar spiral conductor formed on a back surface of a first substrate and a second planer spiral conductor formed on a back surface of a second substrate; an upper core covering a third second planer spiral conductor formed on a front surface of the first substrate on which the insulating resin layer is formed; and a lower core covering a fourth planer spiral conductor formed on a front surface of the second substrate on which the insulating resin layer is formed. One of the upper and lower cores is formed of a metal-magnetic-powder-containing resin. The coil component includes connecting portions disposed respectively at center and outside portions of each of the first and second substrates so as to physically connect the upper and lower cores.

    摘要翻译： 线圈部件包括：绝缘树脂层，设置在形成在第一基板的背面上的第一平面螺旋导体和形成在第二基板的背面上的第二平面螺旋导体之间; 覆盖形成在其上形成有绝缘树脂层的第一基板的前表面上的第三第二平面螺旋形导体的上芯; 以及覆盖形成在其上形成有绝缘树脂层的第二基板的前表面上的第四平面螺旋形导体的下芯。 上下芯之一由含金属磁粉的树脂形成。 线圈部件包括分别设置在第一和第二基板中的每一个的中心部分和外部部分的连接部分，以物理地连接上部和下部芯部。

    Coil component and method of manufacturing the same
    29.
    发明授权
    Coil component and method of manufacturing the same 有权
    线圈部件及其制造方法

    公开(公告)号：US08451083B2

    公开(公告)日：2013-05-28

    申请号：US13149114

    申请日：2011-05-31

    申请人： Takeshi Okumura ,  Tomokazu Ito

    发明人： Takeshi Okumura ,  Tomokazu Ito

    IPC分类号： H01F5/00 ,  H01F27/28

    CPC分类号： H01F5/003 ,  H01F17/0013 ,  H01F17/04 ,  H01F27/292

    摘要： A coil component is provided with a magnetic substrate made of magnetic ceramic material, a thin-film coil layer containing a coil conductor formed on one principal surface of the magnetic substrate, a plurality of bump electrodes formed on the principal surface of the thin-film coil layer, and an insulating resin layer formed on the principal surface of the thin-film coil layer excluding formation positions of the bump electrodes. Each bump electrode has an exposure surface on a bottom surface and on two side surfaces of a layered product composed of the magnetic substrate, the thin-film coil layer and the insulating resin layer. A corner of the each bump electrode has a notch portion. The insulating resin layer includes a center resin portion provided in a center of the principal surface of the thin-film coil layer and a plurality of corner resin portions provided in the notch portion of each bump electrode.

    摘要翻译： 线圈部件设置有由磁性陶瓷材料制成的磁性基板，薄膜线圈层，其包含形成在磁性基板的一个主表面上的线圈导体，形成在薄膜的主表面上的多个凸块电极 线圈层和形成在除了凸起电极的形成位置之外的薄膜线圈层的主表面上的绝缘树脂层。 每个凸块电极在底表面和由磁性基板，薄膜线圈层和绝缘树脂层构成的层叠体的两个侧表面上具有曝光表面。 每个凸起电极的角部具有切口部分。 绝缘树脂层包括设置在薄膜线圈层的主表面的中心的中心树脂部分和设置在每个凸起电极的凹口部分中的多个角部树脂部分。

    Composite electronic device and digital transmission circuit using thereof
    30.
    发明授权
    Composite electronic device and digital transmission circuit using thereof 有权
    复合电子装置及其数字传输电路

    公开(公告)号：US08373954B2

    公开(公告)日：2013-02-12

    申请号：US12692129

    申请日：2010-01-22

    申请人： Tomokazu Ito ,  Yasuhiro Hirobe ,  Atsushi Hitomi ,  Yuji Terada ,  Kensaku Asakura ,  Takeshi Urano

    发明人： Tomokazu Ito ,  Yasuhiro Hirobe ,  Atsushi Hitomi ,  Yuji Terada ,  Kensaku Asakura ,  Takeshi Urano

    IPC分类号： H02H9/00

    CPC分类号： H03H7/0107 ,  H03H7/427 ,  H03H2001/0085

    摘要： A composite electronic device includes first and second magnetic substrates, and a functional layer sandwiched between these magnetic substrates, and the functional layer is configured by a common-mode filter layer and a ESD protection element layer. An electrostatic capacitance of the ESD protection elements is equal to or lower than 0.35 pF. The common-mode filter layer includes a first spiral conductor formed on an insulation layer, and a second spiral conductor formed on an insulation layer. DC resistance of a common mode filter is equal to or higher than 0.5Ω and equal to or lower than 5Ω, and an electrostatic capacitance of the ESD protection elements is equal to or lower than 0.35 pF. A width W and a length L of the first and second spiral conductors satisfy a relational equation expressed by √(L/W)

    摘要翻译： 复合电子器件包括第一和第二磁性基板以及夹在这些磁性基板之间的功能层，功能层由共模滤波器层和ESD保护元件层构成。 ESD保护元件的静电电容等于或低于0.35pF。 共模滤波器层包括形成在绝缘层上的第一螺旋导体和形成在绝缘层上的第二螺旋导体。 共模滤波器的直流电阻等于或高于0.5＆OHgr; 并且等于或低于5＆OHgr;并且ESD保护元件的静电电容等于或低于0.35pF。 第一和第二螺旋导体的宽度W和长度L满足由（L / W）<（7.6651-fc）/0.1385表示的关系式。