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公开(公告)号：US20170358520A1
公开(公告)日：2017-12-14
申请号：US15600849
申请日：2017-05-22
Applicant: SAMSUNG DISPLAY CO., LTD.
Inventor： Sang Hyeon SONG , Byoung Yong KIM , Jeong Ho HWANG
IPC: H01L23/498 , G02F1/133 , G09G3/3208 , H01L23/495
Abstract: A chip-on-film (COF) package includes a film, a driver integrated circuit (IC) chip disposed on the film, an electrode pad disposed on an edge of the film, and a first deformation-preventing member disposed on the film, between the driver IC chip and the electrode pad.
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