公开(公告)号：US20140355202A1

公开(公告)日：2014-12-04

申请号：US14291842

申请日：2014-05-30

申请人： Bull SAS

发明人： Georges LECOURTIER

IPC分类号： H05K7/20 ,  F28D15/02

CPC分类号： H05K7/20781 ,  F28D15/02 ,  H05K7/20736 ,  H05K7/20772 ,  H05K7/2079 ,  H05K7/20818 ,  H05K7/20836

摘要： A cooling system for the electronic components of a computer rack, including a primary circuit of primary liquid; a primary exchanger intended to transfer heat from first electronic components to the primary liquid; a secondary circuit of refrigerant fluid; a primary-secondary exchanger; a tertiary circuit of tertiary liquid; a secondary-tertiary exchanger; and a tertiary-thermal source exchanger. The cooling system also includes a tertiary-secondary exchanger; and an air-tertiary exchanger intended to transfer, to the tertiary liquid, heat from the air of the computer rack heated by second electronic components, the air-tertiary exchanger being arranged, in the tertiary circuit, downstream of the tertiary-secondary exchanger and upstream of the secondary-tertiary exchanger.

摘要翻译： 一种用于计算机机架的电子部件的冷却系统，包括初级液体的初级回路; 用于将热量从第一电子部件传递到初级液体的主要交换器; 制冷剂流体的二次回路; 一级辅助交换机; 三级液体三级回路; 二级三级交换机; 和三级热源交换器。 冷却系统还包括一个三级交换器; 以及用于将由第二电子部件加热的计算机机架的空气中的热量传送到第三液体的空气三次换热器，第三回路中的空气三次换热器设置在三次侧交换器的下游， 二次 - 三次交换器上游。

公开(公告)号：US20140268547A1

公开(公告)日：2014-09-18

申请号：US14290910

申请日：2014-05-29

申请人： FUJITSU LIMITED

发明人： Masao KONDO ,  Hiroyuki FUKUDA ,  Shigeyoshi UMEMIYA ,  Hiroshi ENDO

IPC分类号： H05K7/20

CPC分类号： H05K7/20736 ,  G06F1/206 ,  G06F2200/201 ,  H05K7/20818 ,  H05K7/20836 ,  Y02D10/16

摘要： An electronic device rack includes a plurality of panels surrounding a first space. Moreover, the electronic device rack includes: an electronic-device housing unit disposed in the first space and configured to house electronic devices; a heat exchanger disposed in the first space at a position away from the electronic-device housing unit; a second space provided between the electronic-device housing unit and the heat exchanger and isolated from the rest of the first space; and an air blower configured to circulate air inside the first space through the electronic-device housing unit, the second space, and the heat exchanger in the described order.

摘要翻译： 电子设备机架包括围绕第一空间的多个面板。 此外，电子设备机架包括：电子设备壳体单元，设置在第一空间中，并且被构造成容纳电子设备; 热交换器，其设置在远离所述电子设备壳体单元的位置处的所述第一空间中; 设置在所述电子设备壳体单元和所述热交换器之间并与所述第一空间的其余部分隔离的第二空间; 以及鼓风机，其被构造成以所述顺序通过所述电子设备壳体单元，所述第二空间和所述热交换器使所述第一空间内的空气循环。

公开(公告)号：US20140218858A1

公开(公告)日：2014-08-07

申请号：US13757727

申请日：2013-02-01

申请人： DELL PRODUCTS L.P.

发明人： Austin Michael Shelnutt ,  James D. Curlee ,  Jimmy Pike

IPC分类号： G06F1/20

CPC分类号： G06F1/206 ,  H05K7/203 ,  H05K7/20809 ,  H05K7/20818 ,  H05K7/20827

摘要： A stand-alone immersion tank datacenter (SITDC) includes: a multi-phase heat transfer immersion cooling tank having external walls surrounding a tank volume within which a dielectric liquid is maintained and heated to a boiling point temperature; a plurality of servers having one or more processing and memory components submerged within the dielectric liquid for cooling of the one or more components via heat dissipation from the one or more components into the dielectric liquid when the one or more components are connected to an electric power supply; and a condenser located vertically above the plurality of servers and in a direct path of rising dielectric vapor created when the dielectric liquid absorbs sufficient heat from the one or more components to reach a boiling point temperature of the liquid. The condenser can be a passive heat exchanger, created by providing a heat conductive material as a top lid of the tank.

