公开(公告)号：US11234330B2

公开(公告)日：2022-01-25

申请号：US17154599

申请日：2021-01-21

Applicant: InnoLux Corporation

Inventor： Po-Yun Hsu ,  Ker-Yih Kao ,  Chia-Ping Tseng

IPC: B23P19/00 ,  H05K1/03 ,  H05K3/00 ,  H05K1/05

Abstract: An electronic device and a method for manufacturing the same are disclosed. The method for manufacturing the electronic device includes the following steps: providing a substrate; forming a metal layer on the substrate, wherein the metal layer has a first surface; forming a first insulating layer on the first surface of the metal layer; forming a second insulating layer on the first insulating layer; etching the first insulating layer and the second insulating layer to form a contact hole, wherein the contact hole exposes a portion of the first surface; cleaning the portion of the first surface exposed by the contact hole with a solution; and forming a transparent conductive layer on the second insulating layer, wherein the transparent conductive layer electrically connects with the metal layer.