公开(公告)号：US20120111036A1

公开(公告)日：2012-05-10

申请号：US12939535

申请日：2010-11-04

申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

IPC分类号： F25B1/00 ,  F25D17/02 ,  F25D31/00 ,  F25B43/00

CPC分类号： F25B49/02 ,  F25B25/005 ,  F25B2400/01 ,  F25B2400/24 ,  F25B2600/0251 ,  F28D20/021 ,  F28D2020/0008 ,  H05K7/20809 ,  Y02E60/145

摘要： Apparatus and method are provided for cooling an electronic component(s). The apparatus includes a coolant-cooled structure in thermal communication with the component(s) to be cooled, and a coolant-to-refrigerant heat exchanger in fluid communication with the coolant-cooled structure via a coolant loop. A thermal buffer unit is coupled in fluid communication with the coolant loop, and a refrigerant loop is coupled in fluid communication with the heat exchanger. The heat exchanger dissipates heat from coolant in the coolant loop to refrigerant in the refrigerant loop. A compressor is coupled in fluid communication with the refrigerant loop and is maintained ON responsive to heat load of the component(s) exceeding a heat load threshold, and is cycled ON and OFF responsive to heat load of the component(s) being below the threshold. The thermal storage unit dampens swings in coolant temperature within the coolant loop during cycling ON and OFF of the compressor.

摘要翻译： 提供了用于冷却电子部件的装置和方法。 该装置包括与要冷却的部件热连通的冷却剂冷却结构，以及通过冷却剂回路与冷却剂冷却结构流体连通的冷却剂 - 制冷剂热交换器。 热缓冲单元与冷却剂回路流体连通地联接，并且制冷剂回路与热交换器流体连通地联接。 热交换器将冷却剂回路中的冷却剂的热量散发到制冷剂回路中的制冷剂。 压缩机与制冷剂回路流体连通地联接，并且响应于超过热负荷阈值的部件的热负荷而保持接通，并响应于部件的热负荷而循环接通和断开 阈。 在循环打开和关闭压缩机期间，热存储单元会抑制冷却液回路内冷却液温度的波动。

公开(公告)号：US20120111034A1

公开(公告)日：2012-05-10

申请号：US12939541

申请日：2010-11-04

申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

IPC分类号： F25B41/00 ,  F24H1/10 ,  F25D31/00

CPC分类号： F25B25/005 ,  F24D2200/123 ,  F24D2200/29 ,  F25B49/02 ,  F25B2400/01 ,  F25B2500/28 ,  F25B2700/21171 ,  H05K7/20809 ,  H05K7/20836 ,  Y02B10/70

摘要： A heat exchange assembly and apparatus and method employing the heat exchange assembly are provided. The heat exchange assembly includes a coolant-to-refrigerant heat exchanger and a heater. The heat exchanger includes a coolant inlet and a coolant outlet for passing a coolant through the heat exchanger, and a refrigerant inlet and a refrigerant outlet for separately passing a refrigerant through the heat exchanger. The heat exchanger cools coolant passing through the heat exchanger by dissipating heat from coolant passing through the heat exchanger to refrigerant passing through the heat exchanger. The heater is integrated with the heat exchanger and applies an auxiliary heat load to refrigerant passing through the heat exchanger to facilitate ensuring that refrigerant passing through the heat exchanger absorbs at least a specified minimum heat load, for example, to ensure that refrigerant egressing from the refrigerant outlet of the heat exchanger is superheated vapor refrigerant.

摘要翻译： 提供了一种使用热交换组件的热交换组件和设备和方法。 热交换组件包括冷却剂 - 制冷剂热交换器和加热器。 热交换器包括用于使冷却剂通过热交换器的冷却剂入口和冷却剂出口，以及用于使制冷剂分开地通过热交换器的制冷剂入口和制冷剂出口。 热交换器通过将通过热交换器的冷却剂的热量散发通过热交换器的制冷剂来冷却通过热交换器的冷却剂。 加热器与热交换器集成，并对通过热交换器的制冷剂施加辅助热负荷，以便确保通过热交换器的制冷剂至少吸收特定的最小热负荷，以确保制冷剂从 热交换器的制冷剂出口是过热蒸气制冷剂。

公开(公告)号：US20110315353A1

公开(公告)日：2011-12-29

申请号：US12825745

申请日：2010-06-29

申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

IPC分类号： F28D15/00 ,  F25B41/00

CPC分类号： H05K7/20809

摘要： Liquid-cooled electronics racks are provided which include: immersion-cooled electronic subsystems; a vertically-oriented, vapor-condensing unit facilitating condensing dielectric fluid vapor egressing from the immersion-cooled subsystems, the vertically-oriented, vapor-condensing unit being sized and configured to reside adjacent to at least one side of the electronics rack; a reservoir for holding dielectric fluid, the reservoir receiving dielectric fluid condensate from the vertically-oriented, vapor-condensing unit; a dielectric fluid supply manifold coupling in fluid communication the reservoir and the dielectric fluid inlets of the immersion-cooled electronic subsystems; and a pump associated with a reservoir for pumping under pressure dielectric fluid from the reservoir to the dielectric fluid supply manifold for maintaining dielectric fluid in a liquid state within the immersion-cooled electronic subsystems.

