公开(公告)号：US07060522B2

公开(公告)日：2006-06-13

申请号：US09986107

申请日：2001-11-07

申请人： Peter M. Gulvin ,  Elliott A. Eklund ,  Joel A. Kubby

发明人： Peter M. Gulvin ,  Elliott A. Eklund ,  Joel A. Kubby

IPC分类号： H01L21/00

CPC分类号： B81C1/00476 ,  B81B2203/0127 ,  B81C2201/053

摘要： A structure for a micro-device is fabricated by forming: a first layer of sacrificial material, a layer of structural material over the first sacrificial material layer, a second layer of sacrificial material over the structural material layer and a protective layer over the second sacrificial material layer. A release etch is used to remove the first and second sacrificial material layers at approximately the same rate. A structural feature may also be fabricated by forming: a first layer of a first material; a layer of structural material over the first layer of the first material; at least one cut in the structural material layer; and, a first layer of a sacrificial material, different from the first material, over the structural material layer such that an interface is created between the first layer of the sacrificial material and the first layer of the first material at the at least one cut.

公开(公告)号：US06947624B2

公开(公告)日：2005-09-20

申请号：US10712203

申请日：2003-11-12

申请人： Joel A. Kubby ,  Kathleen A. Feinberg ,  Kristine A. German ,  Peter M. Gulvin ,  Jun Ma ,  Pinyen Lin

发明人： Joel A. Kubby ,  Kathleen A. Feinberg ,  Kristine A. German ,  Peter M. Gulvin ,  Jun Ma ,  Pinyen Lin

IPC分类号： G02B6/12 ,  G02B6/35 ,  G02B6/26 ,  G02B6/42

CPC分类号： G02B6/358 ,  G02B6/3508 ,  G02B6/3566 ,  G02B6/3576 ,  G02B6/3584 ,  G02B6/3594 ,  G02B2006/12145

摘要： An optical micro-electro-mechanical system (MEMS) switch is disclosed. In a preferred embodiment the optical MEMS switch is used as an M×N optical signal switching system. The optical MEMS switch comprises a plurality of optical waveguides formed on a cantilever beam platform for switching optical states wherein the state of the optical switch is changed by a system of drive and latch actuators. The optical MEMS device utilizes a latching mechanism in association with a thermal drive actuator for aligning the cantilever beam platform. In use the optical MEMS device may be integrated with other optical components to form planar light circuits (PLCs). When switches and PLCs are integrated together on a silicon chip, compact higher functionality devices, such as Reconfigurable Optical Add-Drop Multiplexers (ROADMs), may be fabricated.

摘要翻译： 公开了一种光学微机电系统（MEMS）开关。 在优选实施例中，光学MEMS开关用作MxN光信号交换系统。 光学MEMS开关包括形成在悬臂梁平台上的多个光波导，用于切换光学状态，其中光开关的状态由驱动和闩锁致动器的系统改变。 光学MEMS器件利用与用于对准悬臂梁平台的热驱动致动器相关联的闩锁机构。 在使用中，光学MEMS器件可以与其他光学部件集成以形成平面光电路（PLC）。 当开关和PLC集成在硅芯片上时，可以制造紧凑的更高功能的器件，例如可重配置光插座多路复用器（ROADM）。

公开(公告)号：US06479315B1

公开(公告)日：2002-11-12

申请号：US09724514

申请日：2000-11-27

申请人： Andrew J. Zosel ,  Peter M. Gulvin ,  Jingkuang Chen ,  Joel A. Kubby ,  Chuang-Chia Lin ,  Alex T. Tran

发明人： Andrew J. Zosel ,  Peter M. Gulvin ,  Jingkuang Chen ,  Joel A. Kubby ,  Chuang-Chia Lin ,  Alex T. Tran

IPC分类号： H01L2100

CPC分类号： B81C1/00666 ,  B81B2203/058 ,  B81C2201/014 ,  B81C2201/0164 ,  B81C2201/056 ,  G02B26/0833

摘要： The present invention provides a micromechanical or microoptomechanical structure. The structure is produced by a process comprising defining a structure on a single crystal silicon layer separated by an insulator layer from a substrate layer; depositing and etching a polysilicon layer on the single crystal silicon layer, with remaining polysilicon forming mechanical or optical elements of the structure; exposing a selected area of the single crystal silicon layer; and releasing the formed structure.

