公开(公告)号：US20040173466A1

公开(公告)日：2004-09-09

申请号：US10376502

申请日：2003-03-03

Applicant: Com Dev Ltd.

Inventor： Florin Burca ,  John Darmon

IPC: C25D005/34

CPC classification number: C25D5/38 ,  C25D5/18 ,  C25D5/48 ,  C25D5/50

Abstract: A method for plating a titanium-containing metal, comprising the steps of: (a) surface treating the titanium-containing metal in a solution consisting essentially of an aqueous solvent and hydrochloric acid for a period of time sufficient to activate the surface of the titanium-containing metal; (b) plating the surface of the surface treated titanium-containing metal with a metallic coating in an electrolyte bath; and (c) non-oxidatively heat treating the struck titanium-containing metal for a period of time sufficient to cause diffusion bonding between the metallic coating and the titanium-containing metal. The present invention also provides parts made in accordance with the methods disclosed herein.

Abstract translation: 一种含钛金属电镀方法，包括以下步骤：（a）将基本上由水性溶剂和盐酸组成的溶液中的含钛金属表面处理足以活化钛表面的时间 含金属; （b）用金属涂层将表面处理的含钛金属的表面电镀在电解液浴中; 和（c）对所述含钛的金属进行非氧化热处理足以在所述金属涂层和所述含钛金属之间引起扩散接合的时间。 本发明还提供了根据本文公开的方法制备的部件。