公开(公告)号：US06483664B2

公开(公告)日：2002-11-19

申请号：US09409430

申请日：1999-09-30

申请人： Akifumi Kamijima

发明人： Akifumi Kamijima

IPC分类号： G11B5147

CPC分类号： G11B5/3967 ,  G11B5/3116 ,  G11B5/313

摘要： A thin film magnetic head with a sufficient over write characteristic and a small magnetic pole width. A sub-pole tip is formed to cover the edge opposite to the air-bearing surface of a pole tip. The part where the sub-pole tip and the pole tip are overlapped is used as a sub-magnetic pole portion. The volume of the sub-magnetic pole portion is larger than that of a magnetic pole portion which consists of only the pole tip. Thereby, the saturation of the flux in a region in vicinity of the position of throat height 0 is suppressed and thus a sufficient over write characteristic is achieved.

摘要翻译： 具有足够的写写特性和小磁极宽度的薄膜磁头。 形成副极尖以覆盖与极尖的空气轴承表面相对的边缘。 副极尖和极尖重叠的部分用作子磁极部分。 子磁极部的体积大于仅由极尖构成的磁极部的体积。 由此，能够抑制喉部高度0附近的区域内的通量的饱和，从而实现充分的过写特性。

公开(公告)号：US06373657B1

公开(公告)日：2002-04-16

申请号：US09369253

申请日：1999-08-06

申请人： Akifumi Kamijima

发明人： Akifumi Kamijima

IPC分类号： G11B531

CPC分类号： B82Y25/00 ,  B82Y10/00 ,  G11B5/3106 ,  G11B5/3116 ,  G11B5/313 ,  G11B5/3133 ,  G11B5/3146 ,  G11B5/3163 ,  G11B5/3909 ,  G11B5/3967 ,  Y10T29/49043 ,  Y10T29/49044 ,  Y10T29/49046 ,  Y10T29/49048 ,  Y10T29/49052

摘要： A first magnetic film, a gap film, a thin film coil supported by a insulated film and a second magnetic film are formed in turn. The second magnetic film has a pole part opposite to the first magnetic film via the gap film and a yoke part extending backward from the pole part to be magnetically connected to the first magnetic film. The forefront surface of the yoke part is receded from an air bearing surface. The pole part of the second magnetic film has a step d1 in a running direction of a magnetic recording medium and a step d2 in the perpendicular direction to the running direction within the yoke forefront surface and its periphery as is viewed from the yoke forefront surface. A protective film embeds the steps d1 and d2, and covers an inductive type thin film magnetic head element entirely. Thereby, without debasing the overwrite characteristic when the pole part is miniaturized, a thin film magnetic head having a narrowed track width can be provided.

摘要翻译： 依次形成第一磁性膜，间隙膜，由绝缘膜支撑的薄膜线圈和第二磁性膜。 第二磁性膜具有通过间隙膜与第一磁性膜相对的极性部分和从磁极部分向后延伸以磁性连接到第一磁性膜的磁轭部分。 磁轭部件的前表面从空气轴承表面退出。 第二磁性膜的磁极部分在从磁轭最前端面观察时，在磁轭记录介质的行进方向上具有台阶d1，并且在磁轭前端面及其周边的行进方向的垂直方向上具有台阶d2。 保护膜嵌入台阶d1和d2，并且完全覆盖感应式薄膜磁头元件。 由此，在磁极部小型化的情况下，不降低重写特性，可以提供具有窄轨道宽度的薄膜磁头。

公开(公告)号：US06226147B1

公开(公告)日：2001-05-01

申请号：US09362567

申请日：1999-07-28

申请人： Akifumi Kamijima

发明人： Akifumi Kamijima

IPC分类号： G11B517

CPC分类号： G11B5/313 ,  G11B5/17

摘要： A thin-film magnetic head includes a thin-film magnetic circuit that contains a coil conductor with at least one surface. The coil conductor includes a plurality of grooves for reducing electrical resistance of the coil conductor due to skin effect. The grooves are formed on the at least one surface of the coil conductor to run along axis of the coil conductor.