摘要翻译： 本发明提供一种微机械或微机电结构。 该结构通过包括在衬底层上限定由绝缘体层分离的单晶硅层上的结构的方法制造; 沉积和蚀刻单晶硅层上的多晶硅层，剩余的多晶硅形成结构的机械或光学元件; 暴露单晶硅层的选定区域; 并释放形成的结构。

公开(公告)号：US06413793B1

公开(公告)日：2002-07-02

申请号：US09858469

申请日：2001-05-17

申请人： Chuang-Chia Lin ,  Peter M. Gulvin ,  Alex T. Tran ,  Nena Liakopoulos

发明人： Chuang-Chia Lin ,  Peter M. Gulvin ,  Alex T. Tran ,  Nena Liakopoulos

IPC分类号： H01L2100

CPC分类号： B81B3/001

摘要： A semiconductor structure includes a substrate, a sacrificial layer formed on or over the substrate, and a structural layer formed on or over the sacrificial layer. At least one opening is formed in the structural layer. At least one opening is formed in the sacrificial layer below the at least one opening in the structural layer. The at least one opening in the structural layer and the at least one opening in the sacrificial layer are at least partially filled with a filler material. At least one portion of the structural layer is removed to define at least one microstructure. The sacrificial layer is removed such that the at least one microstructure is released from the substrate and the filler material forms one or more protrusions on the at least one microstructure, and/or one or more anchors anchoring the at least one microstructure to the substrate.

摘要翻译： 半导体结构包括衬底，形成在衬底上或衬底上的牺牲层以及形成在牺牲层上或之上的结构层。 在结构层中形成至少一个开口。 在结构层中的至少一个开口下方的牺牲层中形成至少一个开口。 结构层中的至少一个开口和牺牲层中的至少一个开口至少部分地填充有填充材料。 去除结构层的至少一部分以限定至少一个微结构。 去除牺牲层，使得至少一个微结构从衬底释放并且填充材料在至少一个微结构上形成一个或多个突起，和/或一个或多个将至少一个微结构锚定到衬底的锚固件。

公开(公告)号：US09096062B2

公开(公告)日：2015-08-04

申请号：US13195186

申请日：2011-08-01

申请人： James M. Casella ,  Peter M. Gulvin ,  Varun Sambhy ,  Kock-Yee Law ,  Hong Zhao

发明人： James M. Casella ,  Peter M. Gulvin ,  Varun Sambhy ,  Kock-Yee Law ,  Hong Zhao

IPC分类号： B41J2/16 ,  B41J2/14

CPC分类号： B41J2/162 ,  B41J2/1433 ,  B41J2/16 ,  B41J2/1606 ,  B41J2/1623 ,  B41J2/1639 ,  Y10T29/49126 ,  Y10T29/49401

摘要： A method for forming an ink jet printhead can include interposing a coverlay between a press plate of a press and an ink jet printhead aperture plate assembly, such that the coverlay physically contacts an anti-wetting coating on a surface of the aperture plate assembly. With the coverlay contacting the anti-wetting coating, a force is applied to the aperture plate assembly using the press. The coverlay is separated from the aperture plate assembly, wherein the coverlay includes a layer having an elastic modulus of at least 0.5 GPa.

摘要翻译： 用于形成喷墨打印头的方法可以包括在压机的压板和喷墨打印头孔板组件之间插入覆盖物，使得覆盖物物理地接触孔板组件的表面上的防湿涂层。 随着覆盖层与防湿涂层接触，使用压机将力施加到孔板组件。 覆盖层与孔板组件分离，其中覆盖层包括具有至少0.5GPa的弹性模量的层。

公开(公告)号：US08540346B2

公开(公告)日：2013-09-24

申请号：US13095610

申请日：2011-04-27

申请人： Bryan R. Dolan ,  Peter M. Gulvin ,  Hong Zhao ,  John R. Andrews ,  Bradley J. Gerner ,  Antonio Williams ,  Kock-Yee Law ,  David P. Platt ,  Terrance L. Stephens