摘要翻译： 提供液冷电子机架，包括：浸入式冷却电子子系统; 垂直取向的蒸气冷凝单元，其有助于冷凝来自浸没冷却子系统的介电流体蒸汽，所述垂直取向的蒸汽冷凝单元的尺寸和构造为邻近电子机架的至少一侧驻留; 用于保持介电流体的储存器，所述储存器从垂直取向的蒸汽冷凝单元接收介质流体冷凝物; 介质流体供应歧管联接以使浸没冷却的电子子系统的储存器和电介质流体入口流体连通; 以及与储存器相关联的泵，用于在压力介质流体下从介质流体供应歧管压力介质流体，用于将浸没冷却的电子子系统内的介质流体保持在液态。

公开(公告)号：US20110315344A1

公开(公告)日：2011-12-29

申请号：US12825761

申请日：2010-06-29

申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

IPC分类号： F28F7/00

CPC分类号： F28F3/04 ,  F28D2021/0031 ,  F28F3/12 ,  G06F1/20 ,  G06F2200/201 ,  H05K7/20236 ,  H05K7/20827

摘要： Cooling apparatus and method are provided for immersion-cooling of an electronic subsystem of an electronics rack. The cooling apparatus includes a housing at least partially surrounding and forming a sealed compartment about the electronic subsystem and a dielectric fluid disposed within the sealed compartment so that the electronic subsystem is immersed within the dielectric fluid. A liquid-cooled vapor condenser is provided which includes a plurality of thermally conductive condenser fins extending within the sealed compartment. The condenser fins facilitate cooling and condensing of dielectric fluid vapor generated within the sealed compartment. Within the sealed compartment, multiple thermally conductive condenser fins are interleaved with multiple electronic components immersed within the dielectric fluid to facilitate localized cooling and condensing of dielectric fluid vapor between the multiple electronic components.

摘要翻译： 提供冷却装置和方法用于电子机架的电子子系统的浸没冷却。 冷却装置包括至少部分围绕电子子系统和形成密封隔室的壳体，以及设置在密封隔间内的电介质流体，使得电子子系统浸没在电介质流体内。 提供了液体冷却的蒸汽冷凝器，其包括在密封隔室内延伸的多个导热冷凝器翅片。 冷凝器翅片促进在密封隔室内产生的介电流体蒸气的冷却和冷凝。 在密封隔室内，多个导热冷凝器翅片与浸没在电介质流体内的多个电子部件交错，以便于多个电子部件之间的介电流体蒸气的局部冷却和冷凝。

公开(公告)号：US08020390B2

公开(公告)日：2011-09-20

申请号：US12479798

申请日：2009-06-06

申请人： Hendrik F. Hamann ,  Madhusudan K. Iyengar ,  Theodore G. van Kessel

发明人： Hendrik F. Hamann ,  Madhusudan K. Iyengar ,  Theodore G. van Kessel

IPC分类号： F25B1/00

CPC分类号： F25B25/00 ,  F25B27/007 ,  F25B2400/24 ,  F25D16/00 ,  H05K7/20745

摘要： Energy-efficient data center cooling techniques that utilize free cooling and/or solar cooling are provided. In one aspect, a cooling system is provided including a cooling tower; one or more modular refrigeration chiller units; and a water loop that can be selectively directed through the cooling tower, through one or more of the modular refrigeration chiller units or through a combination thereof. Another cooling system is provided including a solar cooling unit; one or more modular refrigeration chiller units; and a water loop that can be selectively directed through the solar cooling unit, through one or more of the modular refrigeration chiller units or through a combination thereof.

