摘要:
Fine silica particles surface-treated with a silane and having primary particles having a particle diameter of from 0.01 to 5 μm, which fine silica particles fulfill the following conditions (i) and (ii), a process for their production and an organic resin composition containing such particles as a component are provided. (i) When an organic compound which is liquid at room temperature and has a dielectric constant of from 1 to 40 F/m and fine silica particles are mixed in a weight ratio of 5:1 and shaked, the fine silica particles disperse uniformly in the organic compound, and (ii) the quantity of primary particles remaining as primary particles when methanol is evaporated under heating by means of an evaporator from a dispersion prepared by dispersing the fine silica particles in methanol and thereafter the particles are held at a temperature of 100° C. for 2 hours, is in a percentage of at least 20% based on the quantity of primary particles originally present. The present fine silica particles are highly dispersible and low aggregative, and the organic resin composition containing them is useful for obtaining films having a good transparency and superior blocking resistance, slip properties and scratch resistance.
摘要:
A surface treating agent is comprised of the reaction product obtained by reacting with ammonia a mixture of (A) an organosilicon compound having a fluorinated organic group and (B) an organosilicon compound having a hydrolyzable group. Substrates treated therewith exhibit high water and oil repellency and allow sticking contaminants to be effectively wiped off.
摘要:
A process for producing an organosilicon resin is disclosed. The process includes the steps of equilibrating a mixture of silane compounds of Si(OR.sup.3).sub.4 wherein R.sup.3 's are a monovalent hydrocarbon group having 1 to 6 carbon atoms; R.sup.2 Si(OR.sup.4).sub.3 wherein R.sup.2 is a monovalent hydrocarbon group having 1 to 20 carbon atoms, and R.sup.4 's are a monovalent hydrocarbon group having 1 to 6 carbon atoms; and R.sup.1.sub.3 SiX wherein X is an --OH group, an --OSiR.sup.1.sub.3 group or a hydrolyzable group, and R.sup.1 's are a monovalent hydrocarbon group having 1 to 6 carbon atoms; adding water to the product of the equilibration reaction to carry out hydrolysis reaction; and adding an aqueous alkali to the product of the hydrolysis reaction to carry out condensation reaction. The organosilicon resin obtained is well dispersible in a resin premix containing a polyol, a blowing agent, a catalyst and a foam stabilizer, and also is highly hydrophobic and low reactive. Hence, the resin premix containing the organosilicon resin has good storage stability. Accordingly, this resin premix need not be agitated when used and also can provide polyurethane foams having superior properties such as dimensional stability.
摘要:
A fiber-treating agent is obtained by dissolving in water a reaction product resulting from co-hydrolysis and condensation of (A) a fluorinated alkyl group-containing alkoxysilane, (B) an alkyl group-containing alkoxysilane, (C) an amino group-containing alkoxysilane, and (D) an epoxy group-containing alkoxysilane. The fiber-treating agent is water soluble and thus safe while it imparts satisfactory water repellency, oil repellency, stain-proof property and even durable water repellency.
摘要:
A hydrolyzate resulting from co-hydrolysis of a perfluoroalkyl group-containing organic silicon compound and a hydrolyzable group-containing methylpolysiloxane compound in a hydrophilic solvent is blended with an organopolysiloxane and a strong acid to constitute a water repellent composition which is effective for imparting water repellency and facilitating falling of water droplets and thus imparting excellent water repellency and stain-proofness to a surface of an article treated therewith.
摘要:
A dynamic semiconductor logic circuit comprising a MOS FET logic section for effecting a high-speed logic operation in response to input logic signals after precharging of an output mode and internal nodes the logic section, a CMOS/BiCMOS output buffer section for outputting a result of the logic operation, and a noise suppression section for preventing erroneous operations without sacrificing the high-speed operation characteristic. The circuit, which is fabricated with 0.5-.mu.m-rule technology and operates at high speed with a low-voltage power source of 4.5 V or less, has a precharging section for precharging the output node and internal nodes of the MOS FET logic section and a noise suppression section for latching the output node of the logic section to the source potential by feeding back the output of an output buffer section in order to enlarge the soft error margin. The latching current is held at less than a predetermined ratio to maintain the high-speed operation characteristic.