发明人： Bryan R. Dolan ,  Peter M. Gulvin ,  Hong Zhao ,  John R. Andrews ,  Bradley J. Gerner ,  Antonio Williams ,  Kock-Yee Law ,  David P. Platt ,  Terrance L. Stephens

IPC分类号： B41J2/14 ,  B41J2/16

CPC分类号： B41J2/162 ,  B41J2/161 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2/1634 ,  B41J2/1642 ,  B41J2/1645 ,  B41J2/1646

摘要： An aperture plate for a print head of a printer can include a first layer having a first emissivity which is covered by a second layer having a second emissivity which is less than the first emissivity. In an embodiment, the second layer can be etched at nozzle locations to form openings in the second layer which have widths/areas greater than widths/areas of nozzles formed in the first layer. In another embodiment, the second layer can have a smaller thickness at the nozzle locations and a larger thickness away from the nozzle locations. Forming the openings in the second layer which are larger than the nozzles, or forming the second layer thinner at the nozzle locations prior to forming the nozzles, can provide a well-formed nozzle and an aperture plate having a low emissivity.

摘要翻译： 用于打印机的打印头的孔板可以包括具有第一辐射率的第一层，第一层被第二层覆盖，第二层的第二发射率小于第一发射率。 在一个实施例中，可以在喷嘴位置处蚀刻第二层，以在第二层中形成具有大于第一层中形成的喷嘴的宽度/面积的宽度/面积的开口。 在另一个实施例中，第二层可以在喷嘴位置处具有较小的厚度，并且距离喷嘴位置具有更大的厚度。 在形成喷嘴之前，在第二层中形成大于喷嘴的开口，或在喷嘴位置处形成较薄的第二层，可以提供具有低发射率的良好形成的喷嘴和孔板。

公开(公告)号：US08450902B2

公开(公告)日：2013-05-28

申请号：US11467660

申请日：2006-08-28

申请人： Peter M. Gulvin ,  Peter J. Nystrom

发明人： Peter M. Gulvin ,  Peter J. Nystrom

IPC分类号： H02N1/00 ,  H01H59/00 ,  B41J2/45

CPC分类号： H01H59/0009 ,  H01G5/18

摘要： The present application is directed to novel electrostatic actuators and methods of making the electrostatic actuators. In one embodiment, the electrostatic actuator comprises a substrate, an electrode formed on the substrate and a deflectable member positioned in proximity to the electrode so as to provide a gap between the electrode and the deflectable member. The deflectable member is anchored on the substrate via one or more anchors. The gap comprises at least one first region having a first gap height positioned near the one or more anchors and at least one second region having a second gap height positioned farther from the anchors than the first region. The first gap height is smaller than the second gap height.

摘要翻译： 本申请涉及新型静电致动器和制造静电致动器的方法。 在一个实施例中，静电致动器包括衬底，形成在衬底上的电极和位于电极附近的可偏转构件，以便在电极和可偏转构件之间提供间隙。 可偏转构件经由一个或多个锚固件锚定在基底上。 所述间隙包括至少一个第一区域，其具有位于所述一个或多个锚固件附近的第一间隙高度和至少一个第二区域，所述第二区域具有比所述第一区域更远离所述锚定件的第二间隙高度。 第一间隙高度小于第二间隙高度。

公开(公告)号：US08097497B2

公开(公告)日：2012-01-17

申请号：US11694886

申请日：2007-03-30

申请人： Peter M. Gulvin ,  Peter J. Nystrom ,  John P. Meyers

发明人： Peter M. Gulvin ,  Peter J. Nystrom ,  John P. Meyers

IPC分类号： H01L21/00

CPC分类号： H01L24/82 ,  H01L23/3185 ,  H01L23/552 ,  H01L23/66 ,  H01L24/24 ,  H01L2224/24011 ,  H01L2224/24051 ,  H01L2224/24226 ,  H01L2224/24998 ,  H01L2224/76155 ,  H01L2224/82007 ,  H01L2224/82102 ,  H01L2224/82104 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00

摘要： A method of connecting a chip to a package in a semiconductor device includes printing an encapsulant to a predetermined thickness on at least a portion of the chip and package and printing a layer of conductive material on the encapsulant in a predetermined pattern between the chip and package. The printed conductive material conforms to an upper surface of the encapsulant such that the encapsulant defines a distance from the printed conductive material to the chip and package. The method further includes printing a second layer of encapsulant over the printed conductive material curing at least the second layer of encapsulant.

