摘要:
Described herein is a stacked package according to the present invention, wherein a plurality of tape carriers which seal semiconductor chips, are multilayered in upward and downward directions. In the stacked package, one ends of leads formed over the whole surfaces of each tape carrier are electrically connected to their corresponding connecting terminals of the semiconductor chip. Other ends of the leads are electrically connected to their corresponding through holes defined in the tape carrier. Connecting terminals common to the plurality of semiconductor chips are formed at the same places of the plurality of tape carriers and withdrawn to the same external connecting terminals through a plurality of mutually-penetrated through holes.
摘要:
A semiconductor device including a nonvolatile memory unit and a variable logic unit mounted on a chip is configured to achieve higher speed operation at a lower voltage. The semiconductor device includes a nonvolatile memory unit comprising a plurality of rewritable nonvolatile memory cells and a variable logic unit whose logical functions are determined, according to logic constitution definition data to be loaded into storage cells thereof. A nonvolatile memory cell essentially has a split gate structure composed of a selecting MOS transistor and a memory MOS transistor and constructed such that the dielectric withstand voltage of the gate of the selecting MOS transistor is lower than that of the memory MOS transistor or the gate insulation layer of the selecting MOS transistor is thinner than that of a high-voltage-tolerant MOS transistor. Because the selecting MOS transistor has a high Gm, a sufficiently great current for reading can be obtained.
摘要:
A method of fabricating a semiconductor integrated circuit device includes: recessing a second surface portion of a semiconductor substrate; forming elements of a first circuit region capable of performing a first function at a first surface portion of the semiconductor substrate and elements of a second circuit region capable of performing a second function at the recessed second surface portion of the semiconductor substrate, the elements of the first circuit region and those of the second circuit region having relatively small and large sizes as generally measured in a direction perpendicular to the surface portions of the semiconductor substrate, respectively; forming an insulating film to cover the first and second circuit regions, with a result that a level difference is caused between first and second portions of the insulating film on the first and second circuit regions at a relatively lower level and at a relatively higher level, respectively; effecting chemical-mechanical planarization of the insulating film to suppress the level difference in the insulating film for enhancing a focus margin for successive photolithographic steps; and forming wiring conductors on the insulating film with the suppressed level difference, enjoying the enhanced focus margin.
摘要:
A bipolar memory of a construction having high immunity from soft error attributable to alpha rays is provided. The transistors of a flip flop, i.e., the essential circuit of the memory cell, are inverted, and the load device thereof has a shielding arrangement for shielding the flip flop from the noise produced within the substrate. Either pnp type transistors or Schottky barrier diodes are employed as the load devices. A buried layer (ordinarily, an n type layer) and a doped layer of the reverse conductivity type (ordinarily the p type) are formed in the region where the device is provided. A reverse bias is applied across the buried layer and the doped layer to shut off the noise produced within the substrate.
摘要:
A bipolar memory of a construction having high immunity to soft error attributable to alpha rays is provided. The transistors of a flip flop, i.e., the essential circuitry of the memory cell, are inverted and the load device thereof has shielding means for shielding the flip flop from the noise produced within the substrate. Bipolar transistors and Schottky barrier diodes are employed as the load devices. A buried layer (ordinarily, an n type layer) and a doped layer of the reverse conductivity type (ordinarily the p type) are formed in a region where the device is provided, and a reverse bias is applied across the buried layer and the doped layer to shut off the noise produced within the substrate.
摘要:
Disclosed is a two-dimensionally arrayed solid-state imaging device for a television camera having a photodiode array arranged at a photo-sensing section and a readout horizontal register constructed by a charge transfer device (CTD) such as a BCD, CCD or BBD. An inverter circuit is provided for each of the vertical signal lines. An input of the inverter circuit is connected to a vertical signal line drain of at least one transfer transistor arranged between the vertical signal line and the CTD, and an output of the inverter circuit is connected to a gate of the transfer transistor. Transfer efficiency is improved by the insertion of the inverter circuit and fixed pattern noise is substantially reduced by supplying bias currents.
摘要:
A solid-state imaging device wherein a MOS sensor is employed for a photosensor part, a CTD shift register is employed for a read-out circuit, first and second transfer gates are connected between vertical signal output lines and the CTD, and a reset gate is connected between a juncture of the first and second transfer gates and a reset voltage line. A method is adopted in which signal outputs of a plurality of rows are transferred to the CTD in a horizontal blanking period, and signals of a plurality of rows are simultaneously read out in a horizontal scanning period. At the signal transfer, bias charges are dumped into the vertical signal output lines from the CTD, and mixed charges consisting of the bias charges and signal charges are transferred to the CTD. Thereafter, the signals are read out.
摘要:
A circuit for generating scanning pulses comprising a plurality of stages of basic circuits connected in series, said each basic circuit comprising first, second and third insulated gate field-effect transistors (MISTs) each of which has first and second terminals each being either of source and drain terminals and a gate terminal, said first terminal of said first MIST being used as a clock pulse-applying terminal, said gate terminal of said first MIST being used as an input terminal, said second terminal of said first MIST and said first terminal and said gate terminal of said second MIST being connected and used as a scanning pulse output terminal, said second terminal of said second MIST and said first terminal of said third MIST being connected and used as an output terminal, said second terminal of said third MIST being used as a ground terminal, said gate terminal of said third MIST being used as a feedback input terminal.
摘要:
This invention relates to a tri-state type driver circuit in which any one of the three possible output signals of "float", "on", or "off" is produced at high speed even when an output terminal is accompanied with a great load. The tri-state type driver circuit comprises an output inverter circuit which employs a bipolar transistor as a load thereof and a MOS-FET as a driver thereof, a first logical circuit which is coupled to an input terminal of the bipolar transistor, which first logical circuit is made up of a C-MOS circuit receiving an external select signal and a C-MOS circuit having an input signal transmitted thereto and whose output can be specified by the external select signal, and a second logical circuit which is coupled to an input terminal of the MOS-FET, which second logical circuit is made up of a C-MOS circuit receiving the external select signal and a C-MOS circuit having the input signal transmitted thereto. The state of the external select signal will determine whether the driver circuit output will be "float" (regardless of the input to the driver circuit) or "on" or "off" (in correspondence with the input to the driver circuit).
摘要:
In a solid-state imaging device having on an identical semiconductor substrate a plurality of photodiodes which are arrayed in two dimensions, vertical and horizontal switching MOSFETs which select the positions of the photodiodes, and vertical and horizontal scanning circuits which provide scanning pulses for controlling the operations of the vertical and horizontal switching MOSFETs; the improvement therein comprising a clamping circuit which is made up of a diode, a MOSFET or the like and which is disposed between the photodiode and a vertical scanning line of the succeeding stage, so that excess charges overflowing the photodiode are drawn out from the vertical scanning line through the clamping circuit, whereby the blooming can be prevented.