公开(公告)号：US20150124162A1

公开(公告)日：2015-05-07

申请号：US14531178

申请日：2014-11-03

Applicant: LG Innotek Co., Ltd.

Inventor： Sang Ok PARK ,  Seong Min LEE ,  Jun Taek LEE ,  Byung Wook SON

IPC: H04N5/225 ,  G03B13/36

CPC classification number: H04N5/2257 ,  G03B3/10 ,  G03B2205/0069 ,  H04N5/2253

Abstract: A camera module includes a PCB (Printed Circuit Board) installed with an image sensor, a base mounted on the PCB, and a bobbin reciprocatingly mounted above the base. A bottom elastic member is fixed to the base to support the bobbin, and a terminal is installed at the base, one end of which is conductively connected to the PCB and the other end of which is conductively connected to the bottom elastic member at a solder part. A solder cut-off part is formed at the base to cut off movement of overflowing solder from the solder part.

Abstract translation: 相机模块包括安装有图像传感器的PCB（印刷电路板），安装在PCB上的基座和沿基座往复安装的线轴。 底部弹性构件固定到基座以支撑线轴，并且端子安装在基座处，其一端导电地连接到PCB，并且另一端在焊料处导电地连接到底部弹性构件 部分。 在基座处形成焊料截止部分，以切断溢出焊料从焊接部分的移动。