摘要翻译： 一个独立的浸池数据中心（SITDC）包括：多相传热浸没冷却槽，其具有围绕容器容积的外壁，其中保持介电液体并加热至沸点温度; 多个服务器具有浸没在电介质液体中的一个或多个处理和存储器组件，用于当一个或多个组件连接到电力时，通过从一个或多个组件散热到电介质液体来冷却一个或多个组件 供应; 以及位于多个服务器上方并且当介电液体从一个或多个组分吸收足够的热量以达到液体的沸点温度时产生的升高的介电蒸汽的直接路径中的冷凝器。 冷凝器可以是被动热交换器，通过提供导热材料作为罐的顶盖而产生。

公开(公告)号：US20140043762A1

公开(公告)日：2014-02-13

申请号：US14055401

申请日：2013-10-16

申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION

发明人： Eric A. ECKBERG ,  David P. GRAYBILL ,  Madhusudan K. IYENGAR ,  Howard V. MAHANEY, JR. ,  Roger R. SCHMIDT ,  Kenneth R. SCHNEEBELI

IPC分类号： H05K7/20 ,  B23P15/26

CPC分类号： B23P15/26 ,  H05K7/20718 ,  H05K7/2079 ,  H05K7/20818 ,  Y10T29/4935

摘要： An air-cooling apparatus is provided which includes a securing mechanism for holding two or more separate electronics racks in fixed relation adjacent to each other, and a multi-rack door sized and configured to span the air inlet or air outlet sides of the racks. The securing mechanism holds the electronics racks in fixed relation with their air inlet sides facing a first direction, and air outlet sides facing a second direction. The door includes a door frame with an airflow opening. The airflow opening facilitates the ingress or egress of airflow through the electronics racks, and the door further includes an air-to-liquid heat exchanger supported by the door frame, and disposed so that air flowing through the airflow opening passes across the heat exchanger. In operation, the heat exchanger extracts heat from the air passing through the separate electronics racks.

公开(公告)号：US08601827B2

公开(公告)日：2013-12-10

申请号：US13662636

申请日：2012-10-29

申请人： Earl Keisling ,  John Costakis ,  Gerald McDonnell

发明人： Earl Keisling ,  John Costakis ,  Gerald McDonnell

IPC分类号： F25B49/00 ,  F25D17/00

CPC分类号： H05K7/20827 ,  F25B49/00 ,  F25D17/00 ,  F28D15/00 ,  G06F1/20 ,  H01L23/34 ,  H01L23/473 ,  H01L2924/0002 ,  H05K7/20218 ,  H05K7/20754 ,  H05K7/20763 ,  H05K7/20781 ,  H05K7/20818 ,  H01L2924/00

摘要： A space-saving, high-density modular data pod system and an energy-efficient cooling system are disclosed. The modular data pod system includes a central free-cooling system and a plurality of modular data pods, each of which includes a heat exchange assembly coupled to the central free-cooling system, and a distributed mechanical cooling system coupled to the heat exchange assembly. The modular data pods include a data enclosure having at least five walls arranged in the shape of a polygon, a plurality of computer racks arranged in a circular or U-shaped pattern, and a cover to create hot and cold aisles, and an air circulator configured to continuously circulate air between the hot and cold aisles. Each modular data pod also includes an auxiliary enclosure containing a common fluid and electrical circuit section that is configured to connect to adjacent common fluid and electrical circuit sections to form a common fluid and electrical circuit that connects to the central free-cooling system. The auxiliary enclosure contains at least a portion of the distributed mechanical cooling system, which is configured to trim the cooling performed by the central free-cooling system.

摘要翻译： 公开了一种节省空间的高密度模块化数据盒系统和节能冷却系统。 模块化数据盒系统包括中央自由冷却系统和多个模块化数据盒，每个模块化数据盒包括耦合到中央自由冷却系统的热交换组件和耦合到热交换组件的分布式机械冷却系统。 模块化数据盒包括具有布置成多边形形状的至少五个壁的数据外壳，以圆形或U形图案布置的多个计算机机架以及用于产生热和冷通道的盖子，以及空气循环器 配置为在热通道和冷通道之间连续循环空气。 每个模块化数据盒还包括一个包含公共流体和电路部分的辅助外壳，其配置成连接到相邻的公共流体和电路部分，以形成连接到中央自由冷却系统的公共流体和电路。 辅助外壳包含分布式机械冷却系统的至少一部分，其被配置为修剪由中央自由冷却系统执行的冷却。

公开(公告)号：US20120291465A1

公开(公告)日：2012-11-22

申请号：US13473685

申请日：2012-05-17

申请人： Yasuhiro KASHIRAJIMA ,  Junichi ITO ,  Yasuhiko INADOMI ,  Tomohiro YOSHIDA ,  Teruo MIKAMI