摘要翻译： 薄膜磁头包括具有至少一个表面的线圈导体的薄膜磁路。 线圈导体包括多个槽，用于降低由于皮肤效应引起的线圈导体的电阻。 沟槽形成在线圈导体的至少一个表面上，以沿着线圈导体的轴线延伸。

公开(公告)号：US06168501A

公开(公告)日：2001-01-02

申请号：US09361615

申请日：1999-07-27

申请人： Akifumi Kamijima

发明人： Akifumi Kamijima

IPC分类号： B24B100

CPC分类号： B24B37/048 ,  B24B37/042

摘要： A method of grinding a microelectronic device includes a step of preparing an abrasive member by crushing a solid-phase liquid into massive form and by compacting the crushed solid-phase liquid, an abrasive member by compacting a solid-phase gas, or an abrasive member by crushing a solid-phase liquid into massive form, by mixing the crushed solid-phase liquid with a solid-phase gas and by compacting the mixed solid-phase liquid and solid-phase gas, and a step of pressing a surface of the microelectronic device to be ground against the abrasive member.

摘要翻译： 研磨微电子器件的方法包括以下步骤：通过将固相液体破碎为块状并通过压实固相气体或磨料构件来压实破碎的固相液体，研磨部件来制备研磨部件 通过将固相液体粉碎成块状，通过将破碎的固相液体与固相气体混合并通过压缩混合固相液相和固相气体，以及将微电子 装置被研磨抵靠研磨部件。

公开(公告)号：US5932396A

公开(公告)日：1999-08-03

申请号：US941038

申请日：1997-09-30

申请人： Akifumi Kamijima

发明人： Akifumi Kamijima

IPC分类号： G03F7/023 ,  G11B5/31 ,  H01F41/02 ,  G03C5/00

CPC分类号： G03F7/023 ,  G11B5/3163 ,  H01F41/026 ,  G11B5/3116 ,  Y10T29/49032

摘要： A resist composition is used to form a plating frame including a space having a section of up to 2 .mu.m in width and at least 4 .mu.m in depth. The resist composition contains as an alkali-soluble resin and a sensitizer a novolak resin obtained by substituting a hydrogen atom in a hydroxyl group in a novolak resin comprising at least one recurring unit represented by the following formula (1): ##STR1## wherein n is an integer of 1 to 4 and m is an integer of 0 to 3, and having a weight average molecular weight of 2,000 to 6,000 calculated as polystyrene by 0.12 to 0.22 moles per hydrogen atom of a 1,2-naphthoquinonediazidosulfonyl group.

摘要翻译： 抗蚀剂组合物用于形成电镀框架，其包括宽度为2μm，深度为至少4μm的截面的空间。 抗蚀剂组合物含有作为碱溶性树脂和敏化剂的酚醛清漆树脂，该酚醛清漆树脂由包含至少一个由下式（1）表示的重复单元的酚醛清漆树脂中的羟基取代：其中n是整数 为1〜4，m为0〜3的整数，重均分子量为2000〜6,000，聚苯乙烯换算为0.12〜0.22摩尔/氢醌的1,2-萘醌二叠氮基磺酰基。

