-
公开(公告)号:USD317308S
公开(公告)日:1991-06-04
申请号:US196356
申请日:1988-05-20
申请人: Shinichi Aoki , Akihiko Konno
设计人: Shinichi Aoki , Akihiko Konno
-
公开(公告)号:US4923652A
公开(公告)日:1990-05-08
申请号:US186487
申请日:1988-02-24
IPC分类号: C04B35/64 , C04B35/638 , C04B33/34
CPC分类号: C04B35/638
摘要: A method of vaporizing and removing a binder from a powder-molded product containing the binder, which method comprises:coating the greater part of the surface of said powder-molded product with a thin resin film having air-tightness thereby leasing an exposed surface portion;pressurizing the thus-coated surface portion of the pressure-molded product hydrostatically;vaporizing the binder in the power-molded product under said hydrostatic pressurization; andremoving the vaporized binder to the exterior of the power-molded product through said exposed surface portion not coated with the thin film.
-