发明人： Yasuhiro KASHIRAJIMA ,  Junichi ITO ,  Yasuhiko INADOMI ,  Tomohiro YOSHIDA ,  Teruo MIKAMI

IPC分类号： F25B49/00

CPC分类号： H05K7/20818 ,  H05K7/20836

摘要： A cooling system for electronic equipment includes an evaporator cooling the electronic equipment, a blower making air heated by the electronic equipment flow into the evaporator, and a condenser condensing a refrigerant to be supplied to the evaporator and also includes a refrigerant liquid pipe guiding a liquefied refrigerant from the condenser to a lower part of the evaporator, a refrigerant gas pipe guiding the refrigerant which evaporates by cooling the electronic equipment from an upper part of the evaporator to the condenser, a refrigerant flow rate control valve controlling a flow rate of the refrigerant flowing into the evaporator, a temperature sensor detecting a temperature of air obtained after passing through the evaporator, and a controller for control valve controlling the control valve on the basis of a detection value of the temperature sensor.

摘要翻译： 一种用于电子设备的冷却系统包括冷却电子设备的蒸发器，使由电子设备加热到空气中的空气进入蒸发器的鼓风机和冷凝供给蒸发器的制冷剂的冷凝器，还包括引导液化的 从冷凝器到蒸发器的下部的制冷剂，通过将电子设备从蒸发器的上部冷却至冷凝器而蒸发的制冷剂的制冷剂气体管道，控制制冷剂的流量的制冷剂流量控制阀 流入蒸发器的温度传感器，检测通过蒸发器后获得的空气的温度的温度传感器，以及基于温度传感器的检测值控制控制阀的控制器。

公开(公告)号：US20120279684A1

公开(公告)日：2012-11-08

申请号：US13517089

申请日：2011-07-13

申请人： Earl Keisling ,  John Costakis ,  Gerald McDonnell

发明人： Earl Keisling ,  John Costakis ,  Gerald McDonnell

IPC分类号： G06F1/20 ,  F25B39/02 ,  H05K7/20

CPC分类号： H05K7/20818 ,  F28D1/0477 ,  F28D1/05383 ,  F28D2021/0028 ,  F28D2021/0068 ,  G06F1/20 ,  G06F2200/201 ,  H05K7/20736 ,  H05K7/20745 ,  H05K7/20827

摘要： A system for cooling electronic equipment includes first and second heat exchangers and a condenser. The first exchanger is disposed in an airflow in thermal communication with electronic equipment and is configured to receive a cooling fluid at a first temperature. The first exchanger enables heat transfer from the airflow to the cooling fluid to heat the cooling fluid to a second temperature. The second exchanger is disposed in the airflow between the first exchanger and the electronic equipment and is configured to receive the cooling fluid at the second temperature. The second exchanger enables heat transfer from the airflow to the cooling fluid to heat the cooling fluid to a third temperature. The condenser is configured to receive the cooling fluid at the third temperature and is configured to enable heat transfer from the cooling fluid to a cooling source to cool the cooling fluid to the first temperature.

摘要翻译： 一种用于冷却电子设备的系统包括第一和第二热交换器和冷凝器。 第一交换器设置在与电子设备热连通的气流中，并且被配置为在第一温度下接收冷却流体。 第一交换器允许从气流到冷却流体的热传递，以将冷却流体加热到第二温度。 第二交换器设置在第一交换器和电子设备之间的气流中，并且被配置为在第二温度下接收冷却流体。 第二交换器使得能够从气流到冷却流体的热传递，以将冷却流体加热到第三温度。 冷凝器被配置为在第三温度下接收冷却流体，并且被配置为使得能够从冷却流体到冷却源的热传递以将冷却流体冷却至第一温度。

公开(公告)号：US20120133256A1

公开(公告)日：2012-05-31

申请号：US13338939

申请日：2011-12-28

申请人： Earl Keisling ,  John Costakis ,  Gerald McDonnell

发明人： Earl Keisling ,  John Costakis ,  Gerald McDonnell

IPC分类号： H05K7/20 ,  H05K5/02

CPC分类号： H05K7/20827 ,  F25B49/00 ,  F25D17/00 ,  F28D15/00 ,  G06F1/20 ,  H01L23/34 ,  H01L23/473 ,  H01L2924/0002 ,  H05K7/20218 ,  H05K7/20754 ,  H05K7/20763 ,  H05K7/20781 ,  H05K7/20818 ,  H01L2924/00

摘要： A space-saving, high-density modular data pod and a method of cooling a plurality of computer racks are disclosed. The modular data pod includes an enclosure including wall members contiguously joined to one another along at least one edge of each wall member in the shape of a polygon and a data pod covering member. Computer racks arranged within the enclosure form a first volume between the inner surface of the wall members and first sides of the computer racks. A second volume is formed of second sides of the computer racks. A computer rack covering member encloses the second volume and the data pod covering member form a third volume coupling the first volume to the second volume. An air circulator continuously circulates air through the first, second, and third volumes. The method includes circulating air between the first and second volumes via the third volume and the computer racks.