摘要翻译： 将芯片连接到半导体器件中的封装的方法包括在芯片和封装的至少一部分上将密封剂印刷到预定厚度，并且在芯片和封装之间以预定图案在密封剂上印刷导电材料层 。 印刷的导电材料符合密封剂的上表面，使得密封剂限定了从印刷的导电材料到芯片和封装的距离。 该方法还包括在固化至少第二层密封剂的印刷导电材料上印刷第二层密封剂。

公开(公告)号：US07911623B2

公开(公告)日：2011-03-22

申请号：US11890575

申请日：2007-08-07

申请人： Pinyen Lin ,  Peter M. Gulvin ,  Yao Rong Wang ,  Lalit Keshav Mestha

发明人： Pinyen Lin ,  Peter M. Gulvin ,  Yao Rong Wang ,  Lalit Keshav Mestha

IPC分类号： G01B9/02

CPC分类号： G02B26/001 ,  G01J3/02 ,  G01J3/0256 ,  G01J3/26 ,  G01J3/2803 ,  G03G2215/00616

摘要： Disclosed is a microelectromechanically tunable Fabry-Perot device and method of manufacturing tunable Fabry-Perot device and method of manufacturing. The F-P device comprises a first and second substrate which has partially reflective planar surfaces, and the partially reflective planar surfaces are separated by a predetermined separation distance and aligned to provide a F-P cavity, where one or more piezoelectric members are adapted to displace the first and second substrates when an electric field is applied.

摘要翻译： 公开了一种微机电可调法布里 - 珀罗器件和制造可调谐法布里 - 珀罗器件的方法和制造方法。 FP器件包括第一和第二衬底，其具有部分反射的平面表面，并且部分反射的平面表面被隔开预定的间隔距离并对齐以提供FP腔，其中一个或多个压电元件适于使第一和 施加电场时的第二基板。

公开(公告)号：US07718458B2

公开(公告)日：2010-05-18

申请号：US11853469

申请日：2007-09-11

申请人： Peter M. Gulvin ,  Donald J. Drake

发明人： Peter M. Gulvin ,  Donald J. Drake

IPC分类号： H01L21/00 ,  H01L31/00 ,  H01G5/16

CPC分类号： B81B3/0086

摘要： A method and resulting device for reducing an electrical field at an isolation gap in a capacitive actuator includes providing a bottom electrode layer and forming a pattern in the bottom electrode layer having an isolation gap between center and outer electrode components of the patterned electrode. A spacing material is deposited in the isolation gap, the spacing material having a greater height than a remainder of the patterned electrode, and a sacrificial material is deposited conformably on a surface of the patterned electrode and spacing material. The method also includes applying a deformable electrode to a surface of the sacrificial material, whereby removal of the sacrificial and spacing materials results in a greater spacing between the deformable electrode and the electrode layer at a region of the isolation gap than over a remainder of the spacing between the patterned electrode layer and deformable surface.

摘要翻译： 用于减小电容式致动器中的隔离间隙处的电场的方法和所得装置包括提供底部电极层并在底部电极层中形成图案，该图案在图案化电极的中心和外部电极组件之间具有隔离间隙。 间隔材料沉积在隔离间隙中，间隔材料具有比图案化电极的其余部分更大的高度，并且将牺牲材料顺应地沉积在图案化电极和间隔材料的表面上。 该方法还包括将可变形电极施加到牺牲材料的表面，由此去除牺牲和间隔材料导致在隔离间隙的区域处的可变形电极和电极层之间的间隔比在其余部分 图案化电极层和可变形表面之间的间距。