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    GALVANIC ISOLATION DEVICE
    31.
    发明申请
    GALVANIC ISOLATION DEVICE 审中-公开

    公开(公告)号：US20190081133A1

    公开(公告)日：2019-03-14

    申请号：US16178352

    申请日：2018-11-01

    Applicant: TEXAS INSTRUMENTS INCORPORATED

    Inventor： Benjamin Stassen Cook ,  Barry Jon Male ,  Robert Alan Neidorff

    IPC: H01L49/02 ,  H01L23/495 ,  H01L23/66

    Abstract: A galvanic isolation device includes a first integrated circuit (IC) die that has communication circuitry formed in a circuit layer below the top surface. A first conductive plate is formed on the IC die proximate the top surface, and is coupled to the communication circuitry. A dielectric isolation layer is formed over a portion of the top surface of the IC after the IC is fabricated such that the dielectric isolation layer completely covers the conductive plate. A second conductive plate is juxtaposed with the first conductive plate but separated by the dielectric isolation layer such that the first conductive plate and the second conductive plate form a capacitor. The second conductive plate is configured to be coupled to a second communication circuit.

    INTEGRATED CIRCUIT WITH AN EMBEDDED INDUCTOR OR TRANSFORMER
    32.
    发明申请
    INTEGRATED CIRCUIT WITH AN EMBEDDED INDUCTOR OR TRANSFORMER 审中-公开

    公开(公告)号：US20190057942A1

    公开(公告)日：2019-02-21

    申请号：US15678841

    申请日：2017-08-16

    Applicant: Texas Instruments Incorporated

    Inventor： Barry Jon Male ,  Rajarshi Mukhopadhyay

    IPC: H01L23/64 ,  H01F27/28 ,  H01F27/24 ,  H01L49/02 ,  H01L23/495

    Abstract: In a described example, an integrated circuit includes: a semiconductor substrate having a first surface and an opposite second surface; at least one dielectric layer overlying the first surface of the semiconductor substrate; at least one inductor coil in the at least one dielectric layer with a plurality of coil windings separated by coil spaces, the at least one inductor coil lying in a plane oriented in a first direction parallel to the first surface of the semiconductor substrate, the at least one inductor coil electrically isolated from the semiconductor substrate by a portion of the at least one dielectric layer; and trenches extending into the semiconductor substrate in a second direction at an angle with respect to the first direction, the trenches underlying the inductor coil and filled with dielectric replacement material.

    METHODS AND APPARATUS FOR SPARK GAP DEVICES WITHIN INTEGRATED CIRCUITS
    33.
    发明申请
    METHODS AND APPARATUS FOR SPARK GAP DEVICES WITHIN INTEGRATED CIRCUITS 审中-公开

    公开(公告)号：US20180190556A1

    公开(公告)日：2018-07-05

    申请号：US15396121

    申请日：2016-12-30

    Applicant: Texas Instruments Incorporated

    Inventor： Barry Jon Male ,  Steve Kummerl ,  Robert Alan Neidorff ,  Benjamin Stassen Cook

    IPC: H01L23/31 ,  H02H9/04 ,  H01L23/495 ,  H01L27/02 ,  H01L21/48 ,  H01L21/56

    Abstract: In a described example, an apparatus includes: an integrated circuit die having multiple terminals; a leadframe having leads for external connections, at least some of the leads electrically coupled to at least one of the multiple terminals of the integrated circuit die; a first electrode having a first end portion; a second electrode having a second end portion positioned proximal to and spaced apart from the first end portion of the first electrode, the first end portion and the second end portion spaced by a spark gap; encapsulation material surrounding the integrated circuit die to form a packaged integrated circuit having a cavity surrounding the first end portion, the second end portion, and the spark gap so that the first end portion of the first electrode, the second end portion of the second electrode and the spark gap are spaced from the encapsulation material.

    Semiconductor package with top circuit and an IC with a gap over the IC
    36.
    发明授权
    Semiconductor package with top circuit and an IC with a gap over the IC 有权

    公开(公告)号：US11302611B2

    公开(公告)日：2022-04-12

    申请号：US16202925

    申请日：2018-11-28

    Applicant: Texas Instruments Incorporated

    Inventor： Barry Jon Male ,  Paul Merle Emerson ,  Sandeep Shylaja Krishnan

    IPC: H01L23/495 ,  H01L23/00 ,  H01L21/56 ,  H01L23/31

    Abstract: A packaged integrated circuit (IC) includes a leadframe including a die pad and leads around the die pad, an analog IC die having first bond pads on its active top side, and a second circuit including second circuit bond pads attached to the analog IC die by an attachment layer configured as a ring with a hollow center that provides an inner gap. A bottom side of the analog IC or the second circuit is attached to the die pad. Bond wires couple at least some of the first bond pads or some of the second circuit bond pads to the leads, and there is a second coupling between others of the second circuit bond pads and others of the first bond pads. A mold compound is for encapsulating the second circuit and the analog IC.

    Integrated circuit with an embedded inductor or transformer
    40.
    发明授权
    Integrated circuit with an embedded inductor or transformer 有权

    公开(公告)号：US10734331B2

    公开(公告)日：2020-08-04

    申请号：US15678841

    申请日：2017-08-16

    Applicant: Texas Instruments Incorporated

    Inventor： Barry Jon Male ,  Rajarshi Mukhopadhyay

    IPC: H01L23/64 ,  H01F27/28 ,  H01F27/24 ,  H01L49/02 ,  H01L23/495 ,  H01F17/00 ,  H01L23/66 ,  H01F41/04 ,  H01L23/522

    Abstract: In a described example, an integrated circuit includes: a semiconductor substrate having a first surface and an opposite second surface; at least one dielectric layer overlying the first surface of the semiconductor substrate; at least one inductor coil in the at least one dielectric layer with a plurality of coil windings separated by coil spaces, the at least one inductor coil lying in a plane oriented in a first direction parallel to the first surface of the semiconductor substrate, the at least one inductor coil electrically isolated from the semiconductor substrate by a portion of the at least one dielectric layer; and trenches extending into the semiconductor substrate in a second direction at an angle with respect to the first direction, the trenches underlying the inductor coil and filled with dielectric replacement material.

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