摘要翻译： 公开了一种节省空间的高密度模块化数据盒和冷却多个计算机机架的方法。 所述模块化数据盒包括一个外壳，其包括沿多边形形状的每个壁构件的至少一个边缘和数据盒盖构件彼此连续地连接的壁构件。 布置在外壳内的计算机机架形成在壁构件的内表面和计算机机架的第一侧之间的第一容积。 第二容积由计算机机架的第二面形成。 计算机机架覆盖构件包围第二容积，并且数据盒盖构件形成将第一容积耦合到第二容积的第三容积。 空气循环器使空气连续地循环通过第一，第二和第三容积。 该方法包括经由第三体积和计算机机架在第一和第二体积之间循环空气。

公开(公告)号：US08077462B2

公开(公告)日：2011-12-13

申请号：US12552479

申请日：2009-09-02

申请人： Wayne A. Barringer ,  David P. Graybill ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  James J. Steffes ,  Gerard V. Weber, Jr.

发明人： Wayne A. Barringer ,  David P. Graybill ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  James J. Steffes ,  Gerard V. Weber, Jr.

IPC分类号： H05K7/20

CPC分类号： H05K7/20781 ,  H05K7/2079 ,  H05K7/20818 ,  Y10T29/4935

摘要： A cooling apparatus and method are provided which include an air-to-liquid heat exchanger and system coolant inlet and outlet plenums mounted to an electronics rack door along an edge of the door remote from the edge hingedly mounted to the rack. The plenums are in fluid communication with the heat exchanger and respectively include an inlet and outlet. Coolant supply and return hoses are disposed above the electronics rack and couple the inlet plenum to a coolant supply header and the outlet plenum to a coolant return header. The hoses are sufficiently long and flexible to open or close the door. A stress relief structure is attached to the top of the door and clamps the supply and return hoses in fixed relation to relieve stress on connect couplings at the ends of the hoses to the plenum inlet and outlet during opening or closing of the door.

摘要翻译： 提供了一种冷却装置和方法，其包括空气 - 液体热交换器和系统冷却剂入口和出口集气室，其沿着门的边缘安装到电子机架门，远离铰接安装到机架的边缘。 增压室与热交换器流体连通，分别包括入口和出口。 冷却剂供应和返回软管设置在电子机架上方，并将进气室连接到冷却剂供应集管，并将出口压力室连接到冷却剂返回集管。 软管足够长且灵活以打开或关闭门。 应力消除结构连接到门的顶部，并且固定地夹紧供应和返回软管，以在门的打开或关闭期间将软管端部处的连接联接器上的压力释放到通风口入口和出口。

公开(公告)号：US20110297351A1

公开(公告)日：2011-12-08

申请号：US13201443

申请日：2009-11-05

申请人： Shaun Andrew Vosper ,  Michael Gee

发明人： Shaun Andrew Vosper ,  Michael Gee

IPC分类号： F28F9/00

CPC分类号： H05K7/20818

摘要： There is provided an electronic equipment cabinet including a cabinet carcass (15) mounting fan cooled equipment (16) venting to the cabinet rear. A hinged front closure assembly (11) includes a frame (14) and an outer filter and perforated metal screen assembly on the outer face of the frame, and a lower condensation trap (20). The frame 14 supports an evaporator assembly (11) connected to a remote compressor/condenser assembly (not shown). The evaporator assembly includes a combined dew point sensor and thermostat (13). A non-woven filter web (19) acts a micro-droplet catcher on the inner face of the door assembly.

摘要翻译： 提供了一种电子设备柜，其包括安装风扇冷却设备（16）的柜体（15），该风扇冷却设备（16）通向柜体后部。 铰接的前封闭组件（11）包括在框架的外表面上的框架（14）和外过滤器和穿孔的金属筛网组件，以及下冷凝阱（20）。 框架14支撑连接到远程压缩机/冷凝器组件（未示出）的蒸发器组件（11）。 蒸发器组件包括组合露点传感器和恒温器（13）。 无纺布过滤网（19）作用在门组件的内表面上的微滴捕获器。