Abstract:
A preamplifier circuit for a computer data storage system disk drive read/write head (or HSA) includes multiple test modes to enable electrical testing of the preamplifier, the read/write heads, and associated circuitry without physically probing the components or circuitry. Communication between the preamplifier and a host controller provides for test mode selection and test mode enablement within the preamplifier. Testing occurs using only the normal interface connector to the head disk assembly (HDA) in which the preamplifier and HSA are embodied. Properties such as electrical resistance, ESD, preamplifier bond wire connection integrity, head bond wire and solder joint integrity, and connections from the head slider to the preamplifier leads are all tested. Testing occurs without probing to provide efficient, reliable, and cost effective manufacturing and testing benefits of the read/write heads, flex assembly, HSA, and HDA.
Abstract:
A semiconductor device microwave integrated circuit includes at least a transistor stage which stage includes a microwave matching circuit and a d.c. bias circuit interconnected at a link node (A). The transistor stage further includes a stabilizing circuit which includes an open stub line connected to the link node. The open stub line connected to the link node is a .lambda./4 line which at the operating frequency imposes a short circuit on the link node. A matching circuit made up of a low-value resistor connected to ground in the microwave mode through a d.c. isolating capacitor is connected to the link node. A .lambda./4 line of the radial type (.lambda./4 radial stub) provides broadband operation.
Abstract:
Semiconductor device including a distributed-type monolithic integrated circuit on a substrate, operating in the high frequency and/or microwave range, this distributed circuit having a plurality of coupled stages each having at least a transistor with a first electrode being AC connected to ground. The first electrode is connected to ground by two branches, a first branch being connected directly to a first ground stub and a second branch being connected to a second ground stub through a resistor.
Abstract:
An integrated semiconductor device including a frequency divide-by-two circuit comprising an inverter stage and a switching transistor (T2) which is controlled by a microwave input signal (E). The divider circuit includes an oscillator stage in that the inverter stage is at least equipped with a reactive element which in combination with the inverter stage forms a negative resistant network. The switching transistor is connected in parallel with this reactive element and the transmit time .tau..sub.0 of the switch is less than the transit time .tau..sub.2 of a signal propagating through the reactive element.
Abstract:
An integrated semiconductor arrangement comprising a high-frequency power amplifier stage, which comprises two field-effect transistor having first connection means to influence the output power by means fo the unit gate width of the amplifier stage, and second connection means to influence the value of the input capacitance of the amplifier stage. This stage also comprises means to ensure the feedback of direct current to ground and also includes D.C. biasing means.