公开(公告)号：US20100116423A1

公开(公告)日：2010-05-13

申请号：US12266613

申请日：2008-11-07

申请人： Zachary Justin Reitmeier

发明人： Zachary Justin Reitmeier

IPC分类号： B32B37/02 ,  C23F1/08

CPC分类号： B41J2/1631 ,  B41J2/1603 ,  B41J2/1623 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1632 ,  B41J2/1634 ,  B41J2/1645

摘要： A micro-fluid ejection device is assembled by wafer-to-wafer bonding at a temperature below about 150° C. a first silicon oxide layer of a first wafer, having flow features patterned in the first silicon oxide layer on an actuator chip in a first silicon substrate of the first wafer, to a second silicon oxide layer of a second wafer, defining a nozzle plate on a second silicon substrate of the second wafer. Nozzle holes are formed in the nozzle plate in alignment with actuator elements of the actuator chip of the first wafer either before or after bonding the first and second wafers together. The second silicon substrate of the second wafer is used as a handle and then removed from the silicon oxide layer of the second wafer after bonding the first and second wafers together.

摘要翻译： 微流体喷射装置在低于约150℃的温度下通过晶片与晶片结合来组装第一晶片的第一氧化硅层，其具有在第一氧化硅层中图案化的致动器芯片上的流动特征 第一晶片的第一硅衬底，到第二晶片的第二氧化硅层，在第二晶片的第二硅衬底上限定喷嘴板。 在将第一和第二晶片结合在一起之前或之后，在喷嘴板中形成与第一晶片的致动器芯片的致动器元件对准的喷嘴孔。 将第二晶片的第二硅衬底用作手柄，然后在将第一和第二晶片接合在一起之后从第二晶片的氧化硅层去除。