摘要翻译： 提供了利用免费冷却和/或太阳能冷却的节能数据中心冷却技术。 一方面，提供一种包括冷却塔的冷却系统; 一个或多个模块式冷冻机组; 以及可以选择性地通过冷却塔引导通过一个或多个模块式制冷机组或通过其组合的水回路。 提供另一个冷却系统，包括太阳能冷却单元; 一个或多个模块式冷冻机组; 以及可以选择性地通过太阳能冷却单元，通过一个或多个模块式冷冻机组或通过其组合引导的水回路。

公开(公告)号：US07979250B2

公开(公告)日：2011-07-12

申请号：US11950747

申请日：2007-12-05

申请人： Matthew R. Archibald ,  Richard C. Chu ,  Hendrik F. Hamann ,  Madhusudan K. Iyengar ,  Roger R. Schmidt

发明人： Matthew R. Archibald ,  Richard C. Chu ,  Hendrik F. Hamann ,  Madhusudan K. Iyengar ,  Roger R. Schmidt

IPC分类号： G06F17/50 ,  G06G7/56 ,  G06G7/50 ,  H02B1/00 ,  G01K13/00 ,  G01K1/08 ,  G01K7/16 ,  G01K11/30 ,  G01K1/16 ,  G01N9/36

CPC分类号： G06F17/509 ,  G06F1/20 ,  G06F17/5004 ,  G06F2217/78 ,  G06F2217/80

摘要： A method is provided for facilitating installation of one or more electronics racks within a data center. The method includes: placing a plurality of thermal simulators in the data center in a data center layout to establish a thermally simulated data center, each thermal simulator simulating at least one of airflow intake or heated airflow exhaust of a respective electronics rack of a plurality of electronics racks to be installed in the data center; monitoring temperature within the thermally simulated data center at multiple locations, and verifying the data center layout if measured temperatures are within respective acceptable temperature ranges for the data center when containing the plurality of electronics racks; and establishing the plurality of electronics racks within the data center using the verified data center layout, the establishing including at least one of reconfiguring or replacing each thermal simulator with a respective electronics rack.

摘要翻译： 提供了一种便于在数据中心内安装一个或多个电子机架的方法。 该方法包括：将多个热模拟器放置在数据中心中的数据中心布局中，以建立热仿真数据中心，每个热模拟器模拟多个模拟数据中心的相应电子机架的气流吸入或加热气流排气中的至少一个 电子机架要安装在数据中心; 监测多个位置的热仿真数据中心内的温度，以及如果测量温度在包含多个电子机架时数据中心的可接受温度范围内，则验证数据中心布局; 以及使用已验证的数据中心布局在所述数据中心内建立所述多个电子机架，所述建立包括用相应的电子机架重新配置或替换每个热模拟器中的至少一个。

公开(公告)号：US07978473B2

公开(公告)日：2011-07-12

申请号：US12706912

申请日：2010-02-17

申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Bruce K. Furman ,  Madhusudan K. Iyengar ,  Paul A. Lauro ,  Roger R. Schmidt ,  Da-Yuan Shih ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Bruce K. Furman ,  Madhusudan K. Iyengar ,  Paul A. Lauro ,  Roger R. Schmidt ,  Da-Yuan Shih ,  Robert E. Simons

IPC分类号： H05K7/20 ,  G06F1/20 ,  H01L23/34

CPC分类号： H01L23/4735 ,  H01L23/473 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00

摘要： A cooling apparatus and method of fabrication are provided for facilitating removal of heat from a heat-generating electronic device. The method of fabrication includes: obtaining a solder material; disposing the solder material on a surface to be cooled; and reflowing and shaping the solder material disposed on the surface to be cooled to configure the solder material as a base with a plurality of fins extending therefrom. In addition to being in situ-configured on the surface to be cooled, the base is simultaneously metallurgically bonded to the surface to be cooled. The solder material, configured as the base with a plurality of fins extending therefrom, is a single, monolithic structure thermally attached to the surface to be cooled via the metallurgical bonding thereof to the surface to be cooled.

摘要翻译： 提供冷却装置和制造方法以便于从发热电子装置中除去热量。 制造方法包括：获得焊料材料; 将焊料材料设置在要冷却的表面上; 回流和成形设置在待冷却表面上的焊料材料，以将焊料材料构成为具有从其延伸的多个翅片的基底。 除了在待冷却的表面上原位配置，基底同时冶金结合到待冷却的表面上。 构造为具有从其延伸的多个翅片的基底的焊料材料是通过其被冶金结合到要冷却的表面热连接到要冷却的表面的单个整体结构。

公开(公告)号：US07961475B2

公开(公告)日：2011-06-14

申请号：US12256618

申请日：2008-10-23

申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Vinod Kamath ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Vinod Kamath ,  Robert E. Simons

IPC分类号： H05K1/00 ,  H05K7/20 ,  H05K5/00 ,  H01R13/40 ,  H02B1/01 ,  F28F7/00 ,  F25D23/12

CPC分类号： H05K7/20772 ,  H01L2924/0002 ,  H01L2924/00

摘要： Apparatus and method are provided for facilitating immersion-cooling of an electronic subsystem having multiple different types of components to be immersion-cooled. The apparatus includes a container sized to receive the electronic subsystem, and a hermetically sealed electrical connector disposed on a wall of the container. The electrical connector is sized and configured to receive an electrical and network connector of the electronic subsystem when the electronic subsystem is operatively inserted into the container, and to facilitate external electrical and network coupling to the subsystem. The apparatus further includes coolant inlet and outlet ports coupled to the container for facilitating ingress and egress of coolant through the container. When the electronic subsystem is operatively inserted into the container and coolant flows through the container, the electronic subsystem is immersion-cooled by the coolant.

