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公开(公告)号:US07126361B1
公开(公告)日:2006-10-24
申请号:US11195990
申请日:2005-08-03
IPC分类号: G01R31/02
CPC分类号: G01R1/07342 , G01R1/06727
摘要: A probe card is vertically mounted generally perpendicular to a wafer undergoing life tests in a heated environment to limit exposure of the probe card to heat from the wafer chuck. The probe card and probe head assembly are mounted on a support rail which has one or more channels for the flow of cool air to a probe head assembly and the probe card, while it shields the flex cable from the hot chuck. The cool air flow disrupts convective hot air flow upwards from the heated chuck to the probe card and probe head and facilitates cooling of the probe card and probe head.
摘要翻译: 探针卡通常垂直于垂直于在加热环境中进行寿命测试的晶片垂直安装,以将探针卡暴露于晶片卡盘的热量。 探针卡和探针头组件安装在支撑轨道上,该支撑轨道具有一个或多个通道,用于将冷空气流动到探头头部组件和探针卡,同时屏蔽柔性电缆与热卡盘。 冷气流破坏对流热气流从加热卡盘向上探针卡和探针头,并有助于冷却探针卡和探针头。