公开(公告)号：US5725997A

公开(公告)日：1998-03-10

申请号：US686911

申请日：1996-07-26

申请人： Akifumi Kamijima

发明人： Akifumi Kamijima

IPC分类号： G03F7/20 ,  G03F7/38 ,  H01L43/12 ,  G03F7/40

CPC分类号： G03F7/38 ,  G03F7/2022 ,  H01L43/12

摘要： A resist pattern formed on a substrate has a T-shaped cross section including a stem portion extending from the substrate surface and a cap portion connected to the stem portion and spaced from the substrate surface. Provided that .alpha. is a minimum of the angle which is defined between a tangent at the lower edge of the cap portion and the substrate surface, and h is the spacing between the lower edge of the cap portion and the substrate surface at an intermediate position, .alpha. and, h fall within a range defined and encompassed by tetragon ABCD wherein A: .alpha.=0.degree., h=0.01 .mu.m, B: .alpha.=20.degree., h=0.01 .mu.m, C: .alpha.=20.degree., h=0.2 .mu.m, and D: .alpha.=0.degree., h=0.3 .mu.m. In a patterning process including the steps of coating of a resist composition to form a resist coating, exposure, reversal baking and development, at least one condition is changed by reducing the thickness of the resist coating, reducing an exposure dose, lowering a reversal baking temperature, reducing a reversal baking time, increasing a developer temperature or extending a developing time such that a resist pattern of T-shaped cross section may be formed.

摘要翻译： 形成在基板上的抗蚀剂图案具有包括从基板表面延伸的杆部分的T形横截面和连接到杆部分并与基板表面间隔开的盖部分。 假设α是在盖部分的下边缘处的切线和基板表面之间限定的角度的最小值，h是盖部分的下边缘和中间位置处的基板表面之间的间隔， α和h落在由四边形ABCD限定和包围的范围内，其中A：α= 0°，h =0.01μm，B：α= 20°，h =0.01μm，C：α= 20°，h = 0.2μm，D：α= 0°，h =0.3μm。 在包括涂覆抗蚀剂组合物以形成抗蚀剂涂层，曝光，反转烘烤和显影的步骤的图案化工艺中，通过减小抗蚀剂涂层的厚度，降低曝光剂量，降低反转烘烤来改变至少一个条件 降低反转烘烤时间，提高显影剂温度或延长显影时间，从而可形成T形横截面的抗蚀剂图案。

公开(公告)号：US07947428B2

公开(公告)日：2011-05-24

申请号：US11235112

申请日：2005-09-27

申请人： Akifumi Kamijima

发明人： Akifumi Kamijima

IPC分类号： H01F27/28 ,  H01F5/00

CPC分类号： G03F7/0387 ,  H01F17/0006 ,  H01F41/042 ,  H05K3/0023 ,  H05K3/28 ,  H05K2201/0154 ,  H05K2203/0577

摘要： The present invention provides a method for forming a photosensitive polyimide pattern 38 on a metal conductor 32, comprising carrying out the following steps (A) to (E) in this order: (A) a step of forming an ester bond type photosensitive polyimide precursor layer 33 by applying an ester bond type photosensitive polyimide precursor composition onto the metal conductor 32; (B) a step of forming an ion bond type photosensitive polyimide precursor layer 34 by applying an ion bond type photosensitive polyimide precursor composition onto the precursor layer 33 until the thickness of the precursor layer 34 reaches a desired thickness; (C) a step of exposing through a mask 35 and transferring the mask pattern as a latent image 36 onto the precursor layers 33 and 34; (D) a step of developing; and (E) a step of forming a polyimide pattern 38 by curing the developed precursor layers 33 and 34.

摘要翻译： 本发明提供了一种在金属导体32上形成光敏聚酰亚胺图案38的方法，包括以下顺序执行以下步骤（A）至（E）：（A）形成酯键型光敏聚酰亚胺前体 通过将酯键型感光性聚酰亚胺前体组合物施加到金属导体32上而形成层33; （B）通过将离子键型光敏聚酰亚胺前体组合物施加到前体层33上直到前体层34的厚度达到所需厚度为止形成离子键型光敏聚酰亚胺前体层34的步骤; （C）通过掩模35曝光并将掩模图案作为潜像36转印到前体层33和34上的步骤; （四）发展的步骤; 和（E）通过固化显影的前体层33和34来形成聚酰亚胺图案38的步骤。

公开(公告)号：US07854829B2

公开(公告)日：2010-12-21

申请号：US11812175

申请日：2007-06-15

申请人： Akifumi Kamijima ,  Atsushi Yamaguchi ,  Masahiro Saito ,  Shingo Miyata ,  Yuji Otsubo ,  Souhei Horiuchi