摘要翻译： 提供了一种装置和方法，用于促进具有要浸没冷却的多种不同类型组件的电子子系统的浸入式冷却。 该装置包括一个容纳电子子系统的容器，以及一个设置在容器壁上的气密密封电连接器。 电连接器的尺寸和构造被设计成当电子子系统可操作地插入容器中时接收电子子系统的电气和网络连接器，并且便于外部电气和网络耦合到子系统。 该装置还包括联接到容器的冷却剂入口和出口，用于促进冷却剂通过容器的进入和流出。 当电子子系统可操作地插入容器并且冷却剂流过容器时，电子子系统被冷却剂浸没冷却。

公开(公告)号：US20110069454A1

公开(公告)日：2011-03-24

申请号：US12566081

申请日：2009-09-24

申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Michael RIZZOLO ,  Robert E. SIMONS

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Michael RIZZOLO ,  Robert E. SIMONS

IPC分类号： H05K7/20

CPC分类号： H05K7/2079

摘要： Liquid-cooled electronics apparatuses and methods are provided. The cooled electronics apparatuses include a liquid-cooled cold rail and an electronics subassembly. The liquid-cooled cold rail has a thermally conductive structure and a coolant-carrying channel extending within and cooling the thermally conductive structure. The electronics subassembly includes an electronics card(s) and one or more thermal transfer plates. The electronics card(s) includes electronic devices to be cooled, and the one or more thermal transfer plates are each rigidly affixed to one or more electronic devices of the electronics card(s). Each thermal transfer plate is thermally conductive and couples the electronics subassembly to the liquid-cooled cold rail to thermally interface the one or more electronic devices to the liquid-cooled cold rail to facilitate cooling of the electronic devices. In one embodiment, the electronics subassembly includes multiple interleaved electronics cards and thermal transfer plates.

摘要翻译： 提供液冷电子设备和方法。 冷却的电子设备包括液冷冷轨和电子组件。 液冷冷轨具有导热结构和在导热结构内延伸并冷却导热结构的冷却剂承载通道。 电子组件包括电子卡和一个或多个热传递板。 电子卡片包括要冷却的电子设备，并且一个或多个热转印板每个刚性地固定到电子卡的一个或多个电子设备。 每个热传递板是导热的并且将电子组件耦合到液冷冷轨，以将一个或多个电子设备热连接到液冷冷轨，以便电子设备的冷却。 在一个实施例中，电子组件包括多个交错电子卡和热转印板。

公开(公告)号：US07907406B1

公开(公告)日：2011-03-15

申请号：US12567954

申请日：2009-09-28

申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

IPC分类号： H05K7/20

CPC分类号： H05K7/2079 ,  H05K7/202 ,  H05K7/20609

摘要： System and method are provided for cooling an electronics rack. A modular cooling unit (MCU) is associated with the rack to provide system coolant to an electronics subsystem and a bulk power assembly. The MCU includes a liquid-to-liquid heat exchanger, and defines portions of facility and system coolant loops. Chilled coolant from a facility source is passed through the liquid-to-liquid heat exchanger to cool system coolant flowing through the system coolant loop. The system also includes an air-to-liquid heat exchanger in fluid communication with the system coolant loop, a pump in fluid communication with the system coolant loop, and a controller. The controller controls operation of the pump to adjust flow of system coolant through the system coolant loop dependent upon a mode of operation. In a standby mode, system coolant flows through the air-to-liquid heat exchanger at a lower flow rate, and expels heat to ambient air.

摘要翻译： 提供了系统和方法来冷却电子机架。 模块化冷却单元（MCU）与机架相关联，以向电子子系统和大容量电源组件提供系统冷却剂。 MCU包括液 - 液热交换器，并且限定设备和系统冷却剂回路的部分。 来自设备源的冷冻冷却剂通过液体 - 液体热交换器以冷却流过系统冷却剂回路的系统冷却剂。 该系统还包括与系统冷却剂回路流体连通的空气 - 液体热交换器，与系统冷却剂回路流体连通的泵和控制器。 控制器控制泵的操作，以根据操作模式来调节通过系统冷却剂回路的系统冷却剂流动。 在备用模式下，系统冷却剂以较低的流量流过空气对液体热交换器，并将热量排放到周围空气。