公开(公告)号：US20180034002A1

公开(公告)日：2018-02-01

申请号：US15658597

申请日：2017-07-25

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Byoung Yong KIM ,  Jeong Ho HWANG

IPC: H01L51/52 ,  H01L51/56 ,  H01L51/00

Abstract: A display device includes a substrate including a display area and a peripheral area outside the display area, the peripheral area including a bendable bending region, a display member on the display area of the substrate to display an image, and a protection film under the substrate, the protection film including a groove at a position corresponding to the bending region of the peripheral area, wherein the groove includes a bottom surface and inner walls extending from the bottom surface to a surface of the protection film, a boundary part being defined at an intersection of each inner wall with the surface of the protection film, and wherein boundary parts adjacent to opposite ends of the protection film are separated from the opposite ends of the protection film, respectively.

公开(公告)号：US20170358520A1

公开(公告)日：2017-12-14

申请号：US15600849

申请日：2017-05-22

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Sang Hyeon SONG ,  Byoung Yong KIM ,  Jeong Ho HWANG

IPC: H01L23/498 ,  G02F1/133 ,  G09G3/3208 ,  H01L23/495

Abstract: A chip-on-film (COF) package includes a film, a driver integrated circuit (IC) chip disposed on the film, an electrode pad disposed on an edge of the film, and a first deformation-preventing member disposed on the film, between the driver IC chip and the electrode pad.