公开(公告)号：US11330651B2

公开(公告)日：2022-05-10

申请号：US16969749

申请日：2019-02-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Gupil Cheong ,  Sungjun Choi ,  Gibeom Kim ,  Doosu Na ,  Hyunah Oh ,  Hyungseoung Yoo ,  Doosuk Kang

IPC: H04W4/00 ,  H04W76/14 ,  H04B17/318 ,  H04W4/80 ,  H04W52/24

Abstract: An electronic device according to various embodiments may comprise a communication module and a processor, wherein: the communication module is configured to transmit a data packet, received from the processor, to an external electronic device connected to the electronic device, receive, from the external electronic device, a response packet corresponding to the data packet, acquire a received signal strength indication (RSSI) of the response packet, and transmit, to the processor, a first packet including information on the RSSI when the response packet is received; and the processor is configured to identify the RSSI of the response packet by using the first packet received from the communication module.