发明人： Akifumi Kamijima ,  Atsushi Yamaguchi ,  Masahiro Saito ,  Shingo Miyata ,  Yuji Otsubo ,  Souhei Horiuchi

IPC分类号： C25D5/02

CPC分类号： H05K3/243 ,  C25D5/022 ,  C25D5/10 ,  H05K3/241 ,  H05K2203/0574

摘要： A method of plating, which allows compositions of plating patterns of a plurality of layers to be uniform without any operational complexity, is provided. The area of the plating layer electrodeposited including plating patterns is constant in each of the plurality of layers. Accordingly, a value of plating-current density is easily maintained constant without any special operation. Consequently, the plating patterns in each of the plurality of layers is easily formed to have an uniform composition.

摘要翻译： 提供一种电镀方法，其允许多层的电镀图案的组合均匀而没有任何操作复杂性。 包含电镀图案的电沉积镀层的面积在多个层中是恒定的。 因此，电镀电流密度的值容易保持恒定，无需特别的操作。 因此，多个层中的每个层中的电镀图案容易形成为具有均匀的组成。

公开(公告)号：US07755064B2

公开(公告)日：2010-07-13

申请号：US11714737

申请日：2007-03-07

申请人： Hitoshi Hatate ,  Akifumi Kamijima

发明人： Hitoshi Hatate ,  Akifumi Kamijima

IPC分类号： B08B7/00 ,  H01L21/302

CPC分类号： H01L21/67115 ,  G03F7/42 ,  H01L21/0273 ,  Y10S438/906

摘要： A resist pattern processing apparatus comprises a stage for mounting a substrate having a patterned photoresist arranged on a surface thereof, a UV-emitting part for emitting UV rays to the stage, and an annular member for surrounding the whole periphery of the substrate. This allows the annular member to restrain ozone supplied near a mounting surface for the substrate on the stage from diffusing to the periphery of the stage, whereby the ozone concentration becomes even in the surface of the substrate mounted on the stage.

摘要翻译： 抗蚀剂图案处理装置包括用于安装具有布置在其表面上的图案化光致抗蚀剂的基板的台，用于向该台发射紫外线的UV发射部分和用于围绕基板的整个周边的环形部件。 这允许环形构件抑制在台面上的基板的安装面附近供应的臭氧扩散到台的周边，由此在安装在台架上的基板的表面上臭氧浓度变得均匀。

公开(公告)号：US07682923B2

公开(公告)日：2010-03-23

申请号：US11967905

申请日：2007-12-31

申请人： Akifumi Kamijima ,  Hideyuki Yatsu

发明人： Akifumi Kamijima ,  Hideyuki Yatsu

IPC分类号： H01L21/20

CPC分类号： H01L27/016 ,  H01L27/0207 ,  H01L28/91

摘要： A method of forming a metal trench pattern in a thin-film device includes a step of depositing an electrode film on a substrate or on a base layer, a step of forming a resist pattern layer having a trench forming portion used to make a trench pattern, on the deposited electrode film, a step of forming a metal layer for filling spaces in the trench forming portion and for covering the trench forming portion, by performing plating through the formed resist pattern layer using the deposited electrode film as an electrode, a step of planarizing at least a top surface of the formed metal layer until the trench forming portion of the resist pattern layer is at least exposed, and a step of removing the exposed trench forming portion of the resist pattern layer.

摘要翻译： 在薄膜器件中形成金属沟槽图形的方法包括在基底或基底层上沉积电极膜的步骤，形成具有用于形成沟槽图案的沟槽形成部分的抗蚀剂图案层的步骤 在沉积的电极膜上，通过使用沉积的电极膜作为电极进行通过形成的抗蚀剂图案层的电镀，形成用于填充沟槽形成部分中的空间并覆盖沟槽形成部分的金属层的步骤，步骤 平坦化所形成的金属层的至少顶表面，直到抗蚀剂图案层的沟槽形成部分至少暴露为止;以及去除抗蚀剂图案层的暴露的沟槽形成部分的步骤。